JPH02129729U - - Google Patents
Info
- Publication number
- JPH02129729U JPH02129729U JP3768789U JP3768789U JPH02129729U JP H02129729 U JPH02129729 U JP H02129729U JP 3768789 U JP3768789 U JP 3768789U JP 3768789 U JP3768789 U JP 3768789U JP H02129729 U JPH02129729 U JP H02129729U
- Authority
- JP
- Japan
- Prior art keywords
- frame body
- bonding
- wiring board
- fixed
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3768789U JPH02129729U (enExample) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3768789U JPH02129729U (enExample) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129729U true JPH02129729U (enExample) | 1990-10-25 |
Family
ID=31545027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3768789U Pending JPH02129729U (enExample) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129729U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520326U (ja) * | 1991-05-14 | 1993-03-12 | 金星エレクトロン株式会社 | リードフレームのインナーリードクランプ装置 |
-
1989
- 1989-03-30 JP JP3768789U patent/JPH02129729U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520326U (ja) * | 1991-05-14 | 1993-03-12 | 金星エレクトロン株式会社 | リードフレームのインナーリードクランプ装置 |