JPH02117795A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH02117795A JPH02117795A JP26992588A JP26992588A JPH02117795A JP H02117795 A JPH02117795 A JP H02117795A JP 26992588 A JP26992588 A JP 26992588A JP 26992588 A JP26992588 A JP 26992588A JP H02117795 A JPH02117795 A JP H02117795A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- flux
- dyestuff
- reflow
- organic substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 20
- 239000006071 cream Substances 0.000 title claims abstract description 18
- 230000008018 melting Effects 0.000 claims abstract 2
- 238000002844 melting Methods 0.000 claims abstract 2
- 239000000975 dye Substances 0.000 abstract description 17
- 230000004907 flux Effects 0.000 abstract description 13
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 230000000007 visual effect Effects 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 229940043267 rhodamine b Drugs 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はコンピュータ等の情報機器や、ビデオ・オーデ
ィオ機器の半導体集積回路およびチップ部品の実装に用
いられるクリーム半田に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to cream solder used for mounting semiconductor integrated circuits and chip components of information equipment such as computers and video/audio equipment.
従来の技術
プリント基板の上にクリーム半田をスクリーン印刷をし
たり、デイスペンサーで塗布し、その上に半導体集積回
路またはチップ部品をのせ、赤外線等のりフロー炉に入
れ、クリーム半田を溶融し。Conventional technology Cream solder is screen printed on a printed circuit board or applied with a dispenser, a semiconductor integrated circuit or chip component is placed on top of it, and the cream solder is melted in an infrared glue flow furnace.
プリント基板の銅箔と半導体集積回路やチップ部品とを
電気的に接続する。この後、フロン液で残留しているフ
ラックスを除去するようにした従来のクリーム半田はＳ
ｎ：Ｐｂの重量比が６３：３７の共晶半田であり、これ
にフラックスと溶剤とクリーム性を出すための粘結剤が
被合されている。Electrically connects the copper foil of a printed circuit board to a semiconductor integrated circuit or chip component. After this, the conventional cream solder that removes the remaining flux with a fluorocarbon solution is S
This is a eutectic solder with a n:Pb weight ratio of 63:37, to which flux, a solvent, and a binder for creaminess are combined.
発明が解決しようとする課題
しかし、上述した従来のクリーム半田においてＨＩＪフ
ロー後、フロン液でフラックスを除去しても、それが不
十分であると７ラツクスがプリント基板上に残り、フラ
ックスに含有している塩素イオンが半導体集積回路（以
下ＩＣと呼ぶ）に浸透し、ＩＣの外部電極であるアルミ
パッドを腐食させ、ＩＣの動作不良を起こす問題がある
。Problems to be Solved by the Invention However, in the conventional cream solder described above, even if the flux is removed with a fluorocarbon solution after HIJ flow, if the removal is insufficient, 7 lux will remain on the printed circuit board and the flux will remain. There is a problem in that the chlorine ions infiltrate the semiconductor integrated circuit (hereinafter referred to as IC) and corrode the aluminum pads that are the external electrodes of the IC, causing malfunction of the IC.
本発明は上記問題を解決するため、フラックスの除去状
態を簡単に目視判別する方法等を用いることができるよ
うＫしたクリーム半田を提供することを目的とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a cream solder that can be used to easily visually determine the state of flux removal.
課題を解決するための手段
本発明はクリーム半田に、リフローの温度が加わっても
変質しない有機物染料を微量添加するようにしたもので
ある。Means for Solving the Problems According to the present invention, a trace amount of an organic dye that does not deteriorate even when subjected to reflow temperature is added to cream solder.
作用
クリーム半田に添加した有機物染料がリフロー時、フラ
ックスとともに拡がり、クリーム半田は融ける。これに
用いる染料はりフロー時の加熱温度（２３０°Ｃ前後）
でも分解や他の化合物にもならない安定なものである。Function The organic dye added to cream solder spreads with flux during reflow, and the cream solder melts. Heating temperature during dye beam flow used for this (around 230°C)
However, it is stable and does not decompose or turn into other compounds.
