JPH0214897A - Production of filmy diamond - Google Patents
Production of filmy diamondInfo
- Publication number
- JPH0214897A JPH0214897A JP16421188A JP16421188A JPH0214897A JP H0214897 A JPH0214897 A JP H0214897A JP 16421188 A JP16421188 A JP 16421188A JP 16421188 A JP16421188 A JP 16421188A JP H0214897 A JPH0214897 A JP H0214897A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- substrate
- film
- layer
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 92
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 12
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 8
- 239000010419 fine particle Substances 0.000 claims description 15
- 239000012808 vapor phase Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 230000006911 nucleation Effects 0.000 abstract description 6
- 238000010899 nucleation Methods 0.000 abstract description 6
- 239000008187 granular material Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 38
- 239000007789 gas Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 238000005229 chemical vapour deposition Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 239000002994 raw material Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 238000001308 synthesis method Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- -1 gesten Chemical compound 0.000 description 2
- 239000012770 industrial material Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000035874 Excoriation Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は膜状ダイヤモンドの製造方法の改良に関するも
のである。さらに詳しくいえば本発明は、気相合成法に
より、基体表面に均一で良質な膜状ダイヤモンドを速い
成長速度で形成させる膜状ダイヤモンドの製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improvement in a method for producing film-like diamond. More specifically, the present invention relates to a method for producing diamond film, in which a uniform diamond film of good quality is formed on the surface of a substrate at a high growth rate using a vapor phase synthesis method.
[従来の技術]
近年、ダイヤモンドの合成技術は著しい発展を遂げ、例
えば切削工具や耐摩耗工具をはじめとし、各種保護膜と
して、あるいは光学用材料、電子材料、化学工業材料な
どに、嗅状合成ダイヤモンドが広く用いられている。[Conventional technology] In recent years, diamond synthesis technology has made remarkable progress. For example, diamond synthesis technology has been used for cutting tools, wear-resistant tools, various protective films, optical materials, electronic materials, chemical industrial materials, etc. Diamonds are widely used.
このような膜状ダイヤモンドを基体表面に形成させる方
法としては、種々の気相合成法、例えば、炭素源を含む
原料ガスを用い、これをプラズマ分解するか、又は非平
衡反応を利用して、膜状ダイヤモンドを基体表面に析出
させる化学蒸着法(CVD法)、熱陰極PIGガン、冷
陰極PIGガン、スパッターガンなとを用いて膜状ダイ
ヤモンドを基体表面に形成させるイオン化蒸着法などが
知られている。特に、CVD法により、膜状ダイヤモン
ドを基体表面に析出させる方法は、連続操業が容易であ
って工業的に有利であることから、最近注目を浴びてい
る。As a method for forming such a diamond film on the surface of a substrate, there are various gas phase synthesis methods, for example, using a raw material gas containing a carbon source and subjecting it to plasma decomposition, or using a non-equilibrium reaction. Known methods include the chemical vapor deposition method (CVD method) in which diamond film is deposited on the surface of a substrate, and the ionization vapor deposition method in which diamond film is formed on the surface of the substrate using a hot cathode PIG gun, cold cathode PIG gun, sputter gun, etc. ing. In particular, the method of depositing diamond film on the surface of a substrate by the CVD method has recently attracted attention because it is easy to operate continuously and is industrially advantageous.
このような気相合成法により、基体表面に膜状ダイヤモ
ンドを形成させる方法においては、該ダイヤモンドが熱
力学的に準安定な領域下において合成させるため、ダイ
ヤモ〕・ド単一相が析出する領域は極めて狭い上に、そ
の析出は、基体温度、ガス流量、反応管内の全圧、炭素
源の種類などの合成条件によって制限され、したがって
、ダイヤモンド核発生の駆動力となる過飽和度を自由に
制御しにくいために、粒状ダイヤモンド結晶の析出は容
易であるが、膜状ダイヤモンドの析出は困難であるとい
う問題を有している。In the method of forming a diamond film on the surface of a substrate by such a vapor phase synthesis method, the diamond is synthesized in a thermodynamically metastable region. is extremely narrow, and its precipitation is limited by synthesis conditions such as substrate temperature, gas flow rate, total pressure in the reaction tube, and type of carbon source, and therefore the degree of supersaturation that is the driving force for diamond nucleation can be freely controlled. Therefore, it is easy to precipitate granular diamond crystals, but it is difficult to precipitate film-like diamonds.
