JPH02138014A - Mechanism for cutting out semiconductor device - Google Patents

Abstract

PURPOSE:To improve reliability by a method wherein in a mechanism for cutting out an IC in a tilted tube in a horizontal posture, a cam is communicated with a tilting rail, and a shuttle rail with vacuum suction function which is freely movable between a posture for aligning the tilting tube and a horizontal posture is provided. CONSTITUTION:An IC 1 in a tilting tube 2 is dropped and stable on a tilting rail 3 with a stopper pin 10. On the other hand, a shuttle rail 12 is moved along a cam 11 to a position for aligning with the tilting rail 3. Then, by elevating the stopper pin 10, one IC 1 is transferred onto the shuttle rail 12 and vacuum sucked. At the same time, the next IC 1 is engaged with the stopper pin 10 lowered. Then, the shuttle rail 12 is returned to a horizontal posture. This constitution improves positioning accuracy when an IC is cut out and simplifies mechanism since a horizontal feeding mechanism or the like is not required, while reducing time for cutting out only one IC by setting it in a horizontal state from a tilted state.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a semiconductor manufacturing apparatus that separates a single semiconductor device (hereinafter referred to as an IC) in a horizontal position that falls from within a tube that is supported in an inclined manner. The invention relates to a cutting mechanism.

[Conventional technology]

FIG. 4 shows the cut-out mechanism of this type of conventional semiconductor manufacturing equipment. In the figure, 1 indicates the IC52.
3 is an inclined rail, 4 is a tube containing multiple
is the first shuttle rail that moves the ICIs one by one from the inclined state to the horizontal state, 4a indicates the position where this shuttle rail 4 is in the inclined state, and 5 indicates the position of the ICI on the inclined rail 3.
A first cutting pin for keeping the ICI stationary above, 6 a second cutting pin for cutting out the ICI on the shuttle rail 4,
7 is a horizontal rail, 8 is a horizontal feed mechanism that conveys the ICI in a horizontal state, and 9 is a cutting air that cuts out the ICIs sent to a fixed position on the horizontal rail 7 one by one by the horizontal feed mechanism 8. Department.

Next, its operation will be explained. First, the ICI in the tube 2 that is supported in an inclined manner falls, and after pressing the workpiece C1 on the inclined rail 3 with the first cutting pin 5, the cutting pin 5 and the IC receiving position are pressed. The ICI is removed by the operation of the cutout pin 6 on the shuttle rail 4 at 114a.
is placed on the shuttle rail 4, and then the shuttle rail 4 moves horizontally. The ICIs now in a horizontal state are transported to a fixed position on the horizontal rail 7 by the horizontal feed mechanism 8, and air is blown out from the cutting air section 9 to cut out the ICIs one by one. be.

[Problem to be solved by the invention]

The cutting mechanism of conventional semiconductor manufacturing equipment is configured as described above, and the ICs cut out from the tilted state become horizontal, and then the ICs are cut out one by one using air.
There are problems such as the IC bounces off the stopper and cannot be cut out in a fixed position, and the mechanism itself becomes expensive because it requires a horizontal feed mechanism.

This invention was made to solve the above-mentioned problems, and provides highly reliable semiconductor manufacturing equipment in which the IC is already fixed in place when the IC changes from a tilted state to a horizontal state. The purpose is to obtain a cutting mechanism for.

[Means to solve the problem]

The cutting mechanism of the semiconductor manufacturing apparatus according to the present invention includes an IC
It has a rail on which only one object can be placed and vacuum-suctioned, and the rail is operated by a cam.

[Effect]

Since the rail in this invention is moved by a cam, it can always be moved to a fixed position, and since the IC can be vacuum-adsorbed, it can be fixed in a fixed position.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, 10 is a stopper bin that stops the ICI on the inclined rail 3, 11 is a cam that is arranged continuously on the inclined rail 3, and 12 is a stopper bin that is placed along the cam 11 to receive the ICI from the inclined rail 3 and keep it in a horizontal state. It is an almost L-shaped shuttle rail that moves with a vacuum suction port (
(not shown). Note that 13 is shuttle rail 1
2 and rotates along the cam 11. FIG. 2 is a diagram showing the shuttle rail 12 moving along the cam 11 and in an inclined state, and FIG. 3 is a diagram showing the shuttle rail 12 vacuum-chucking only one IC 1 and cutting it out.

Next, the operation will be explained. First, as shown in Figure 1,
The ICI in the tube 2 supported in an inclined manner falls, and the IC 1 is kept stationary on the inclined rail 3 by the stopper bin 10, while the shuttle rail 12 is in a horizontal state. After that, the shuttle rail 12 moves along the cam 11 toward the inclined rail 3 by driving an air cylinder or the like,
After the movement is completed, the stopper bin 10 rises, and only one ICI that has been stationary is placed on the shuttle rail 12, and is vacuum-adsorbed (the state shown in Fig. 2).
After the stopper bin IO is lowered and brought to a standstill, the shuttle rail 12 vacuum-adsorbing the IC 1 returns to the horizontal state along the cam 11, and the cutting is completed.

〔Effect of the invention〕

As described above, according to the present invention, the positioning accuracy when cutting out an IC is improved, and since a horizontal feeding mechanism is not required, the mechanism can be made inexpensive and simple. The time it takes to cut out just one piece is also shortened. By arranging multiple units of this mechanism in the horizontal direction (vertical direction in Figure 1), multiple ICs can be manufactured from one tube.
It has many excellent effects, such as being able to position each at a fixed pitch.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a cutting-out mechanism of a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIGS. 2 and 3 are illustrations of its operation, and FIG. 4 is a front view showing a cutting-out mechanism of a conventional semiconductor manufacturing apparatus. It is a diagram. In the figure, 1 is the IC12 tube, 3 is the inclined rail, and IO
is a stopper bin, 11 is a cam, 12 is a shuttle rail,
13 is a roller. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] In this mechanism, ICs that fall from inside a tube supported on an inclined rail are moved horizontally and separated and cut out one by one. A cam is placed continuously on the inclined rail, and only one IC is cut out. It is characterized by having a shuttle rail that can be placed and vacuum-suctioned, and that moves reciprocatingly along the cam so that the IC mounting surface is horizontal at one end of the stroke and the tube has an inclined angle at the other end. A cutting mechanism for semiconductor manufacturing equipment.