JPH02137252A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the bending of a lead at the time of burn-in test by providing a linkage frame with notches so as to correspond with separating frames to divide a device into individual sections. CONSTITUTION:Stress at the time of resin sealing is absorbed by slits 15 arranged in separating frames 17. W-shaped notches 18 are formed at parts of linkage frames 16-1, 16-2 which correspond with the separating frames 17. When a device is mounted on a socket for a lead frame use, and subjected to BT test, stress is applied in the longitudinal direction of the lead frame by the difference of thermal expansion between the lead frame and the socket. This stress is absorbed by the deformation of portional put between the slits 15 and the notches 18. Thereby, the positional deviation between the socket and a package is not caused, so that the deformation of the lead can be prevented.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to lead frames for semiconductor devices.

[Conventional technology]

A conventional lead frame for a semiconductor device has a connecting frame 6-1.6 as shown in FIG. -2 has a straight outer edge and a constant width.

[Problem to be solved by the invention]

In the conventional lead frame for semiconductor devices described above, the width of the connection frame is constant, so in the manufacturing process of semiconductor devices,
After mounting a semiconductor chip and enclosing it in a package before separating it individually, it is assembled into a lead frame socket at room temperature and then exposed to high temperatures in a BT bath, but at that time the amount of thermal expansion between the socket and lead frame is different. Therefore, there is a drawback that the leads may be bent, especially in a lead frame with a narrow pitch between the leads.

[Means to solve the problem]

In the lead frame for a semiconductor device of the present invention, a notch is provided in the connecting frame corresponding to the partition frame dividing each frame.

〔Example〕

Next, the present invention will be explained with reference to the first page.

FIG. 1 is a plan view showing an embodiment of the present invention, in which a semiconductor chip is mounted on a lead frame, enclosed in a package, and a tie bar (not shown) is cut away.

Reference numeral 15 denotes a slit provided in the partition frame 17 to absorb distortion during resin filling. A W-shaped notch 18 is provided in a portion of the connecting frame 16-1 and 16-2 that corresponds to the partition frame.

When performing a BT test by attaching it to a lead frame socket, stress is applied in the X direction (longitudinal direction of the lead frame) due to the difference in thermal expansion between the lead frame and the socket, but the portion sandwiched between the slit 15 and the notch 18 is deformed. Since the deformation of the leads is prevented, there is no misalignment between the socket and the package.

〔Effect of the invention〕

As explained above, in the present invention, since the connecting frame of the lead frame is provided with a cutout for absorbing the difference in thermal expansion, bending of the leads can be prevented during a burn-in test in the lead frame state, and the retention of semiconductor devices can be prevented. It has an improving effect.

5.15...Slit, 6 1.16-2...Connection frame, 7 18...notch.

, 6-2. 16- 17... Partition frame,

Claims (1)

[Claims] A lead frame for a semiconductor device, characterized in that a connecting frame is provided with a notch corresponding to a partition frame dividing each frame.