フロン洗浄で残ったフラックスには、この染料が分散し
ているため、この染料の有無を調べると７ラツクヌの残
置が判別できる。This dye is dispersed in the flux left over from Freon cleaning, so by examining the presence or absence of this dye, it is possible to determine whether 7 Ratsukunu remains.
実施例
以下に本発明の実施例について説明する。まずクリーム
半田に重量比で２％以下の有機物染料を添加する。これ
にはローダミンＢ系やアゾ系、アントラキノン系があり
、これらはりフローの温度でも分解されず、他の化合物
にもならない安定な染料である。こｈらの染料の添加量
は２％以下が良く、これより多く入れると半田の濡れ性
や、半田付は性を悪くするため、これ以上多く添加する
のは好ましくない。Examples Examples of the present invention will be described below. First, an organic dye of 2% or less by weight is added to cream solder. These include rhodamine B, azo, and anthraquinone dyes, which are stable dyes that do not decompose even at beam flow temperatures and do not turn into other compounds. The amount of these dyes to be added is preferably 2% or less; if more than this is added, the solder wettability and soldering properties will be deteriorated, so it is not preferable to add more than this.
このクリーム半田をプリント基板の銅箔パターンの所定
の位置にヌクリーン印刷またはディヌベンサーで塗布し
、次にこの上にＩＣやチップ部品をのせ、赤外線やベー
パリフロー炉に入れる。この時の温度は２３０°Ｃ前後
であり、クリーム半田は溶けＩＣリードやチップ部品の
電極と銅箔パターンとを接続する。This cream solder is applied to predetermined positions on the copper foil pattern of the printed circuit board using Nuclean printing or Dinubensor, and then ICs and chip components are placed on top of this and placed in an infrared or vapor reflow oven. The temperature at this time is around 230°C, and the cream solder melts and connects the IC lead or the electrode of the chip component to the copper foil pattern.
この後フラックス除去のためフロン溶剤により、プリン
ト基板をデイツプやヌプレー、あるいは超音波洗浄を行
ない１次にフラックヌ装置の確認を染料の色具合で行な
う。これには目視又は顕微鏡下で行なう。Thereafter, the printed circuit board is dip-dipped, sprayed, or ultrasonically cleaned using a fluorocarbon solvent to remove the flux, and the flux-nulling device is first checked by checking the color of the dye. This can be done visually or under a microscope.
なおその検出が困難性をともなう場合忙は、紫外線を照
射することにより、その判別を容易にすることができる
。In cases where detection is difficult, irradiation with ultraviolet rays can make the discrimination easier.
発明の効果
本発明によればクリーム半田に染料を入れておくととＫ
より、リフロー後のフロン洗浄によるフラックス残置量
が、これに分散している染料の量に比例して色が出るた
め、目視や顕微鏡下でのチエツクで判別でき、その精度
も高い。Effects of the Invention According to the present invention, if dye is added to the cream solder, K
Therefore, the amount of flux remaining after reflow cleaning after reflowing produces a color in proportion to the amount of dye dispersed in it, so it can be determined visually or by checking under a microscope, with high accuracy.
Claims (1)
たクリーム半田。Cream solder containing an organic dye that does not lose its color before and after melting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26992588A JPH02117795A (en) | 1988-10-26 | 1988-10-26 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26992588A JPH02117795A (en) | 1988-10-26 | 1988-10-26 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02117795A true JPH02117795A (en) | 1990-05-02 |
Family
ID=17479112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26992588A Pending JPH02117795A (en) | 1988-10-26 | 1988-10-26 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02117795A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103706966A (en) * | 2013-12-11 | 2014-04-09 | 河南超威电源有限公司 | Soldering flux of busbar of lead-acid storage battery |
| JP2017064730A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition for non-cleaned solder paste and no-clean solder paste, and flux scattering evaluation method of solder paste |
-
1988
- 1988-10-26 JP JP26992588A patent/JPH02117795A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103706966A (en) * | 2013-12-11 | 2014-04-09 | 河南超威电源有限公司 | Soldering flux of busbar of lead-acid storage battery |
| JP2017064730A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition for non-cleaned solder paste and no-clean solder paste, and flux scattering evaluation method of solder paste |
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