そこで、このような問題を解決するために、従来基体と
してダイヤモンド以外のもの、例えばケイ素、モリブデ
ン、タンタル、タングステン、あるいは炭化タングステ
ン、炭化ケイ素、炭化タンタルなどの炭化物などから成
るものを使用する場合、その表面にあらかじめ、例えば
高硬度粉末による摩耗処理や衝突池理を施して鋭利な傷
を形成させ、ダイヤモンドの核形成エネルギー・の増加
や高い飽和度を生じさせることが試みられている。Therefore, in order to solve such problems, conventionally when using materials other than diamond as a substrate, such as silicon, molybdenum, tantalum, tungsten, or carbides such as tungsten carbide, silicon carbide, and tantalum carbide, Attempts have been made to form sharp scratches on the surface of the diamond by applying abrasion treatment using high-hardness powder or impact treatment in advance, thereby increasing the diamond nucleation energy and increasing the degree of saturation.
しかしなから、このような方法においては、該基体表面
に均一な傷を形成させることが困難であって、均一で良
質な膜状ダイヤモンドは得られに<G′上に、成膜速度
も遅いという問題がある。However, in such a method, it is difficult to form uniform scratches on the surface of the substrate, and it is difficult to obtain a uniform and high-quality film of diamond. There is a problem.
[発明が解決しようとする課題]
本発明はこのような従来の膜状ダイ′でモンドの製造方
法が有する欠点を克服し、気相合成法により、基体表面
に均一で良質な膜状ダイヤモンドを速い成長速度で形成
させる方法を提供することを目的としてなされlこもの
である。[Problems to be Solved by the Invention] The present invention overcomes the drawbacks of the conventional diamond manufacturing method using a film-like diamond, and uses a vapor phase synthesis method to produce a uniform and high-quality film-like diamond on the surface of a substrate. This was developed for the purpose of providing a method for forming the film at a high growth rate.
[課題を解決するための手段]
本発明者らは、気相合成法により、基体表面に膜状ダイ
ヤモンドを形成させる方法について鋭意研究を重ねた結
果、ダイヤモンド表面におけるダイヤモンドの核形成エ
ネルギーが、通常ダイヤモンド形成に用いられている基
体(ダイヤモンド以外のもの)表面におけるそれよりも
低いことに着目し、あらかじめ、該基体表面に所定の粒
径のダイヤモンド微粒子層を設けておくことにより、ダ
イヤモンドの核形成エネルギー・の増加や高い過飽和度
をもたらし、前記目的を達成しうろことを見い出し、こ
の知見に基づいて本発明を完成するに至った。[Means for Solving the Problems] As a result of extensive research into a method for forming a diamond film on the surface of a substrate using a vapor phase synthesis method, the present inventors found that the nucleation energy of diamond on the diamond surface is normally Focusing on the fact that it is lower than that on the surface of a substrate (other than diamond) used for diamond formation, by providing a layer of diamond fine particles with a predetermined particle size on the surface of the substrate in advance, diamond nucleation is possible. The inventors have discovered that the above objects can be achieved by increasing the energy and increasing the degree of supersaturation, and have completed the present invention based on this knowledge.
すなわち、本発明は、気相合成法により基体表面に膜状
ダイヤモンドを形成させるに当たり、あらかじめ該基体
表面に平均粒径10μm以下のダイヤモンド微粒子層を
設けておくことを特徴とする膜状ダイヤモンドの製造方
法を提供するものである。That is, the present invention provides a method for producing a diamond film, which is characterized in that, before forming a diamond film on the surface of a substrate by a vapor phase synthesis method, a layer of fine diamond particles having an average particle size of 10 μm or less is provided on the surface of the substrate in advance. The present invention provides a method.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明方法において用いられる基体の材質については特
に制限はなく、従来膜状ダイヤモンドの形成に慣用され
ているもの、例えばケイ素、モリブデン、タンタル、り
:/ゲステン、チタン、コバルト、クロム、ニッケル、
銅、鉄、アルミニウムなどの金属や、これらの金属の合
金、各種金属の炭化物、窒化物、酸化物、あるいはTi
C−Ni系、TiC−Co系、AQ、03−Fe系など
のサーメット、各種ガラス、セラミックスなどの中から
任意のものを選択して用いることができる。また基体の
形状についても特に制限はなく、例えば板状、線状、パ
イプ状など使用目的に応じて任意の形状ものもを用いる
ことができる。There are no particular restrictions on the material of the substrate used in the method of the present invention, and materials conventionally used for forming diamond films, such as silicon, molybdenum, tantalum, gesten, titanium, cobalt, chromium, nickel,
Metals such as copper, iron, aluminum, alloys of these metals, carbides, nitrides, oxides of various metals, or Ti
Any material can be selected from among cermets such as C--Ni, TiC--Co, AQ, and 03-Fe, various glasses, and ceramics. There is also no particular restriction on the shape of the base, and any shape can be used depending on the purpose of use, such as a plate, a line, or a pipe.
