JPH02134854A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To avoid development of crackings in molding resin and mount a semiconductor element as large as possible under the limited outer dimensional conditions by a method wherein a protrusion is provided on the surface of the semiconductor element which is supported by leads with an insulating member between and the protrusion is indirectly bonded to the insulating member with bonding material and so forth. CONSTITUTION:A semiconductor element 1 having a group of electrodes 9, a plurality of leads 3 which are extended to positions where they support the semiconductor element 1, metal fine wires 4 with which the respective electrodes 9 are connected to the respective leads 3, a member 11 which insulates the semiconductor element 1 from the respective leads 3 electrically and a sealing resin part 5 in which the respective components are molded are provided to constitute a resin-sealed semiconductor device. In the device, at least one protrusion 12 is provided on the surface of the semiconductor element 1 which is supported by the leads 3 with the insulating member 11 in between and the protrusion 12 is indirectly bonded to the insulating member 11 and, on the other hand, the parts other than the protrusion 12 are mounted on the insulating member 11 directly, indirectly or with a gap in between.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and is particularly suitable for preventing the occurrence of resin cranks, and is suitable for increasing the size of semiconductor elements. The present invention relates to semiconductor devices.

[Conventional technology]

In recent years, the dimensions of semiconductor devices have tended to increase as they have become more highly integrated.In contrast, the external dimensions of semiconductor devices have become more flexible due to demands for compatibility with other products or higher packaging density. We are in a situation where we are unable to expand.

Conventionally, in a resin-sealed semiconductor device, as shown in a cross section in FIG. A structure in which the electrode 9 and the lead 3 are electrically connected by a metal body 84 and the periphery thereof is sealed with a sealing resin 5 to form a package is known from Japanese Patent Laid-Open No. 57-64942. There is.

In addition, as disclosed in Japanese Patent Application Laid-open No. 57-114261, there is a method in which the tab is eliminated, the lead is extended to the vicinity of the center of the package, and the semiconductor element is mounted directly or through an insulating film on the lead. There is something.

[Problem to be solved by the invention]

However, in the structure shown in JP-A-57-64942, if the size of the semiconductor element 1 is increased without changing the external dimensions of the device, the bonding interface 8 between the lead 3 and the sealing resin 5 will be damaged as shown in the following figure. A high thermal stress occurs due to the difference in linear expansion coefficient between the semiconductor element 1 and the sealing resin 5.

In other words, Fig. 12 shows a standard 16-pin dual in-line package with various dimensions (semiconductor element width 3).
．． The distribution of the maximum principal stress on the side surface of the sealing resin when a semiconductor element of 5 to 5.5 am) is mounted is obtained by analysis. In this analysis, the influence of the leads was omitted, and only the semiconductor element and the tab were assumed to generate stress in the sealing resin. As is clear from FIG. 12, the stress on the side surface of the sealing resin increases rapidly as the size of the semiconductor element increases, and its distribution rapidly increases near the height where the semiconductor element exists. Therefore, in the conventional semiconductor device 11 in which the adhesive interface 8 between the lead 3 and the sealing resin 5 is located near the semiconductor element 1, the thermal stress acting on the adhesive interface 8 increases as the semiconductor element becomes larger. As a result, adhesive peeling and resin cracks occur between adjacent leads, making it impossible to obtain a sealing effect.

Furthermore, as shown in FIG. 11, as the semiconductor element 1 increases in size, the length 6 of the portion where the leads 3 are fixed with the sealing resin 5 becomes insufficient, and the lead 3 has sufficient fixing strength against external forces. Furthermore, it becomes difficult to secure a sufficient connection portion 7 between the thin metal wire 4 and the lead 3.

On the other hand, according to the structure shown in Japanese Unexamined Patent Publication No. 57-114261, it is possible to ensure the fixing strength of the leads.

However, in the above conventional technology, an insulating member with a linear expansion coefficient different from that of the sealing resin is provided on the entire surface between the bottom surface of the semiconductor element and the top surface of the leads, that is, the entire surface of the bottom surface of the cable. Exists near semiconductor elements. Therefore, the adhesive interface between the lead and the sealing resin around the semiconductor cord.

They are strongly subjected to thermal stress generated by semiconductor elements, insulating members, etc., and adhesive peeling and resin cracks occur in this case as well.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin-sealed semiconductor device that can prevent the occurrence of resin cracks and can mount as large a semiconductor element as possible within limited external dimensions.

