JPH02129734U - - Google Patents
Info
- Publication number
- JPH02129734U JPH02129734U JP1989038080U JP3808089U JPH02129734U JP H02129734 U JPH02129734 U JP H02129734U JP 1989038080 U JP1989038080 U JP 1989038080U JP 3808089 U JP3808089 U JP 3808089U JP H02129734 U JPH02129734 U JP H02129734U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- main plane
- heat sink
- bonded
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989038080U JPH02129734U (US06633782-20031014-M00005.png) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989038080U JPH02129734U (US06633782-20031014-M00005.png) | 1989-03-31 | 1989-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02129734U true JPH02129734U (US06633782-20031014-M00005.png) | 1990-10-25 |
Family
ID=31545766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989038080U Pending JPH02129734U (US06633782-20031014-M00005.png) | 1989-03-31 | 1989-03-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02129734U (US06633782-20031014-M00005.png) |
-
1989
- 1989-03-31 JP JP1989038080U patent/JPH02129734U/ja active Pending