本発明方法においては、膜状ダイヤモンドを形成させる
前に、あらかじめ前記基体の表面にダイヤモンド微粒子
層を設けておくことが必要である。In the method of the present invention, it is necessary to previously provide a layer of fine diamond particles on the surface of the substrate before forming a diamond film.
このダイヤモンド微粒子層を設けることによって、ダイ
ヤモンドの核形成エネルギーの増加や高い過飽和度をも
たらし、均一で良質な膜状ダイヤモンドを速い成長速度
で形成させることができる。By providing this diamond fine particle layer, the diamond nucleation energy is increased and the supersaturation degree is increased, and a uniform and high quality diamond film can be formed at a high growth rate.
この際、用いるダイヤモンド微粒子の平均粒径は10μ
m以下、好ましくは0.1〜10μm1さらに好ましく
は1〜6μmの範囲にあることが必要である。この平均
粒径が10μm超えると該ダイヤモンド微粒子−ヒにの
みダイヤモンドが析出し、膜状ダイヤモンドが得られに
くくなる。At this time, the average particle size of the diamond fine particles used was 10 μm.
m or less, preferably in the range of 0.1 to 10 μm, and more preferably in the range of 1 to 6 μm. If the average particle diameter exceeds 10 μm, diamond will precipitate only on the diamond fine particles, making it difficult to obtain a diamond film.
該基体表面にダイヤモンド微粒子層を設ける方法として
は、例えば合成ダイヤモンド粉末を沈降法により基体表
面に敷きつめる方法や、加圧法により基体表面に合成ダ
イヤモンド粉末の層を形成させる方法などを用いること
ができる。この際、形成させるダイヤモンド微粒子層の
厚さは、通常5〜100μmの範囲で選ばれる。As a method for providing the diamond fine particle layer on the surface of the substrate, for example, a method of spreading synthetic diamond powder on the surface of the substrate by a sedimentation method, a method of forming a layer of synthetic diamond powder on the surface of the substrate by a pressurization method, etc. can be used. . At this time, the thickness of the diamond fine particle layer to be formed is usually selected within the range of 5 to 100 μm.
第1図は沈降法により基体2の表面にダイヤモンド微粒
子層1が設けられた状態を示し、第2図は加圧法により
基体2の表面にダイヤモンド微粒千層3が設けられた状
態を示す。FIG. 1 shows a state in which a diamond fine particle layer 1 is provided on the surface of a substrate 2 by the sedimentation method, and FIG. 2 shows a state in which a diamond fine particle layer 3 is provided on the surface of the substrate 2 by a pressure method.
さらに、前記以外の方法として、例えば基体材料中にダ
イヤモンド微粒子を含有させておいて、基体表面に該微
粒子が均一に分散するように基体を作成する方法も用い
ることができる。Furthermore, as a method other than the above, for example, a method can be used in which diamond fine particles are contained in the base material and the base body is prepared so that the fine particles are uniformly dispersed on the surface of the base body.
本発明方法においては、このようにしてあらかじめ表面
にダイヤモンド微粒子層を設けた基体を用い、気相合成
法により該基体表面に膜状ダイヤモンドを形成させる。In the method of the present invention, a substrate whose surface has been provided with a layer of diamond fine particles in advance is used, and a diamond film is formed on the surface of the substrate by vapor phase synthesis.