[Means to solve the problem]

In order to achieve the above object, a convex portion is provided on the surface of the semiconductor element to be mounted on the insulating member or tab.

This is achieved by indirectly joining the protrusion and the insulating member or the tab.

In order to achieve the above object, the invention as claimed in claim 1 of the present application includes a semiconductor element having an electrode group, a plurality of leads extending and arranged at a position supporting the semiconductor element, and each lead. A thin metal wire that electrically connects each of the corresponding electrodes, a member that electrically insulates each of the boards and the semiconductor element, and a sealing resin part that molds each of the parts. In the resin-sealed semiconductor device, a convex portion is provided on a surface of the semiconductor element supported by the lead via the insulating member, and the convex portion and the insulating member are indirectly bonded via a bonding material. It is characterized by the presence of

In order to achieve the above object, the invention recited in claim 2 of the present application is based on the same premise as the invention recited in claim 1, in which the size of the insulating member is larger than the convex portion, and the semiconductor It is characterized in that it is made smaller than the element, and the convex portion and the insulating member are indirectly joined.

The invention set forth in claim 3 of the present application provides that, on the same premise as the invention set forth in claim 1, in order to achieve the above object [1], the convex portion is formed by a member different from the semiconductor element. It is characterized by having been configured.

In order to achieve the above object, the invention described in claim 4 of the present application includes a semiconductor element having an electrode group, a tab on which the semiconductor element is mounted, a lead group including a tab suspension lead connected to the tab, and a lead group including a tab suspension lead connected to the tab. In a resin-sealed semiconductor device comprising thin metal wires that electrically connect the electrodes corresponding to each lead, and a sealing resin portion that molds each of the components, the tab mounting side of the semiconductor element A convex portion is provided on the surface of the semiconductor element, and the size of the tab is larger than the convex portion and smaller than the semiconductor element, and the convex portion and the tab are indirectly bonded. The device is characterized in that the plurality of leads are arranged on the lower surface of the element.

[Effect]

According to the configuration of the present invention, adhesive peeling and resin cracks occurring between the leads can be prevented by separating the adhesive interface between the lead and the sealing resin from the height position where the semiconductor element exists where thermal stress increases. Even when a large semiconductor element is mounted, a highly reliable resin-sealed semiconductor device can be obtained.

【Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device which is an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a resin-sealed semiconductor device according to an embodiment of the present invention, and FIG. It is a top view in a state.

In the figure, a semiconductor cord 1 is provided with electrodes 9 at both longitudinal ends thereof. This semiconductor element 1 is attached to the lead fixing inclined wall 6. shown in FIG. It covers up to the connection part 7 between the thin metal wire 4 and the lead 3, and the semiconductor element 1 is enlarged within the size range that the package size of the part molded with the sealing resin 5 allows. be. Lead 3 is
A plurality of them are arranged on both sides of the outside of the package, and inside the sealing resin 5, they are disposed at a position below the semiconductor element 1 to support the semiconductor element 1, and extend in an L-shaped bent shape. A sheet-like insulating member 11 is adhered onto the adhesive 3. Surface 1a of semiconductor element 1 mounted on insulating member 11
A convex portion 12 is provided in the center of the semiconductor element 1.
is mounted on the insulating member 11 by joining the convex portion 12 and the insulating member 11 via a bonding material 13.

As a result, the semiconductor element 1 is placed at a higher position than the leads 3, and the leads 3 are placed at a position where the stress distribution shown in FIG. 12 is reduced. The ends of the extensions of the leads 3 are formed to have different lengths for each lead 3 so as to be located near the electrodes 9 of the semiconductor element 1. The tip of the glue 3 inside the sealing resin 5 is electrically connected to the electrode 9 of the semiconductor element 1 by the thin metal wire 4 .

Further, the electrodes 9 on the semiconductor element 1 are arranged so that the connection with the tip of each lead 3 is the shortest distance. A sealing resin 5 is interposed in the non-bonded portion between the semiconductor element 1 and the insulating member 11 so as to be in direct contact with both.

According to this embodiment, even if the semiconductor element 1 becomes large in size, the stress at the adhesive interface between the leads 3 and the sealing resin 5 can be reduced, so that the stress at the adhesive interface between the leads 3 and the sealing resin 5 can be reduced. It is possible to prevent resin cracks that occur in the lead 3 and the metal wire 4. A lead connection area can be secured.

