JPH0215268Y2 - - Google Patents
Info
- Publication number
- JPH0215268Y2 JPH0215268Y2 JP1984122509U JP12250984U JPH0215268Y2 JP H0215268 Y2 JPH0215268 Y2 JP H0215268Y2 JP 1984122509 U JP1984122509 U JP 1984122509U JP 12250984 U JP12250984 U JP 12250984U JP H0215268 Y2 JPH0215268 Y2 JP H0215268Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- lead wire
- circuit element
- connecting end
- terminal device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Details Of Resistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984122509U JPS6136970U (ja) | 1984-08-09 | 1984-08-09 | 端子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984122509U JPS6136970U (ja) | 1984-08-09 | 1984-08-09 | 端子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6136970U JPS6136970U (ja) | 1986-03-07 |
| JPH0215268Y2 true JPH0215268Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-04-24 |
Family
ID=30681263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984122509U Granted JPS6136970U (ja) | 1984-08-09 | 1984-08-09 | 端子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6136970U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-08-09 JP JP1984122509U patent/JPS6136970U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136970U (ja) | 1986-03-07 |