JPH02146342U - - Google Patents
Info
- Publication number
- JPH02146342U JPH02146342U JP5581889U JP5581889U JPH02146342U JP H02146342 U JPH02146342 U JP H02146342U JP 5581889 U JP5581889 U JP 5581889U JP 5581889 U JP5581889 U JP 5581889U JP H02146342 U JPH02146342 U JP H02146342U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- support base
- metal insert
- single piece
- plastic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本案の一実施例の半導体式圧力センサ
の縦断面図である。
１……金属インサートカラー、２……支持台受
、３……突起、４……感圧素子、５……支持台、
６……接着剤、７……リードフレーム、８……ケ
ーシングクミ、９……金線、１０……コーテイン
グ材、１１……ポート。
FIG. 1 is a longitudinal sectional view of a semiconductor pressure sensor according to an embodiment of the present invention. 1... Metal insert collar, 2... Support stand holder, 3... Protrusion, 4... Pressure sensitive element, 5... Support stand,
6... Adhesive, 7... Lead frame, 8... Casing wire, 9... Gold wire, 10... Coating material, 11... Port.
Claims (1)
モールド成型した支持台受へ感圧素子を接合した
支持台を接着固定する構造で、金属インサートカ
ラーの側面に少なくとも３ケ以上の穴を設けて、
プラスチツク材で１体モールド成型する際、前記
穴部にプラスチツクで突起を成型したことを特徴
とする半導体式圧力センサ。 It has a structure in which a support base with a pressure-sensitive element bonded to it is adhesively fixed to a support base holder made of a metal insert collar molded as a single piece of plastic material, and at least three or more holes are provided on the side of the metal insert collar.
1. A semiconductor pressure sensor, characterized in that, when molded as a single piece of plastic material, a protrusion is molded from plastic in the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5581889U JPH02146342U (en) | 1989-05-17 | 1989-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5581889U JPH02146342U (en) | 1989-05-17 | 1989-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146342U true JPH02146342U (en) | 1990-12-12 |
Family
ID=31579108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5581889U Pending JPH02146342U (en) | 1989-05-17 | 1989-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146342U (en) |
-
1989
- 1989-05-17 JP JP5581889U patent/JPH02146342U/ja active Pending