JPH0215318Y2 - - Google Patents

Info

Publication number

JPH0215318Y2

JPH0215318Y2 JP6266385U JP6266385U JPH0215318Y2 JP H0215318 Y2 JPH0215318 Y2 JP H0215318Y2 JP 6266385 U JP6266385 U JP 6266385U JP 6266385 U JP6266385 U JP 6266385U JP H0215318 Y2 JPH0215318 Y2 JP H0215318Y2

Authority

JP

Japan

Prior art keywords

sample

electrolytic

sample holder

semiconductor

guide rod

Prior art date

1985-04-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004065 semiconductor Substances 0.000 claims description 43
• 238000000866 electrolytic etching Methods 0.000 claims description 30
• 239000003792 electrolyte Substances 0.000 claims description 20
• 239000008151 electrolyte solution Substances 0.000 claims description 19
• 210000000078 claw Anatomy 0.000 claims description 9
• 238000007599 discharging Methods 0.000 claims description 2
• 238000011049 filling Methods 0.000 claims description 2
• 239000013078 crystal Substances 0.000 description 14
• 230000007547 defect Effects 0.000 description 14
• 238000000034 method Methods 0.000 description 13
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
• 229940075397 calomel Drugs 0.000 description 11
• ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 11
• 238000005259 measurement Methods 0.000 description 10
• IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
• 229910001873 dinitrogen Inorganic materials 0.000 description 9
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
• 238000003780 insertion Methods 0.000 description 8
• 230000037431 insertion Effects 0.000 description 8
• 238000005530 etching Methods 0.000 description 7
• HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
• 239000007864 aqueous solution Substances 0.000 description 6
• 239000000498 cooling water Substances 0.000 description 6
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
• 229910052697 platinum Inorganic materials 0.000 description 6
• 238000001514 detection method Methods 0.000 description 5
• 239000007789 gas Substances 0.000 description 5
• 238000005868 electrolysis reaction Methods 0.000 description 4
• 239000011521 glass Substances 0.000 description 4
• 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
• 238000003486 chemical etching Methods 0.000 description 3
• 239000007788 liquid Substances 0.000 description 3
• 239000010453 quartz Substances 0.000 description 3
• 229920001817 Agar Polymers 0.000 description 2
• 239000008272 agar Substances 0.000 description 2
• 230000005518 electrochemistry Effects 0.000 description 2
• 239000010408 film Substances 0.000 description 2
• 238000001451 molecular beam epitaxy Methods 0.000 description 2
• 238000002360 preparation method Methods 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
• 238000004140 cleaning Methods 0.000 description 1
• 238000011109 contamination Methods 0.000 description 1
• 230000007423 decrease Effects 0.000 description 1
• 230000002950 deficient Effects 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 238000004090 dissolution Methods 0.000 description 1
• 239000012153 distilled water Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 229920001971 elastomer Polymers 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000002474 experimental method Methods 0.000 description 1
• 230000002349 favourable effect Effects 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 238000002386 leaching Methods 0.000 description 1
• 238000012423 maintenance Methods 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000012528 membrane Substances 0.000 description 1
• 238000002156 mixing Methods 0.000 description 1
• 230000003287 optical effect Effects 0.000 description 1
• 239000003960 organic solvent Substances 0.000 description 1
• 239000001301 oxygen Substances 0.000 description 1
• 229910052760 oxygen Inorganic materials 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 230000035945 sensitivity Effects 0.000 description 1
• 238000004904 shortening Methods 0.000 description 1
• 239000000243 solution Substances 0.000 description 1
• 238000003756 stirring Methods 0.000 description 1
• 230000007847 structural defect Effects 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1
• 238000000927 vapour-phase epitaxy Methods 0.000 description 1
• 238000005406 washing Methods 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1