Note that when assembling this semiconductor device, first, the semiconductor element 1 is attached to the insulating member 11 bonded on the lead 3.
is mounted, and at this time, the convex portion 12 provided on the semiconductor element 1 and the insulating member 11 are bonded via a bonding material. Next, the electrodes 9 on the semiconductor element 1 and each lead 3 are electrically connected using thin metal wires 4, and then these are sealed with a sealing resin 5.
to obtain a semiconductor device.

The shape of the convex portion 12 provided on the semiconductor element 1 is not limited to the shape illustrated in this embodiment, but is similar to that shown in the third embodiment.
As illustrated in the figure, the semiconductor element 1 may have a shape elongated in the longitudinal direction, a shape elongated in the transverse direction, or a cross shape or a round shape. Further, the convex portion 12 may not only be provided at one location as illustrated in this embodiment, but may be provided at two or more locations. Furthermore, the location where the convex portion 12 is provided is not limited to the central portion of the semiconductor element 1, and may be provided at any location without any problem.

The direction in which the lead 3 is drawn out of the sealing resin 5 is not limited to two directions as shown in FIG. 1, but may be one direction or three or more directions without any problem. Furthermore, although the figure shows an example of a dual-in-line type in which the leads 3 are bent downward outside the sealing resin 5, the leads 3 outside the sealing resin 5 can be bent in any direction or shape. It's good and you don't have to bend it again.

FIGS. 4 and 5 show other embodiments of the present invention.
6 is a cross-sectional view of the resin-sealed semiconductor device of the present invention, and FIG. 5 is a plan view with the upper part of the encapsulating resin removed from the lead 3 to show the internal structure of FIG. 4. , a convex portion 12 is provided at the center of the surface 1a of the semiconductor element 1 supported by the lead 3 via the insulating member 11, and the semiconductor element 1 is larger than the convex portion 12 and is larger than the semiconductor element 1. It is mounted on the insulating member 11 by connecting the small insulating member 11 and the convex portion 12 via a bonding material 13. As a result, the semiconductor cords 1 are placed in a vertical position higher than the leads 3, and the leads 3 are placed at a position where the stress distribution shown in FIG. 12 is reduced. Moreover, the insulating member 11 that causes stress concentration is not present in the central portions 5a and 5b of the package where the maximum stress of the sealing resin 5 occurs. In this embodiment as well, even if the semiconductor cable 1 increases in size, the stress at the adhesive interface between the leads 3 and the sealing resin 5 can be reduced, so peeling of the resin adhesive interface and resin cracks can be prevented. can.

The convex portion 12 provided on the semiconductor element 1 may be made of a member different from the semiconductor element 1. In FIG. 6, a convex portion 12 is indirectly joined to the center of the surface 1a of the semiconductor element 1 supported by the leads 3 via the insulating member 11. The material of the convex portion 12 may be the same as that of the semiconductor element 1, or may be a different material.

7 and 8 show still other embodiments of the present invention, in which FIG. 7 is a cross-sectional view of a resin-sealed semiconductor device according to the present invention, and FIG. 8 shows the internal structure of FIG. 7. FIG. 3 is a plan view of the lead 3 with the upper sealing resin removed.

In the figure, a semiconductor element 1 is provided with electrodes 9 at both longitudinal ends thereof. This semiconductor element 1 has a lead fixing area 6. shown in FIG. It covers up to the connection part 7 between the thin metal wire 4 and the lead 3, and the semiconductor element 1 is enlarged to a size that is within the allowable size of the package of the part molded with the sealing resin 5. be. Inside the sealing resin 5, a tab suspension lead 10 is placed under the semiconductor element 1.
A tab 2 supported by the package is disposed at a position where the semiconductor element 1 is mounted, and a plurality of leads 3 are arranged on both sides of the outside of the package and extend around the tab 2 in an L-shaped bent shape. . A convex portion 12 is provided at the center of the surface 1a of the semiconductor element 1 that is mounted on the tab 2, and the semiconductor element 1 is
The tab 2 is larger than the convex portion 12 and smaller than the semiconductor cord 1.
The tab 2 is mounted on the tab 2 by joining the and the convex portion 12 via a joining material 13. by this.

The semiconductor element 1 is placed at a higher position than the leads 3, and the leads 3 are placed at a position where the stress distribution shown in FIG. 12 is reduced. The ends of the extensions of the leads 3 are formed to have different lengths for each lead 3 so as to be located near the electrodes 9 of the semiconductor cord 1. The tip of the glue 3 inside the sealing resin 5 is electrically connected to the electrode 9 of the semiconductor element 1 by the thin metal wire 4 . Further, the electrodes 9 on the semiconductor element 1 are arranged so that the connection with the tip of each lead 3 is the shortest distance.

