JPH02136331U - - Google Patents

Info

Publication number
JPH02136331U
JPH02136331U JP1989044755U JP4475589U JPH02136331U JP H02136331 U JPH02136331 U JP H02136331U JP 1989044755 U JP1989044755 U JP 1989044755U JP 4475589 U JP4475589 U JP 4475589U JP H02136331 U JPH02136331 U JP H02136331U
Authority
JP
Japan
Prior art keywords
metal substrate
resin
protrusion
semiconductor device
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989044755U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989044755U priority Critical patent/JPH02136331U/ja
Publication of JPH02136331U publication Critical patent/JPH02136331U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989044755U 1989-04-17 1989-04-17 Pending JPH02136331U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989044755U JPH02136331U (enFirst) 1989-04-17 1989-04-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989044755U JPH02136331U (enFirst) 1989-04-17 1989-04-17

Publications (1)

Publication Number Publication Date
JPH02136331U true JPH02136331U (enFirst) 1990-11-14

Family

ID=31558333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989044755U Pending JPH02136331U (enFirst) 1989-04-17 1989-04-17

Country Status (1)

Country Link
JP (1) JPH02136331U (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714943A (ja) * 1993-06-18 1995-01-17 Matsushita Electric Works Ltd チップキャリア
JP2018029183A (ja) * 2013-04-17 2018-02-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス部品およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832616U (enFirst) * 1971-08-21 1973-04-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832616U (enFirst) * 1971-08-21 1973-04-20

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714943A (ja) * 1993-06-18 1995-01-17 Matsushita Electric Works Ltd チップキャリア
JP2018029183A (ja) * 2013-04-17 2018-02-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス部品およびその製造方法

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