JPH02120866U - - Google Patents
Info
- Publication number
- JPH02120866U JPH02120866U JP2919589U JP2919589U JPH02120866U JP H02120866 U JPH02120866 U JP H02120866U JP 2919589 U JP2919589 U JP 2919589U JP 2919589 U JP2919589 U JP 2919589U JP H02120866 U JPH02120866 U JP H02120866U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- electrode
- pattern
- soldered
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2919589U JPH02120866U (zh) | 1989-03-15 | 1989-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2919589U JPH02120866U (zh) | 1989-03-15 | 1989-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120866U true JPH02120866U (zh) | 1990-09-28 |
Family
ID=31253195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2919589U Pending JPH02120866U (zh) | 1989-03-15 | 1989-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120866U (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305370A (ja) * | 2001-04-06 | 2002-10-18 | Sanken Electric Co Ltd | 回路基板、電子部品実装体及びその製造方法 |
| JP2008218644A (ja) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | 回路基板および電子部品付回路基板 |
| JP2011100987A (ja) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | 配線基板 |
| JP2017084902A (ja) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | 実装基板及び電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (ja) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | 難燃性ポリエステル組成物 |
-
1989
- 1989-03-15 JP JP2919589U patent/JPH02120866U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (ja) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | 難燃性ポリエステル組成物 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305370A (ja) * | 2001-04-06 | 2002-10-18 | Sanken Electric Co Ltd | 回路基板、電子部品実装体及びその製造方法 |
| JP2008218644A (ja) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | 回路基板および電子部品付回路基板 |
| JP2011100987A (ja) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | 配線基板 |
| JP2017084902A (ja) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | 実装基板及び電子装置 |