JPH0213770U - - Google Patents
Info
- Publication number
- JPH0213770U JPH0213770U JP9193888U JP9193888U JPH0213770U JP H0213770 U JPH0213770 U JP H0213770U JP 9193888 U JP9193888 U JP 9193888U JP 9193888 U JP9193888 U JP 9193888U JP H0213770 U JPH0213770 U JP H0213770U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- wiring board
- printed wiring
- land
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9193888U JPH0213770U (it) | 1988-07-13 | 1988-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9193888U JPH0213770U (it) | 1988-07-13 | 1988-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213770U true JPH0213770U (it) | 1990-01-29 |
Family
ID=31316395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9193888U Pending JPH0213770U (it) | 1988-07-13 | 1988-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213770U (it) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351845A (ja) * | 2005-06-16 | 2006-12-28 | Nissan Motor Co Ltd | 電子部品実装用基板及び実装方法並びに装置 |
| JP2007042995A (ja) * | 2005-08-05 | 2007-02-15 | Panasonic Ev Energy Co Ltd | プリント配線板とその半田付け方法及び装置 |
| JP2008533744A (ja) * | 2005-03-15 | 2008-08-21 | メドコンクス， インコーポレイテッド | マイクロ半田ポット |
| US10299387B2 (en) | 2017-05-23 | 2019-05-21 | Fujitsu Limited | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component |
-
1988
- 1988-07-13 JP JP9193888U patent/JPH0213770U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008533744A (ja) * | 2005-03-15 | 2008-08-21 | メドコンクス， インコーポレイテッド | マイクロ半田ポット |
| JP2006351845A (ja) * | 2005-06-16 | 2006-12-28 | Nissan Motor Co Ltd | 電子部品実装用基板及び実装方法並びに装置 |
| JP4639353B2 (ja) * | 2005-06-16 | 2011-02-23 | 日産自動車株式会社 | 電子部品実装用基板及び実装方法並びに装置 |
| JP2007042995A (ja) * | 2005-08-05 | 2007-02-15 | Panasonic Ev Energy Co Ltd | プリント配線板とその半田付け方法及び装置 |
| JP4580839B2 (ja) * | 2005-08-05 | 2010-11-17 | プライムアースＥｖエナジー株式会社 | プリント配線板 |
| US10299387B2 (en) | 2017-05-23 | 2019-05-21 | Fujitsu Limited | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component |