JPH02125365U - - Google Patents

Info

Publication number
JPH02125365U
JPH02125365U JP3327789U JP3327789U JPH02125365U JP H02125365 U JPH02125365 U JP H02125365U JP 3327789 U JP3327789 U JP 3327789U JP 3327789 U JP3327789 U JP 3327789U JP H02125365 U JPH02125365 U JP H02125365U
Authority
JP
Japan
Prior art keywords
electronic components
pads
electrodes
substrate
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3327789U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3327789U priority Critical patent/JPH02125365U/ja
Publication of JPH02125365U publication Critical patent/JPH02125365U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】
第１図は本考案の面実装電子部品試験用プリン
ト基板の平面図、第２図は同基板にＱＦＰを搭載
した時の平面図である。 １……面実装電子試験用プリント基板、２……
くし形、３……くし形電極。
補正 平２．３．７ 図面の簡単な説明を次のように補正する。 明細書第８頁第１６行「２……くし形」を「２
……パツド」に訂正する。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板状に電子部品の電極や端子をはんだ付
    けできるパツドが形成されているとともに、該パ
    ツドに囲まれた部分にはくし形電極が形成されて
    いることを特徴とする面実装電子部品試験用プリ
    ント基板。
JP3327789U 1989-03-27 1989-03-27 Pending JPH02125365U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3327789U JPH02125365U (ja) 1989-03-27 1989-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3327789U JPH02125365U (ja) 1989-03-27 1989-03-27

Publications (1)

Publication Number Publication Date
JPH02125365U true JPH02125365U (ja) 1990-10-16

Family

ID=31536817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3327789U Pending JPH02125365U (ja) 1989-03-27 1989-03-27

Country Status (1)

Country Link
JP (1) JPH02125365U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622784U (ja) * 1985-06-21 1987-01-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622784U (ja) * 1985-06-21 1987-01-09

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