JPH02114933U - - Google Patents
Info
- Publication number
- JPH02114933U JPH02114933U JP1989022309U JP2230989U JPH02114933U JP H02114933 U JPH02114933 U JP H02114933U JP 1989022309 U JP1989022309 U JP 1989022309U JP 2230989 U JP2230989 U JP 2230989U JP H02114933 U JPH02114933 U JP H02114933U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- wiring
- bonded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022309U JPH02114933U (enExample) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022309U JPH02114933U (enExample) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114933U true JPH02114933U (enExample) | 1990-09-14 |
Family
ID=31240305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989022309U Pending JPH02114933U (enExample) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114933U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873126A (ja) * | 1981-10-27 | 1983-05-02 | Seiko Keiyo Kogyo Kk | 半導体装置の実装方法 |
| JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
-
1989
- 1989-02-28 JP JP1989022309U patent/JPH02114933U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873126A (ja) * | 1981-10-27 | 1983-05-02 | Seiko Keiyo Kogyo Kk | 半導体装置の実装方法 |
| JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |