JPH02134839A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate mounting of semiconductor chips having little variation in characteristics on a carrier tape by a method wherein the region of a carrier tape including a lead frame protruding from the semiconductor chip is cut out and a mark is formed in the region in accordance with the screened characteristic value and the region is bonded to another carrier tape having no lead frame. CONSTITUTION:A semiconductor chip 7 having electronic circuits on its one main surface is mounted on a carrier tape to which a lead frame is bonded and, after the electrode pads 16 of the semiconductor chip 7 are connected to the lead frame, the semiconductor chip 7 is subjected to characteristics screening. When a semiconductor device is manufactured through such a process, the region 5 of the carrier tape including the lead frame protruding from the semiconductor chip 7 is cut out and a mark is formed in the cut-out region 5 of the carrier tape in accordance with the screened characteristic value. Then the cut-out region 5 of the carrier tape is bonded to another carrier tape 1a having no lead frame.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a semiconductor device using a tape carrier method.

[Conventional technology]

Semiconductor devices using this type of tape carrier method are manufactured by mounting a semiconductor chip on a carrier tape to which a lead frame is attached, and connecting and wiring the lead frame and the electrode pads of the semiconductor chip. In particular, this carrier tape type semiconductor device requires wiring and characteristics selection with the semiconductor chip mounted on the tape.
This semiconductor device has the advantage of being easy to automate;
Since it can be made thin, it has come to be widely used in calculators, watches, electronic notebooks, etc.

FIG. 8 is a plan view of a conventional semiconductor device.

This semiconductor device manufacturing method consists of two parts:
We start by manufacturing the components, which are a carrier tape with a lead frame attached to it and a semiconductor chip.

First, regarding the carrier tape, a long resin tape 1
Sprocket holes 10 through which the resin tape 1 is sent out are formed on both sides of the sprocket. Further, a rectangular hole 12 into which the semiconductor chip 7 is inserted is formed in the center surface of the resin tape 14. Furthermore, this rectangular hole 1
Suspenders 13 are formed by making trapezoidal holes 18 along each side of 2.

Next, copper foil is attached to the resin tape 1. This copper foil is processed into the following shape by etching. That is, the lead frames 2a, 2b, 2C, and 2d have lead portions 4a, 4b, 4c, and 4d having various shapes, each having pads 3a to 3d at one end of the lead, and the lead portion 3C of the lead frame 2C. It is formed to have a protrusion 15 having a recognition mark 17, which is a hole, on one side.

On the other hand, semiconductor chips are manufactured after passing through a number of processes, namely, a process of diffusing impurities to form a large number of electronic circuit element regions on a semiconductor substrate, a process of forming internal wiring, and a process of forming an interlayer insulating film. The substrate is cut and divided into regions to form semiconductor chips.

After the above two parts are prepared, first, the semiconductor chip 7 is inserted into the hole 12 of the resin tape 1, and the relative position of the recognition mark 17 and the semiconductor chip 7 is determined while observing with a microscope. Next, each lead portion 4a is bonded using a bonding device.
, 4b, 4C, and 4d are crimped and connected to the electrode pads 16 of the semiconductor chip.

Next, the semiconductor chips 7 mounted on the resin tape 1 are sent to a sorting stage, and are inspected and sorted by bringing the contacts into contact with the pads 3a of the lead frame 2a.

[Problem to be solved by the invention]

In the conventional semiconductor device manufacturing method described above, semiconductor chips are inspected and sorted after being mounted on a carrier tape, so semiconductor chips attached to the same carrier tape each have variations in characteristics. For example, in the case of memory, even if you grade it by speed, memories with different speeds will be scattered on the same carrier tape, making it impossible to meet the demand for memory with consistent speeds. There is.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that allows semiconductor chips with less variation in characteristics to be mounted on the same carrier tape.

[Means to solve the problem]

The method for manufacturing a semiconductor device of the present invention includes the steps of: - mounting a semiconductor chip having an electronic circuit formed on its main surface on a carrier tape to which a lead frame is bonded; and connecting electrode pads of the semiconductor chip and the lead frame. , a method for manufacturing a semiconductor device including, after this step, a step of selecting the characteristics of the semiconductor chip, after the selecting step, cutting out a region of the carrier tape including the lead frame protruding from the semiconductor chip, and The method includes the steps of forming a mark according to the characteristic selection value in the region of the carrier tape, and pasting the carrier tape in the cutout region to another carrier tape without a lead frame.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view showing a semiconductor device manufactured by a manufacturing method according to a first embodiment of the present invention.

As shown in the figure, this semiconductor device is mounted with a semiconductor chip 7 after characteristics selection using a conventional semiconductor device manufacturing method, and lead portions 4a, 4b, 4C of a lead frame protruding from the semiconductor chip 7. The frame body 5, which is an area of the carrier tape having legs 6 projecting from the four corners, including 4d, is cut out and pasted onto another resin tape la without a lead frame.

