JPH02146874U - - Google Patents
Info
- Publication number
- JPH02146874U JPH02146874U JP5418789U JP5418789U JPH02146874U JP H02146874 U JPH02146874 U JP H02146874U JP 5418789 U JP5418789 U JP 5418789U JP 5418789 U JP5418789 U JP 5418789U JP H02146874 U JPH02146874 U JP H02146874U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldered
- jig
- parts
- backboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims 6
- 238000007598 dipping method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は本考案の構造を示す要部断面図、第2
図は本考案のマスクカバーの一部断面斜視図、第
3図は従来の接続構造を示す斜視図、第4図は第
3図の要部の断面図を示す。
図において、8……バツクボードパネル、13
……スルーホール、15……マスクカバー、16
……切欠き窓をそれぞれ示す。
Figure 1 is a sectional view of the main parts showing the structure of the present invention, Figure 2
The figure shows a partially sectional perspective view of the mask cover of the present invention, FIG. 3 is a perspective view showing a conventional connection structure, and FIG. 4 is a sectional view of the main part of FIG. 3. In the figure, 8...Backboard panel, 13
...Through hole, 15...Mask cover, 16
... Each cutout window is shown.
Claims (1)
ネル8に、該スルーホールを挿通して半田付け接
続されるべき部品と、半田付けをしてはならない
部品とが混在突出する場合に一回の半田浸漬工程
で半田付けが可能な一括半田付け治具であつて、 前記バツクボードパネルの前記半田付けをして
はならない部品の突出領域のみを立体的に遮蔽す
ると共に、前記半田付け接続されるべき部品の突
出領域には切欠き窓16を設け、かつ半田付けさ
れない部材を用いて形成したマスクカバー15と
、 該マスクカバーを前記バツクボードパネルに着
脱自在に密着させる機構とを備えたことを特徴と
するバツクボードパネルの一括半田付け治具。[Claims for Utility Model Registration] A backboard panel 8 in which a through hole 13 is formed includes a mixture of parts that should be inserted through the through hole and connected by soldering and parts that should not be soldered. The jig is a batch soldering jig that can perform soldering in a single solder dipping process when soldering, and three-dimensionally shields only the protruding areas of the parts of the backboard panel that should not be soldered, and A mask cover 15 provided with a cutout window 16 in a protruding area of a component to be connected by soldering and formed using a member that is not soldered; and a mechanism for removably attaching the mask cover to the backboard panel. A jig for batch soldering of backboard panels.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989054187U JPH0747903Y2 (en) | 1989-05-10 | 1989-05-10 | Batch soldering jig for backboard panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989054187U JPH0747903Y2 (en) | 1989-05-10 | 1989-05-10 | Batch soldering jig for backboard panel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02146874U true JPH02146874U (en) | 1990-12-13 |
JPH0747903Y2 JPH0747903Y2 (en) | 1995-11-01 |
Family
ID=31576028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989054187U Expired - Lifetime JPH0747903Y2 (en) | 1989-05-10 | 1989-05-10 | Batch soldering jig for backboard panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0747903Y2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140152U (en) * | 1976-04-19 | 1977-10-24 | ||
JPS5385558U (en) * | 1976-12-17 | 1978-07-14 | ||
JPS6163877U (en) * | 1985-09-26 | 1986-04-30 |
-
1989
- 1989-05-10 JP JP1989054187U patent/JPH0747903Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140152U (en) * | 1976-04-19 | 1977-10-24 | ||
JPS5385558U (en) * | 1976-12-17 | 1978-07-14 | ||
JPS6163877U (en) * | 1985-09-26 | 1986-04-30 |
Also Published As
Publication number | Publication date |
---|---|
JPH0747903Y2 (en) | 1995-11-01 |
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