The tab 2 on which the semiconductor element 1 is mounted is not only placed on the same plane as the lead 3, but also bent upward at the tab suspension lead 10 (not shown) as shown in FIG.
It may be arranged at a position higher than the lead 3, or it may be arranged at a position lower than the lead 3 as shown in FIG.

According to this embodiment, even if the semiconductor element 1 becomes large in size, the stress at the adhesive interface between the leads 3 and the sealing resin 5 can be reduced, so that the stress at the adhesive interface between the leads 3 and the sealing resin 5 can be reduced. It is possible to prevent resin cracks that would otherwise occur, and at the same time, it is possible to secure a sufficient fixed length of the cord 3, the thin metal wire 4, and the lead connection area. Furthermore, according to this embodiment, the semiconductor device can be constructed without using an insulating member, so there is also an effect of reducing costs.

In this embodiment as well, the shape, number and location of the protrusions 12 provided on the semiconductor element 1 are the same.

It is not limited to what is shown in this example.

Moreover, there is no problem even if the convex portion 12 is made of a member different from the semiconductor element 1.

〔Effect of the invention〕

According to the present invention, it is possible to prevent adhesive peeling between the leads and the sealing resin, resin cracks between the leads, etc., so that a good sealing effect can be obtained. It is possible to obtain a resin-sealed semiconductor device that can be mounted with.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the resin-sealed semiconductor device of the present invention, FIG. 2 is a plan view with the upper surface of the lead removed from the encapsulation resin in FIG. 1, and FIG. FIG. 4 is a plan view of a semiconductor element showing an example of the shape of the convex portion, FIG. 4 is a cross-sectional view showing another embodiment of the present invention, and FIG. Plan view, No. 6
The figure is a sectional view showing still another embodiment of the invention, FIG. 7 is a sectional view showing still another embodiment of the invention, and FIG. 8 is a sectional view showing still another embodiment of the invention.
9 and 10 are cross-sectional views of other embodiment devices, respectively, and FIG. 11 shows a conventional resin-to-IE type semiconductor device. The cross-sectional view, FIG. 12, is a maximum principal stress distribution diagram on the resin side surface of the semiconductor device. 1... Semiconductor element, 2... Tab, 3... Lead,
4... Metal thin wire, 5... Sealing resin, 9... Electrode,
DESCRIPTION OF SYMBOLS 11... Insulating member, 12... Convex part, 13... Bonding material. Tomizu 2 figure/Z・-convex elevation■ Zueri Otsu figure/--1 Half-happy I≧To→1≦j- Summer figure 13 special attack■ Figure 5 and figure 5Figure 1Fuzu figure 1ρ mouth■ I figure

Claims (1)

[Scope of Claims] 1. A semiconductor element having an electrode group, a plurality of leads extending and arranged at a position supporting the semiconductor element, and electrically connecting each lead and each corresponding electrode. In a resin-sealed semiconductor device, the resin-sealed semiconductor device comprises: a thin metal wire that electrically insulates each lead and the semiconductor element; and a sealing resin part that molds each of the parts. At least one convex portion is provided on the surface supported by the lead through an insulating member, and the convex portion and the insulating member are indirectly joined, while the portion other than the convex portion is connected to the insulating member. A resin-sealed semiconductor device characterized in that it is mounted directly, indirectly, or through a gap. 2. The size of the insulating member is larger than at least one convex portion provided on the surface of the semiconductor element supported by the lead via the insulating member, and smaller than the semiconductor element. A resin-sealed semiconductor device according to claim 1. 3. The resin-sealed semiconductor device according to claim 1, wherein the convex portion is made of a member different from the semiconductor element. 4. A semiconductor element having an electrode group, a tab on which the semiconductor element is mounted, a lead group including a tab suspension lead connected to the tab, and a metal that electrically connects each lead to each of the corresponding electrodes. In a resin-sealed semiconductor device comprising a thin wire and a sealing resin portion for molding each of the above-mentioned components,
At least one protrusion is provided on the tab mounting side surface of the semiconductor element, and the size of the tab is larger than the protrusion and smaller than the semiconductor element, so that the protrusion and the tab are indirectly connected. 1. A resin-sealed semiconductor device characterized in that a plurality of leads are disposed on the lower surface of the semiconductor element excluding the lower surface of the convex portion.