JPH02150690U - - Google Patents
Info
- Publication number
- JPH02150690U JPH02150690U JP5873389U JP5873389U JPH02150690U JP H02150690 U JPH02150690 U JP H02150690U JP 5873389 U JP5873389 U JP 5873389U JP 5873389 U JP5873389 U JP 5873389U JP H02150690 U JPH02150690 U JP H02150690U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- semiconductor device
- type semiconductor
- dip type
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000523 sample Substances 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は同要部断面図、第３図、第４図はリードの構
造斜視図、第５図は本考案の実施例２を示す斜視
図、第６図は同要部断面図、第７図はリードの構
造斜視図、第８図は従来のＤＩＰ型半導体装置用
ソケツトを示す斜視図、第９図は従来のＤＩＰ型
半導体装置用ソケツトを示す要部断面図である。
１……ソケツト本体、１ｂ……ソケツト本体の
下面、１ｃ……ソケツト本体の側面、２……板バ
ネ、３，３ａ……リード端子、４ａ，４ｂ，４ｃ
……鉤部、５……ＤＩＰ型半導体装置、６……半
導体装置の外部リード。
Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
3 and 4 are structural perspective views of the lead. FIG. 5 is a perspective view showing Embodiment 2 of the present invention. FIG. 6 is a sectional view of the essential parts. FIG. 7 8 is a perspective view of the structure of a lead, FIG. 8 is a perspective view of a conventional DIP type semiconductor device socket, and FIG. 9 is a sectional view of a main part of the conventional DIP type semiconductor device socket. 1... Socket body, 1b... Bottom surface of socket body, 1c... Side surface of socket body, 2... Leaf spring, 3, 3a... Lead terminal, 4a, 4b, 4c
...Hook portion, 5...DIP type semiconductor device, 6...External lead of semiconductor device.
Claims (1)
るリード端子を備えたＤＩＰ型半導体装置用ソケ
ツトにおいて、前記リード端子の先端をソケツト
本体の下面及び側面の２方向に張り出させて設け
、ソケツト本体の側面から張り出したリード端子
に測定装置の測定子を掛止させる鉤部を有するこ
とを特徴とするＤＩＰ型半導体装置用ソケツト。 In a socket for a DIP type semiconductor device, which is provided with a lead terminal to which an external lead of the DIP type semiconductor device press-fits, the tip of the lead terminal is provided so as to protrude in two directions, the lower surface and the side surface of the socket body, and A DIP type semiconductor device socket characterized by having a hook portion for hooking a probe of a measuring device onto a lead terminal protruding from the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5873389U JPH02150690U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5873389U JPH02150690U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02150690U true JPH02150690U (en) | 1990-12-27 |
Family
ID=31584614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5873389U Pending JPH02150690U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02150690U (en) |
-
1989
- 1989-05-22 JP JP5873389U patent/JPH02150690U/ja active Pending