JPH0212894A - Method of cutting ceramic circuit board - Google Patents
Method of cutting ceramic circuit boardInfo
- Publication number
- JPH0212894A JPH0212894A JP16304688A JP16304688A JPH0212894A JP H0212894 A JPH0212894 A JP H0212894A JP 16304688 A JP16304688 A JP 16304688A JP 16304688 A JP16304688 A JP 16304688A JP H0212894 A JPH0212894 A JP H0212894A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- ceramic wiring
- protecting film
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 47
- 238000005520 cutting process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000011230 binding agent Substances 0.000 claims abstract description 15
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 7
- 239000012778 molding material Substances 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000004793 Polystyrene Substances 0.000 abstract description 2
- 239000000113 methacrylic resin Substances 0.000 abstract description 2
- 229920002223 polystyrene Polymers 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
この発明は、セラミック配線基板の表面に配線パターン
を形成した後、これを所定の裁断線に従って裁断する方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of forming a wiring pattern on the surface of a ceramic wiring board and then cutting the same along predetermined cutting lines.
［従来の技術］
第７図〜第９図を参照しながら上記セラミック配線基板
の製造方法、特にその裁断工程について説明する。[Prior Art] A method of manufacturing the above-mentioned ceramic wiring board, particularly a cutting process thereof, will be described with reference to FIGS. 7 to 9.
先ず、Ａｌ２Ｏ５を主体としたセラミック原料粉末をバ
インダ成分と共に混練し、基板の成形素材となるスラリ
ーを作る。これをドクタ、−ブレード法等の手段でシー
ト状に延伸し、グリーンシート４を作る。このグリーン
シート４にスルーホール（図示せず）を穿孔し、さらに
第７図で示すように、配線パターン２．２・・・やスル
ーホール導体（図示せず）を印刷する。次に、このグリ
ーンシート４．４・・・と印刷ペーストを乾燥した後、
該グリーンシート４．４・・・を複数枚積み重ねて圧着
し、第７図で示すような未焼成のセラミック配線基板ｌ
を作る。First, a ceramic raw material powder mainly composed of Al2O5 is kneaded with a binder component to create a slurry that will become a molding material for the substrate. This is stretched into a sheet shape using a doctor, blade method, etc. to produce a green sheet 4. Through holes (not shown) are punched in this green sheet 4, and furthermore, as shown in FIG. 7, wiring patterns 2.2... and through-hole conductors (not shown) are printed. Next, after drying this green sheet 4.4... and the printing paste,
A plurality of green sheets 4.4... are stacked and crimped to form an unfired ceramic wiring board l as shown in FIG.
make.
上記印刷工程では、比較的広い面積のグリーンシート４
．４・・・に、複数相分の回路を同時に印刷する。従っ
て、これを積層した第７図の配線基板ｌには、複数組の
回路が形成されているため、上記積層体を個々の回路に
分割する裁断工程が必要である。この工程では、先ず上
記セラミック配線基板ｌの下面に、固定用シート５を接
着し、その後、第８図で示すようにダイシングソーａで
裁断し、個々の回路毎に分離する。In the above printing process, a green sheet 4 with a relatively large area is used.
．． 4... Print circuits for multiple phases at the same time. Therefore, since a plurality of sets of circuits are formed on the wiring board l shown in FIG. 7 in which these are laminated, a cutting step is required to divide the laminated body into individual circuits. In this step, the fixing sheet 5 is first adhered to the lower surface of the ceramic wiring board 1, and then, as shown in FIG. 8, it is cut with a dicing saw a to separate each circuit.
その後、このセラミック配線基板ｌを脱バインダ処理し
、さらに焼成することによって、セラミック配線基板ｌ
が完成する。After that, this ceramic wiring board l is subjected to a binder removal treatment and further fired to form a ceramic wiring board l.
is completed.
