JPH02140850U - - Google Patents

Info

Publication number
JPH02140850U
JPH02140850U JP4881889U JP4881889U JPH02140850U JP H02140850 U JPH02140850 U JP H02140850U JP 4881889 U JP4881889 U JP 4881889U JP 4881889 U JP4881889 U JP 4881889U JP H02140850 U JPH02140850 U JP H02140850U
Authority
JP
Japan
Prior art keywords
semiconductor device
electrodes
protruding electrodes
bonded
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4881889U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4881889U priority Critical patent/JPH02140850U/ja
Publication of JPH02140850U publication Critical patent/JPH02140850U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP4881889U 1989-04-27 1989-04-27 Pending JPH02140850U (US07943777-20110517-C00090.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4881889U JPH02140850U (US07943777-20110517-C00090.png) 1989-04-27 1989-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4881889U JPH02140850U (US07943777-20110517-C00090.png) 1989-04-27 1989-04-27

Publications (1)

Publication Number Publication Date
JPH02140850U true JPH02140850U (US07943777-20110517-C00090.png) 1990-11-26

Family

ID=31565969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4881889U Pending JPH02140850U (US07943777-20110517-C00090.png) 1989-04-27 1989-04-27

Country Status (1)

Country Link
JP (1) JPH02140850U (US07943777-20110517-C00090.png)

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