3 to 7 are plan views of a carrier tape including semiconductor chips shown in the processing order of the carrier tape for explaining an example of the method of manufacturing a semiconductor device of the present invention. first,
Similar to the conventional example, a sprocket hole 10, a hole 12 into which a semiconductor chip 7 is inserted, etc. are made in a resin tape 1, for example, a tape such as Kapton. Next, a copper foil having a thickness of, for example, about 35 μm is attached and etched to form the bonded frames 2a, 2b, 2c, and 2d.

Next, as shown in FIG. 4, the semiconductor chip 7 is inserted into the hole 12 of the resin tape 1, and the semiconductor chip 7 is
The relative positions of the recognition mark 17 and the semiconductor chip 7 are determined while looking through a microscope.

Next, the semiconductor chip 7 on which bumps have been formed in advance
The electrode pads 16 and the tips of the leads of the lead frames 2a, 2b, 2C, and 2d are crimped and connected using a bonding device.

Next, characteristic selection is performed in the same manner as before. At this time, the sorting machine grades the characteristic values of each semiconductor chip that is sequentially fed by the resin tape 1, and stores the classification of the characteristic values of the semiconductor chips. Next, a punching device reads the characteristic values stored in the sorting machine and punches holes 8 in the supporting portion 9 of the resin tape 1 according to marks corresponding to the characteristic values, that is, as shown in FIG. This semiconductor chip 7
It is preferable to classify the characteristic value classification according to the size or position of the hole 8, for example.

Next, as shown in FIG.
It's about cutting out more. On the other hand, punch holes 14 larger than the sprocket 10 and the semiconductor chip 7 are formed in another resin tape 1a as shown in FIG. A protrusion 11 is formed to fit into the hole 8 shown in FIG.

Next, as shown in FIG. 1, the cutout frame 5 shown in FIG. 6 is attached to the protrusion 11 of another resin tape 1a shown in FIG.
Insert into hole 8 and paste. By doing this, semiconductor chips of the same characteristic value classification are mounted on the same carrier tape.

FIG. 2 is a plan view of the frame showing another shape of the frame shown in FIG. This frame body 5a has the semiconductor chips 7 mounted thereon after sorting, and the lead portions 4a, 4b, 4c.
and 4d are cut out into a rectangular shape. And another resin sheet without lead frame 1-1 c
This frame body 5a is attached to the frame body 5a. This frame 5a
Since the frame body 5 is stronger than the frame body 5 described above, it has the advantage that the pasting process is easier.6 In the above embodiments, the frame body cut out from the resin tape on which the semiconductor chip is mounted is used as one part of the lead frame. (Pad 3
Although the explanation has been given using an example in which parts a, 3b, 3c, and 3d) are left, the area including the entire lead frame may be cut out. Therefore, the present invention is not limited to the shape of the resin tape to be cut out. do not have.

〔Effect of the invention〕

As explained above, the present invention forms a mark in accordance with the characteristic value of the semiconductor chip in the carrier tape after the characteristic selection inspection of the semiconductor chip mounted on the carrier tape, and leads the carrier tape on which the semiconductor chip is mounted. By making a cutout frame in the area including the frame and pasting semiconductor chips with the same characteristic value classification in the cutout frame on the same carrier tape without a lead frame, the same carrier tape can be used. This has the effect of providing a method for manufacturing a semiconductor device that can perform WiN on semiconductor chips with less variation in characteristics.

[Brief explanation of the drawing]

FIG. 1 shows a first embodiment according to the present invention! A plan view showing a semiconductor device manufactured by method A, a plan view of a carrier tape including semiconductor chips showing the processing order of the carrier tape for explaining an example of the second manufacturing method, and FIG. FIG. 1 is a plan view of a semiconductor device showing an example. 1.1a, 1c-resin tape, 2a, 2 +), 2C
52d-, lead frame, 3a, 3b, 3c3 d
... Pad, 4a, 4b, 4 C14d -, Lead part, 5.5a... Frame body, 6... Foot part, 7...
Semiconductor chip, 8.8a, 12.18. ,, hole, 9...
・Support part, 10... Sprocket hole, 1... Protrusion, 3... Suspender, ■ 4... Hole,... Projection, 6... Electrode, 7... Recognition mark.

Claims (1)

[Claims] A step of mounting a semiconductor chip with an electronic circuit formed on one main surface on a carrier tape to which a lead frame is adhered, and connecting the electrode pads of the semiconductor chip with the lead frame, and after this step, characteristics of the semiconductor chip. In the method of manufacturing a semiconductor device, the method includes a step of sorting, after the sorting step, a region of the carrier tape including the lead frame protruding from the semiconductor chip is cut out, and a characteristic selection value is placed in the cut out region of the carrier tape. 1. A method for manufacturing a semiconductor device, comprising the steps of: forming a mark in accordance with the above, and pasting the carrier tape in the cutout region onto another carrier tape without a lead frame.