［発明が解決しようとする課題］
上記のようなダイシングソーａによる裁断工程では、セ
ラミック配線基板１の切り屑がセラミック配線基板ｌの
表面に付着する。この切り屑をセラミック配線基板Ｉの
表面から完全に除去することは極めて困難で、例えば、
第９図で示すように、ブラシＣやワイパー等で拭き取る
と、配線パターン２．２・・・が傷付いて断線したり、
印刷ペーストが配線パターン２．２・・・以外の部分に
延びて、回路が短絡される。また、こく。[Problems to be Solved by the Invention] In the cutting process using the dicing saw a as described above, chips of the ceramic wiring board 1 adhere to the surface of the ceramic wiring board l. It is extremely difficult to completely remove these chips from the surface of the ceramic wiring board I. For example,
As shown in Fig. 9, if you wipe it with brush C or wiper, etc., the wiring patterns 2.2... may be damaged and disconnected.
The printed paste extends to areas other than the wiring patterns 2, 2, etc., and the circuit is short-circuited. Also, rich.
さらに、上記裁断工程において、誤ってセラミック配線
基板Ｉの表面に傷を付けてしまうことも多く、これがセ
ラミック配線基板ｌの不良発生の大きな原因の一つとな
っている。Furthermore, in the above-mentioned cutting process, the surface of the ceramic wiring board I is often erroneously scratched, and this is one of the major causes of defects in the ceramic wiring board I.
この発明は、従来のセラミック配線基板の裁断工程にお
ける上記従来の問題点を解決することを目的とする。The object of the present invention is to solve the above-mentioned conventional problems in the conventional cutting process of ceramic wiring boards.
［課題を解決するための手段］
すなわち、前記目的を達成するため、本発明において採
用した手段の要旨は、表面に配線パターン１２．１２・
・・を印刷したグリーンシート１４．１４・・・により
、多層配線基板１１を形成し、これをダイシングソーａ
で裁断した後、前記グリーンシート１４．１４・・・を
脱バインダ処理する方法に於て、配線パターン１２．１
２・・・を印刷した裁断前のセラミック配線基板１１の
表面を、上記配線基板１１の成形材料中のバインダの熱
分解温度以下の温度で熱分解する保護膜１３で覆い、該
保護膜１３の上からセラミック配線基板１１を裁断した
後、同保護［１３から切り屑を除去し、その後前記セラ
ミック配線基板を熱処理炉に導入して、前記保護膜１３
の熱分解湿度以上の温度で熱処理することを特徴とする
セラミック配線基板゛の裁断方法である。[Means for Solving the Problem] That is, the gist of the means adopted in the present invention in order to achieve the above object is to form a wiring pattern 12.12 on the surface.
A multilayer wiring board 11 is formed using green sheets 14, 14, and so on printed with .
In the method of removing the binder from the green sheet 14.14 after cutting the green sheet 14.14, the wiring pattern 12.1
The surface of the ceramic wiring board 11 printed with . After cutting the ceramic wiring board 11 from above, chips are removed from the protective film 13, and then the ceramic wiring board is introduced into a heat treatment furnace to remove the protective film 13.
This is a method for cutting a ceramic wiring board, which is characterized by heat treatment at a temperature higher than the pyrolysis humidity of the ceramic wiring board.
［作 用コ
前記本発明による裁断方法によれば、切断時に保護膜１
３がセラミック多層基板１１の表面を覆っているため、
切断時に発生する切り屑は、この保護膜１３の表面に付
着する。そして、この切り屑を除去するが、このとき、
セラミック多層基板１１の表面は、前記保護膜１３で保
護され、そこに形成された配線パターン１２．１２・・
・に傷が付かない。さらに、この保護膜１３は、前記セ
ラミック配線基板１１を形成するグリーンシート１４．
１４・・・のバインダ成分の熱分解温度以下の温度で熱
分解されるため、その後の脱バインダ処理により熱分解
して除去される。従って、最終的に、セラミック配線基
板ｌｌには、切り屑、傷、保護膜１３の何れも残らない
。しかも、脱バインダ処理と同時に前記保護１摸１３の
除去が可能であるから、従来の方法に比べて、保護膜１
３を施す工程が増えるものの、切り屑の除去が容易であ
ることを勘案すると、より簡易な工程で実施できるよう
？こなる。[Function] According to the cutting method according to the present invention, the protective film 1 is removed during cutting.
3 covers the surface of the ceramic multilayer substrate 11,
Chips generated during cutting adhere to the surface of this protective film 13. Then, this chip is removed, but at this time,
The surface of the ceramic multilayer substrate 11 is protected by the protective film 13, and the wiring patterns 12, 12, . . . formed thereon are protected by the protective film 13.
