JPH02139716U - - Google Patents
Info
- Publication number
- JPH02139716U JPH02139716U JP4905589U JP4905589U JPH02139716U JP H02139716 U JPH02139716 U JP H02139716U JP 4905589 U JP4905589 U JP 4905589U JP 4905589 U JP4905589 U JP 4905589U JP H02139716 U JPH02139716 U JP H02139716U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- crimping pin
- light
- axis
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4905589U JPH054996Y2 (en, 2012) | 1989-04-26 | 1989-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4905589U JPH054996Y2 (en, 2012) | 1989-04-26 | 1989-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02139716U true JPH02139716U (en, 2012) | 1990-11-21 |
| JPH054996Y2 JPH054996Y2 (en, 2012) | 1993-02-09 |
Family
ID=31566417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4905589U Expired - Lifetime JPH054996Y2 (en, 2012) | 1989-04-26 | 1989-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054996Y2 (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011148261A (ja) * | 2010-01-25 | 2011-08-04 | Seidensha Electronics Co Ltd | 熱カシメ装置及び熱カシメ方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019188257A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社メイコー | プレス装置、及び回路基板の製造方法 |
-
1989
- 1989-04-26 JP JP4905589U patent/JPH054996Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011148261A (ja) * | 2010-01-25 | 2011-08-04 | Seidensha Electronics Co Ltd | 熱カシメ装置及び熱カシメ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH054996Y2 (en, 2012) | 1993-02-09 |