JPH02150073A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH02150073A
JPH02150073A JP63304442A JP30444288A JPH02150073A JP H02150073 A JPH02150073 A JP H02150073A JP 63304442 A JP63304442 A JP 63304442A JP 30444288 A JP30444288 A JP 30444288A JP H02150073 A JPH02150073 A JP H02150073A
Authority
JP
Japan
Prior art keywords
light
window
light diffusing
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63304442A
Other languages
Japanese (ja)
Inventor
Namiki Moriga
森賀 南木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63304442A priority Critical patent/JPH02150073A/en
Publication of JPH02150073A publication Critical patent/JPH02150073A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a light diffusing function in a semiconductor device itself, to reduce in size and to simplify manufacturing steps by composing a light transmission window of a material having the light diffusing function. CONSTITUTION:As a light transmitting window 8, a light diffusing glass window having light diffusing function by itself is employer instead of a conventional transparent glass window. In this case, a light from an external object is directed to the window 8. It is diffused in the step of transmitting it through the window 8, and the diffused light is directed to a semiconductor element 1 in a package. Accordingly, entirely the same function as that in the conventional one is performed as a hue sensor. Thus, since a light diffusing plate is eliminated, it is reduced in size that much, and manufacturing steps are also simplified.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は受光機能を有する半導体素子をパッケージに
収容してなる半導体装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device in which a semiconductor element having a light receiving function is housed in a package.

〔従来の技術〕[Conventional technology]

第3図は例えばビデオカメラに装備して被写体の色相を
検出する色相センサーに使用されるこの種従来の半導体
装置を示す断面図である。図において、(1)はGaA
s等受光機能を有する半導体素子、(2)は半導体素子
(1)を内部に収容するパッケージで、下パッケージ(
2a)と上パッケージ(2b)とを組合せて構成されて
いる。(3)は半導体素子(1)の端子(4)を外部に
引出すためパッケージ(2)を貫通して設けられたリー
ドフレーム、(5)はパッケージ(2とリードフレーム
(3)との隙間を埋めるシール樹脂、(6)は外部の被
写体からの光を半導体素子(1)へ導くため上パッケー
ジ(2b)の中央に設けられた光透過窓としての透明ガ
ラス窓で、上パッケージ(2b)と一体に形成されてい
る。なお、半導体素子(1)の光入射側には、RGB3
原色のいずれかの色相成分のみを透過させるフィルター
膜が形成されており、これら3種類の半導体装置を1組
として使用するものである。
FIG. 3 is a sectional view showing a conventional semiconductor device of this kind used as a hue sensor installed in a video camera to detect the hue of an object, for example. In the figure, (1) is GaA
A semiconductor element having a light receiving function such as s, (2) is a package that houses the semiconductor element (1) inside, and the lower package (
2a) and an upper package (2b). (3) is a lead frame that penetrates the package (2) in order to draw out the terminal (4) of the semiconductor element (1) to the outside, and (5) is the gap between the package (2) and the lead frame (3). The sealing resin (6) is a transparent glass window as a light transmission window provided in the center of the upper package (2b) to guide light from an external object to the semiconductor element (1). The semiconductor element (1) is formed integrally with RGB 3 on the light incident side.
A filter film is formed that transmits only one of the hue components of the primary colors, and these three types of semiconductor devices are used as a set.

(7)は以上の各部品で構成される半導体装置の上面に
設けられた光拡散板で、被写体からの光をこの部分で拡
散し、この拡散した光が透明ガラス窓(6)を経て半導
体素子(1)に入射される。これにより、入射光線の局
部的な分布変動によって半導体装置(1)の出力が不安
定になるのを防止している。
(7) is a light diffusing plate installed on the top surface of the semiconductor device made up of the above components. This part diffuses the light from the subject, and this diffused light passes through the transparent glass window (6) to the semiconductor device. The light is incident on element (1). This prevents the output of the semiconductor device (1) from becoming unstable due to local distribution fluctuations of the incident light beam.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の半導体装置は以上のようにように構成されている
ので、特性安定化のなめ半導体装置の光入射側に別途、
光拡散板(7)を設ける必要があり、その分部品として
の寸法が大きくなるとともに製造工程上も煩雑になると
いう問題点があった。
Conventional semiconductor devices are configured as described above, so in order to stabilize the characteristics, a separate
It is necessary to provide the light diffusing plate (7), which increases the size of the component and complicates the manufacturing process.

この発明は以上のような問題点を解消するためになされ
たもので、半導体装置自体に光拡散の機能をもたせ、小
形化と製造工程の簡便化とを図ることを目的とする。
This invention was made to solve the above-mentioned problems, and aims to provide a semiconductor device itself with a light diffusion function, thereby achieving miniaturization and simplifying the manufacturing process.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る半導体装置は、光透過窓を光拡散機能を
有する材料で構成したものである。
In the semiconductor device according to the present invention, the light transmission window is made of a material having a light diffusion function.

〔作  用〕[For production]

外部からの光はパッケージに一体に形成された光透過窓
に直接入射し、ここで拡散されてパッケージ内の半導体
素子に至る。
Light from the outside enters directly into a light transmission window formed integrally with the package, is diffused here, and reaches the semiconductor element inside the package.

〔実 施 例〕〔Example〕

以下、この発明の一実施例を図について説明する0図に
おいて、従来と異なるのは光透過窓(8)のみである。
In the following, an embodiment of the present invention will be explained with reference to the drawings. In Fig. 0, only the light transmitting window (8) is different from the conventional one.

即ち、光透過窓(8)として、従来の透明ガラス窓に替
わり、それ自体で光拡散機能を備えている光拡散ガラス
窓を採用している。
That is, as the light transmitting window (8), a light diffusing glass window which itself has a light diffusing function is used instead of a conventional transparent glass window.

この場合、外部の被写体からの光は、この光拡散ガラス
窓(8)に入射される。そしてこの光拡散ガラス窓(5
)を透過する過程で拡散され、半導体素子(1)にはこ
の拡散した光が入射されることになる。
In this case, light from an external object is incident on this light-diffusing glass window (8). And this light diffusing glass window (5
), and this diffused light is incident on the semiconductor element (1).

従って、色相センサーとして従来と全く同様の機能が達
成される。
Therefore, the same function as the conventional hue sensor can be achieved.

これにより、従来の光拡散板■は不要となるので、その
寸法骨だけ小形となることは勿論、製造工程も簡単とな
る。
This eliminates the need for the conventional light diffusing plate (2), which not only reduces its dimensions but also simplifies the manufacturing process.

第2図はこの発明の他の実施例を示すもので、ここでは
、光透過窓(8)は、光拡散ガラス部(8a)と透明ガ
ラス部〈8b)とからなる合成ガラス窓から構成されて
いる。パッケージ!21の一部を構成することから要求
される機械的強度の条件を満たすために必要な厚さと、
所定の光減衰量の範囲内で必要な光拡散を行うために必
要な厚さとに差がある場合に、この合成ガラス窓(aが
有用となる。
FIG. 2 shows another embodiment of the present invention, in which the light transmitting window (8) is composed of a synthetic glass window consisting of a light diffusing glass part (8a) and a transparent glass part (8b). ing. package! The thickness necessary to satisfy the mechanical strength conditions required because it forms a part of 21,
This synthetic glass window (a) is useful when there is a difference in the thickness required to achieve the necessary light diffusion within a predetermined amount of light attenuation.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明では、光透過窓を光拡散機能を
有する材料で構成したので、半導体装置自体に光拡散機
能をもたせることができ、小形化と製造工程の簡便化が
可能となる。
As described above, in the present invention, since the light transmitting window is made of a material having a light diffusion function, the semiconductor device itself can be provided with a light diffusion function, making it possible to downsize and simplify the manufacturing process.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例における半導体装置を示す
断面図、第2図はこの発明の他の実施例におけるものを
示す断面図、第3図は従来の半導体装置を示す断面図で
ある。 図において、(1)は半導体素子、(21はパッケージ
、8は光透過窓としての光拡散ガラス窓である。 なお、各図中同一符号は同一または相当部分を示す。 第1図 第2図 第3図 代理人 弁理士  大 岩 増 雄
FIG. 1 is a sectional view showing a semiconductor device according to one embodiment of the invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing a conventional semiconductor device. . In the figures, (1) is a semiconductor element, (21 is a package, and 8 is a light-diffusing glass window as a light-transmitting window. In each figure, the same reference numerals indicate the same or corresponding parts. Figure 1 Figure 2 Figure 3 Agent: Masuo Oiwa, patent attorney

Claims (1)

【特許請求の範囲】 受光機能を有する半導体素子と、この半導体素子を内部
に収容するとともに、外部からの光を透過させて上記半
導体素子に導く光透過窓をその一部に一体に形成したパ
ッケージとを備えたものにおいて、 上記光透過窓を光拡散機能を有する材料で構成したこと
を特徴とする半導体装置。
[Scope of Claims] A package that includes a semiconductor element having a light receiving function, and a light transmitting window that houses this semiconductor element inside and integrally forms a part of the semiconductor element that transmits light from the outside and guides it to the semiconductor element. A semiconductor device comprising: the light transmitting window made of a material having a light diffusing function.
JP63304442A 1988-11-30 1988-11-30 Semiconductor device Pending JPH02150073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63304442A JPH02150073A (en) 1988-11-30 1988-11-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63304442A JPH02150073A (en) 1988-11-30 1988-11-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH02150073A true JPH02150073A (en) 1990-06-08

Family

ID=17933058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63304442A Pending JPH02150073A (en) 1988-11-30 1988-11-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH02150073A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877546A (en) * 1996-01-02 1999-03-02 Lg Semicon Co., Ltd. Semiconductor package with transparent window and fabrication method thereof
JP2010097182A (en) * 2008-09-22 2010-04-30 Mitsubishi Electric Corp Light source unit and image displaying apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162882A (en) * 1980-05-19 1981-12-15 Nec Corp Glass fiber bundle photodetector
JPS56162881A (en) * 1980-05-19 1981-12-15 Nec Corp Glass fiber bundle photodetector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162882A (en) * 1980-05-19 1981-12-15 Nec Corp Glass fiber bundle photodetector
JPS56162881A (en) * 1980-05-19 1981-12-15 Nec Corp Glass fiber bundle photodetector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877546A (en) * 1996-01-02 1999-03-02 Lg Semicon Co., Ltd. Semiconductor package with transparent window and fabrication method thereof
JP2010097182A (en) * 2008-09-22 2010-04-30 Mitsubishi Electric Corp Light source unit and image displaying apparatus
JP4741017B2 (en) * 2008-09-22 2011-08-03 三菱電機株式会社 Light source unit and image display device

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