・Does not cause any damage. Further, this protective film 13 is applied to a green sheet 14 that forms the ceramic wiring board 11.
Since it is thermally decomposed at a temperature lower than the thermal decomposition temperature of the binder component of No. 14, it is thermally decomposed and removed by the subsequent binder removal process. Therefore, ultimately, no chips, scratches, or protective film 13 remain on the ceramic wiring board ll. Moreover, since the protective film 13 can be removed at the same time as the binder removal process, the protective film 1
Although the number of steps to apply step 3 increases, considering that it is easy to remove chips, it seems like it can be done in a simpler process. This will happen.
［実 施 例コ
次に、第１図〜第６図を参照しながら、セラミック配線
基板の製造手順に従い、この発明の実施例について説明
する。[Embodiment] Next, an embodiment of the present invention will be described in accordance with the manufacturing procedure of a ceramic wiring board, with reference to FIGS. 1 to 6.
既に述べた方法で、スラリーからグリーンシートを作り
、これに配線バ１才一ン１２１．１．．２・・・を印刷
した後、複数枚積層し、第１図で示すような、複数組の
回路を有する未焼成のセラミック配ｔｆＡ基板１１を作
る。A green sheet is made from the slurry using the method already described, and a wiring bar is attached to it.121.1. ．． After printing 2..., a plurality of sheets are laminated to form an unfired ceramic tfA substrate 11 having a plurality of sets of circuits as shown in FIG.
次に、第２図で示すように、このセラミック配線基板１
１の背面に固定シート１５を接着すると共に、配線パタ
ーント２．１２・・・が形・成された該セラミック配線
基板１１の表面に保護膜１３を形成する。Next, as shown in FIG.
A fixing sheet 15 is adhered to the back surface of the ceramic wiring board 11, and a protective film 13 is formed on the surface of the ceramic wiring board 11 on which the wiring patterns 2, 12, . . . have been formed.
上記保護膜１３は、前記グリーンシー）１４．１４・・
・のバインダ成分の熱分解温度と同じかまたはそれ以下
の温度で熱分解するものを使用するが、さらにダイシン
グソーａによって容易に裁断でき、該ダイシングソーａ
に付着し難いものがよく、例えば、メタクリル樹脂、ポ
リスチレン、ポリプロピレン、ポリエチレン等の樹脂膜
を用ることができる。これは、予めシート状に成形され
たものを被着してもよいが、前記樹脂の溶液、例えば、
メタクリ酸イソブチルエステル重合体の８０％トルエン
溶液等を、スピンコード法等の手段でセラミック多層基
板１１の表面にコーティングし、乾燥する方法によって
形成するのが簡便である。なお、この場合の保護膜１３
の膜厚は、２〜５μｍ程度が一般的であるが、その膜厚
は、形成法により異なるのが通例で、何れの場合も後述
する切り屑の除去工程で、回路基板１１の表面を保護す
るのに十分なものであればよい。The above-mentioned protective film 13 is the above-mentioned Green Sea) 14.14...
A material that thermally decomposes at a temperature equal to or lower than the thermal decomposition temperature of the binder component is used, but it can also be easily cut with a dicing saw a, and the dicing saw a
For example, a resin film such as methacrylic resin, polystyrene, polypropylene, or polyethylene can be used. This may be applied to a sheet formed in advance, but a solution of the resin, for example,
It is convenient to form the coating by coating the surface of the ceramic multilayer substrate 11 with an 80% toluene solution of isobutyl methacrylate ester polymer using a spin coating method or the like, and then drying it. Note that the protective film 13 in this case
The film thickness is generally about 2 to 5 μm, but the film thickness usually differs depending on the forming method. As long as it is sufficient to do so.
次に、第３図で示すように、上記保護［１３の上からダ
イシングソーａによってセラミック配線基板１１を個々
の回路毎に裁断する。第３図に於て、ｂは切削液の噴射
ノズルで、裁断中のダイシングソーａの洗浄及び冷却を
目的として、同ダイシングソーａの刃先に切削液を吹き
付ける。なお、セラミック配線基板１１の切込み溝の中
に切り屑が残らないよう、ダイシングソーａを第３図に
於て矢印方向に回転させるのが好ましい。Next, as shown in FIG. 3, the ceramic wiring board 11 is cut into individual circuits from above the protection [13] using a dicing saw a. In FIG. 3, reference numeral b denotes a cutting fluid spray nozzle that sprays cutting fluid onto the cutting edge of the dicing saw a for the purpose of cleaning and cooling the dicing saw a during cutting. Note that it is preferable to rotate the dicing saw a in the direction of the arrow in FIG. 3 so that no chips remain in the cut grooves of the ceramic wiring board 11.
ダイシングソーａの切込み深さは、保護ｉｔ３からセラ
ミック配線基板１１の下面に至るまでの深さよりやや深
く調整しておき、固定シート１５へ上記ダイシングソー
８を浅く切り込ませる。従って、第４図で示すように、
個々の回路毎に裁断された後のセラミック配線基板１１
は、互いに分離せずに固定シー）１５の上に保持される
。The cutting depth of the dicing saw a is adjusted to be slightly deeper than the depth from the protection IT3 to the lower surface of the ceramic wiring board 11, and the dicing saw 8 is caused to make a shallow cut into the fixed sheet 15. Therefore, as shown in Figure 4,
Ceramic wiring board 11 after being cut into individual circuits
are held on a fixed seat (15) without separating from each other.
次に、この保持された状態のまま、第５図で示すように
、保護膜１３の上に付着した切り屑を除去する。除去の
手段は、例えば第５図で示すようなロール状ブラシＣに
よる他、ワイパ等による清掃が一般的である。何れの場
合も、表面の保護膜１３を完全に削り取ることなく、切
り屑が完全に除去される方法を採用する。Next, while maintaining this state, as shown in FIG. 5, the chips adhering to the protective film 13 are removed. As a means for removing it, for example, in addition to using a roll-shaped brush C as shown in FIG. 5, cleaning with a wiper or the like is generally used. In either case, a method is adopted in which the chips are completely removed without completely scraping off the protective film 13 on the surface.
その後、第６図で示すように、固定シー）１５から個々
のセラミック配線基板１１を分離し、これを脱バインダ
処理する。このとき、前記保護膜１３もバインダと共に
熱分解し、除去される。その後、セラミック配線基板ｌ
を焼成することによって、グリーンシート１４．１４・
・・が焼成されると共に、配線パ°ターン１２、・ ｌ
・°２・・・を形成する導電ペーストが焼き付けられ、
セラミック配線基板１１が完成する。Thereafter, as shown in FIG. 6, the individual ceramic wiring boards 11 are separated from the fixed sheet 15 and subjected to a binder removal process. At this time, the protective film 13 is also thermally decomposed and removed together with the binder. After that, the ceramic wiring board l
By firing the green sheet 14.14.
... are fired, and the wiring patterns 12, ... are fired.
・A conductive paste forming °2... is baked,
Ceramic wiring board 11 is completed.
［発明の効果］
以上説明した通り、この発明によれば、ダイシングソー
ａによるセラミック配線基板１１の裁断時に発生する切
り屑を゛除去する際に−゛°セラミック配線基板１１−
の表面に傷を付けることなく除去が可能であり、しかも
、このときセラミック配線基板１１の表面を保護する保
護１１１１３の除去も、その後脱バインダ処理と同時に
なされる。[Effects of the Invention] As described above, according to the present invention, when removing the chips generated when cutting the ceramic wiring board 11 with the dicing saw a,
can be removed without damaging the surface of the ceramic wiring board 11, and the protection 11113 that protects the surface of the ceramic wiring board 11 can be removed at the same time as the subsequent binder removal process.
従って、工程を増大させずに切り屑を容易に、かつ完全
に除去することができ、品質の向上と生産性の向上を図
ることが出来る。Therefore, chips can be easily and completely removed without increasing the number of steps, and quality and productivity can be improved.
第１図〜第６図は、この発明の実施例を示す多層セラミ
ック配線基板の積層から裁断完了までの工程概念図、第
７図〜第９図は、多層セラミック配線基板の積層から裁
断完了までの工程の従来例を示す概念図である。Figures 1 to 6 are conceptual diagrams of processes from lamination to completion of cutting of a multilayer ceramic wiring board showing an embodiment of the present invention, and Figures 7 to 9 are process conceptual diagrams from lamination to completion of cutting of a multilayer ceramic wiring board. FIG. 2 is a conceptual diagram showing a conventional example of the process.