該気相合成法については特に制限はなく、従来膜状ダイ
ヤモンドの形成に慣用されている方法、例えば種々の化
学蒸着法(CVD法)やイオン化蒸着法などの物理蒸着
法の中から任意の方法を選A7で用いることができるが
、CVD法が好適である。There are no particular restrictions on the vapor phase synthesis method, and any method may be used from among the methods conventionally used for forming diamond film, for example, physical vapor deposition methods such as various chemical vapor deposition methods (CVD methods) and ionization vapor deposition methods. can be used in selection A7, but the CVD method is preferred.
このCVD法には、原料ガスを活性化状態に導く手段に
よって、例えば(1)原料ガスを赤熱したフィラメント
の近傍を通過させ−ることによって活性化状態に導く熱
分解CVD法、(2)原料ガスの導入部に高周波を印加
し、高周波によってプラズマを形成させることによって
、該原料ガスを活性化状態に導く高周波プラズマCVD
法、(3)前記高周波の代わりにマイクロ波を用いるマ
イクロ波プラズマCVD法、(4)イオンビームによっ
て原料ガスを活性化状態に導くイオンビームCVD法な
どがあり、本発明においてはいずれの方法も用いること
ができる。This CVD method includes means for bringing the raw material gas into an activated state, such as (1) a pyrolysis CVD method in which the raw material gas is brought into an activated state by passing near a red-hot filament, (2) a raw material gas High-frequency plasma CVD that applies high-frequency waves to the gas introduction section and forms plasma using the high-frequency waves, thereby leading the raw material gas to an activated state.
(3) a microwave plasma CVD method that uses microwaves instead of the high frequency, and (4) an ion beam CVD method that brings the raw material gas into an activated state with an ion beam. Can be used.
前記CVD法において用いられる原料ガスとしては、炭
素源ガスと水素との混合ガスが用いられる。炭素源ガス
については特に制限はなく、通常CVD法によりダイヤ
モンドの形成に用いらt’tでいるもの、例えば−酸化
炭素や二酸化炭素、あるいはアルカン類、アルケン類、
アルキン類、芳香族炭化水素類、シクロパラフィン類、
シクロオレフィン類、含酸素炭素化合物、含窒素炭素化
合物などの中から選ばれた1種又は2種以上の混合物が
用いられる。またこれらの原料ガスには、所望に応じ窒
素、アルゴン、ネオン、キセノンなどの不活性ガスを含
有させてもよい。As the raw material gas used in the CVD method, a mixed gas of carbon source gas and hydrogen is used. There are no particular restrictions on the carbon source gas, and gases that are not normally used to form diamonds by the CVD method, such as carbon oxide, carbon dioxide, alkanes, alkenes, etc.
Alkynes, aromatic hydrocarbons, cycloparaffins,
One type or a mixture of two or more types selected from cycloolefins, oxygen-containing carbon compounds, nitrogen-containing carbon compounds, etc. is used. Further, these raw material gases may contain an inert gas such as nitrogen, argon, neon, or xenon, if desired.
このようにして、前記の基体表面に設(つられたダイヤ
モンド微粒子層の上に膜状ダイヤモンドが形成される。In this way, a diamond film is formed on the diamond fine particle layer provided on the surface of the substrate.
この膜状ダイヤモンドの厚さは、使用目的によって異な
るが、通常10〜1000μmの範囲で選ばれる。The thickness of this diamond film varies depending on the purpose of use, but is usually selected in the range of 10 to 1000 μm.
次に、本発明方法による膜状ダイヤモンドの成長過程の
1例を電子顕微鏡写真図で示すと、第3図(A)は反応
前の基体表面に設けられたダイヤモンド微粒子層の状態
、第3図(B) 、(C)及び(D)は、それぞれCV
D法による反応開始15分後、30分後及び60分後の
基体表面の状態を示す。Next, an example of the growth process of film-like diamond according to the method of the present invention is shown using electron micrographs. (B), (C) and (D) are CV
The state of the substrate surface 15 minutes, 30 minutes and 60 minutes after the start of the reaction by method D is shown.
このようにして形成された膜状ダイヤモンドは各種ダイ
ヤモンド工具をはじめ、光学用材料、電気材料、化学工
業材料などに好適に用いられる。The film-like diamond thus formed is suitably used for various diamond tools, optical materials, electrical materials, chemical industrial materials, and the like.
該膜状ダイヤモンドを用いた工具作成の例を示すと、基
体を付けたまま、膜状ダイヤモンドを工具基体上にロウ
付けしたのち、該基体を適当な手段によって取り除くこ
とにより、所望のダイヤモンド工具を作成することがで
きるし、あるいは基体として適当な線材を用いて、膜状
ダイヤモンドの被覆層を形成させることにより、このも
のを直接ワイヤー切断機などのワイヤーとして用いるこ
ともできる。To give an example of making a tool using the diamond film, the diamond film is brazed onto the tool base with the base attached, and then the base is removed by appropriate means to create the desired diamond tool. Alternatively, by using a suitable wire material as a base and forming a coating layer of diamond film, this material can be used directly as a wire for a wire cutting machine or the like.
ざらに又、基体表面上にダイヤモンド微粒子層を数十μ
m以上の厚さに厚く設けた後に、気相合成法によりダイ
ヤモンドを析出させると、気相合成法により析出したダ
イヤモンドがあたかも最初に敷き詰めたダイヤモンド粒
子相互に対してバインダーのような働きを示し、それら
のダイヤモンド粒子同志が集合合体したダイヤモンド多
結晶体を作成することもできる。Roughly, a layer of diamond fine particles of several tens of microns is placed on the surface of the substrate.
When diamond is precipitated by vapor phase synthesis after being deposited thickly to a thickness of more than m, the diamond precipitated by vapor phase synthesis acts as if it were a binder for each of the diamond particles that were initially laid out. It is also possible to create a polycrystalline diamond in which these diamond particles are aggregated together.
[実施例]
次に実施例により本発明をさらに詳細に説明するが、本
発明はこれらの例によってなんら限定されるものではな
い。[Examples] Next, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples in any way.
実施例1
第1図に示すように、シリコン基体上に、平均粒径2〜
4μmの合成ダイヤモンド粉末を沈降法により敷き詰め
た。この基体を用いて、電子線照射CVD法により、雰
囲気温度800℃、フィラメント温度1800℃、圧力
40To r r。Example 1 As shown in FIG.
Synthetic diamond powder of 4 μm was spread by a sedimentation method. Using this substrate, electron beam irradiation CVD was performed at an ambient temperature of 800°C, a filament temperature of 1800°C, and a pressure of 40 Torr.
CH、/ H2容ユ比1g1oo、加速電圧]、50V
。CH, / H2 volume ratio 1g1oo, acceleration voltage], 50V
.
電流密度10 mA / cm2、反応時間1hrの条
件にて膜状ダイヤモンドを析出させた。第3図は、膜状
ダイヤモンドの成長過程を示す電子間@鏡写真図であり
、(A) 、(B) 、(C)及び(D)は、それぞれ
反応前、反応開始15分経過後、30分経過後及び60
分経過後の状態を示す。Film-like diamond was deposited under conditions of a current density of 10 mA/cm2 and a reaction time of 1 hr. FIG. 3 is an electron-electron mirror photograph showing the growth process of diamond film, and (A), (B), (C), and (D) are before the reaction, 15 minutes after the start of the reaction, and After 30 minutes and 60 minutes
Shows the status after minutes have elapsed.
この方法による成膜速度は10μm/hrであったが、
同様な実験条件下で、平均粒径2〜4μmのタイヤモン
ド扮末を用いて表面傷を形成させたンリコン基体の表面
に、膜状ダイヤモンドを析出させたところ、成膜速度は
2.5μm/hrであった。このことから本発明による
方法はきわめて成膜速度が速いということが裏付けられ
る。The film formation rate by this method was 10 μm/hr,
Under similar experimental conditions, film-like diamond was deposited on the surface of a NRICON substrate with surface scratches formed using Tiremond powder with an average particle size of 2 to 4 μm, and the film formation rate was 2.5 μm/min. It was hr. This proves that the method according to the present invention has an extremely fast film formation rate.
実施例2
第2図に示すように、モリブデン基体上に平均粒径1〜
2μnlの合成ダイヤモンド粉末層を500 IHt/
cm2の圧力で設けたのち、直流プラズ?CVD法に
より、圧力200Torr1基体温度750°C,CH
7/H2容量比1:100.反応時間4hrの条件下で
ダイヤモンドを析出させたところ、厚さ100μmの膜
状ダイヤモンドを得ることができた。Example 2 As shown in FIG.
