JPH02122634A - 樹脂封止型電子部品の製造方法 - Google Patents
樹脂封止型電子部品の製造方法Info
- Publication number
- JPH02122634A JPH02122634A JP27437288A JP27437288A JPH02122634A JP H02122634 A JPH02122634 A JP H02122634A JP 27437288 A JP27437288 A JP 27437288A JP 27437288 A JP27437288 A JP 27437288A JP H02122634 A JPH02122634 A JP H02122634A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resin
- mold
- main surface
- molding cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 102
- 229920005989 resin Polymers 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000465 moulding Methods 0.000 claims abstract description 61
- 238000007789 sealing Methods 0.000 claims abstract description 61
- 238000002347 injection Methods 0.000 claims abstract description 26
- 239000007924 injection Substances 0.000 claims abstract description 26
- 239000000565 sealant Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 14
- 239000012530 fluid Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 10
- 238000001721 transfer moulding Methods 0.000 description 7
- 239000011800 void material Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27437288A JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27437288A JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122634A true JPH02122634A (ja) | 1990-05-10 |
| JPH0514424B2 JPH0514424B2 (enrdf_load_stackoverflow) | 1993-02-25 |
Family
ID=17540740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27437288A Granted JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122634A (enrdf_load_stackoverflow) |
-
1988
- 1988-11-01 JP JP27437288A patent/JPH02122634A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514424B2 (enrdf_load_stackoverflow) | 1993-02-25 |
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