Claims (1)
ーンシート１４、１４・・・により、多層配線基板１１
を形成し、これをダイシングソーａで裁断した後、前記
グリーンシート１４、１４・・・を脱バインダ処理する
方法に於て、配線パターン１２、１２・・・を印刷した
裁断前のセラミック配線基板１１の表面を、上記配線基
板１１の成形材料中のバインダの熱分解温度以下の温度
で熱分解する保護膜１３で覆い、該保護膜１３の上から
セラミック配線基板１１を裁断した後、同保護膜１３か
ら切り屑を除去し、その後前記セラミック配線基板を熱
処理炉に導入して、前記保護膜１３の熱分解温度以上の
温度で熱処理することを特徴とするセラミック配線基板
の裁断方法。The multilayer wiring board 11 is formed by green sheets 14, 14, etc. having wiring patterns 12, 12, ... printed on their surfaces.
is formed, cut by a dicing saw a, and then the green sheets 14, 14... are subjected to a binder removal process. 11 is covered with a protective film 13 that thermally decomposes at a temperature below the thermal decomposition temperature of the binder in the molding material of the wiring board 11, and after cutting the ceramic wiring board 11 from above the protective film 13, A method for cutting a ceramic wiring board, characterized in that chips are removed from the film 13, and then the ceramic wiring board is introduced into a heat treatment furnace and heat treated at a temperature higher than the thermal decomposition temperature of the protective film 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16304688A JPH0212894A (en) | 1988-06-30 | 1988-06-30 | Method of cutting ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16304688A JPH0212894A (en) | 1988-06-30 | 1988-06-30 | Method of cutting ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212894A true JPH0212894A (en) | 1990-01-17 |
Family
ID=15766150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16304688A Pending JPH0212894A (en) | 1988-06-30 | 1988-06-30 | Method of cutting ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212894A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0591772A1 (en) * | 1992-10-07 | 1994-04-13 | Fujitsu Limited | High-density/long-via laminated connector |
| US6261927B1 (en) * | 1999-04-30 | 2001-07-17 | International Business Machines Corporation | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| US6526958B1 (en) | 1991-06-26 | 2003-03-04 | Murata Manufacturing Co., Ltd. | Method of cutting ceramic green block |
| US6910473B1 (en) * | 1991-06-26 | 2005-06-28 | Murata Manufacturing Co. Ltd. | Method of cutting ceramic green block |
| CN108029192A (en) * | 2015-09-24 | 2018-05-11 | 吉佳蓝科技股份有限公司 | The flexible PCB and its manufacture method that bending durability is enhanced |
| CN110012618A (en) * | 2019-02-20 | 2019-07-12 | 深圳顺络电子股份有限公司 | A kind of processing method of laminated sheet type electronic component |
-
1988
- 1988-06-30 JP JP16304688A patent/JPH0212894A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6526958B1 (en) | 1991-06-26 | 2003-03-04 | Murata Manufacturing Co., Ltd. | Method of cutting ceramic green block |
| US6910473B1 (en) * | 1991-06-26 | 2005-06-28 | Murata Manufacturing Co. Ltd. | Method of cutting ceramic green block |
| EP0591772A1 (en) * | 1992-10-07 | 1994-04-13 | Fujitsu Limited | High-density/long-via laminated connector |
| US6261927B1 (en) * | 1999-04-30 | 2001-07-17 | International Business Machines Corporation | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| US6597058B1 (en) * | 1999-04-30 | 2003-07-22 | International Business Machines Corporation | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| CN108029192A (en) * | 2015-09-24 | 2018-05-11 | 吉佳蓝科技股份有限公司 | The flexible PCB and its manufacture method that bending durability is enhanced |
| CN108029192B (en) * | 2015-09-24 | 2020-05-08 | 吉佳蓝科技股份有限公司 | Flexible circuit board with improved bending durability and method of manufacturing the same |
| CN110012618A (en) * | 2019-02-20 | 2019-07-12 | 深圳顺络电子股份有限公司 | A kind of processing method of laminated sheet type electronic component |
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