A layer of 2 μnl of synthetic diamond powder was deposited at 500 IHt/
After setting it at a pressure of cm2, DC plasma? By CVD method, pressure 200 Torr, substrate temperature 750°C, CH
7/H2 capacity ratio 1:100. When diamond was precipitated under conditions of a reaction time of 4 hours, a diamond film with a thickness of 100 μm could be obtained.
この膜状ダイヤモンドを超硬合金製スローアウェイチッ
プ基体上にロウ付けしたのち、機械的衝撃によって容易
にモリブデン析出基体を取り除き、研磨刃付は加工をす
ることによって気相合成多結晶ダイヤモンド工具を作成
した。After this film-like diamond is brazed onto a cemented carbide indexable tip base, the molybdenum precipitated base is easily removed by mechanical impact, and the blade is polished to create a vapor-phase synthetic polycrystalline diamond tool. did.
[発明の効果]
本発明方法によると、従来行われている高硬度粉末など
による基体の前処理を施さなくても、均一で良質の膜状
ダイヤモンドをより速い速度で形成させることができる
。[Effects of the Invention] According to the method of the present invention, uniform and high-quality film-like diamond can be formed at a faster rate without the need for pretreatment of a substrate with a high-hardness powder, which is conventionally performed.
第1図及び第2図は、それぞれ基体表面に沈降法及び加
圧法によりダイヤモンド微粒子層を設けた状態を示す模
式図、第3図(A)〜(D)はCVD法による膜状ダイ
ヤモンドの成長過程の1例を示す成長表面の粒子構造の
電子顕微鏡写真図である。
第
図
(A)
(B)Figures 1 and 2 are schematic diagrams showing the state in which a diamond fine particle layer is provided on the substrate surface by the sedimentation method and the pressure method, respectively, and Figures 3 (A) to (D) are the growth of film-like diamond by the CVD method. It is an electron micrograph diagram of the grain structure of the growth surface showing one example of the process. Figures (A) (B)
Claims (1)
成させるに当たり、あらかじめ該基体表面に平均粒径1
0μm以下のダイヤモンド微粒子層を設けておくことを
特徴とする膜状ダイヤモンドの製造方法。1. When forming a diamond film on the surface of a substrate by vapor phase synthesis, an average particle size of 1.
A method for producing a film-like diamond, characterized in that a layer of diamond fine particles of 0 μm or less is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63164211A JP2686970B2 (en) | 1988-07-01 | 1988-07-01 | Membrane diamond manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63164211A JP2686970B2 (en) | 1988-07-01 | 1988-07-01 | Membrane diamond manufacturing method |
Publications (2)
Publication Number | Publication Date |
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JPH0214897A true JPH0214897A (en) | 1990-01-18 |
JP2686970B2 JP2686970B2 (en) | 1997-12-08 |
Family
ID=15788778
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JP63164211A Expired - Fee Related JP2686970B2 (en) | 1988-07-01 | 1988-07-01 | Membrane diamond manufacturing method |
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Country | Link |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994016125A1 (en) * | 1993-01-14 | 1994-07-21 | Sumitomo Electric Industries, Ltd. | Process for vapor-phase diamond synthesis |
JPH11180797A (en) * | 1997-12-24 | 1999-07-06 | Sharp Corp | Production of base body for forming diamond |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6418991A (en) * | 1987-07-10 | 1989-01-23 | Matsushita Electric Ind Co Ltd | Formation of diamond thin film |
-
1988
- 1988-07-01 JP JP63164211A patent/JP2686970B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6418991A (en) * | 1987-07-10 | 1989-01-23 | Matsushita Electric Ind Co Ltd | Formation of diamond thin film |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994016125A1 (en) * | 1993-01-14 | 1994-07-21 | Sumitomo Electric Industries, Ltd. | Process for vapor-phase diamond synthesis |
US5499601A (en) * | 1993-01-14 | 1996-03-19 | Sumitomo Electric Industries, Ltd. | Method for vapor phase synthesis of diamond |
JPH11180797A (en) * | 1997-12-24 | 1999-07-06 | Sharp Corp | Production of base body for forming diamond |
Also Published As
Publication number | Publication date |
---|---|
JP2686970B2 (en) | 1997-12-08 |
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