JP2606610B2 - Solder paste, connection method and connection structure of semiconductor device - Google Patents
Solder paste, connection method and connection structure of semiconductor deviceInfo
- Publication number
- JP2606610B2 JP2606610B2 JP6317160A JP31716094A JP2606610B2 JP 2606610 B2 JP2606610 B2 JP 2606610B2 JP 6317160 A JP6317160 A JP 6317160A JP 31716094 A JP31716094 A JP 31716094A JP 2606610 B2 JP2606610 B2 JP 2606610B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- resin
- solder paste
- added
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明はソルダーペースト、特
に、はんだ接合後の洗浄が不用であるファインパターン
用ソルダーペーストに関する。さらに、本発明ははんだ
接合後の洗浄が不用である半導体装置の接続方法および
接続構造に関する。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste, and more particularly to a solder paste for fine patterns which does not require cleaning after soldering. Furthermore, the present invention
Method for connecting semiconductor device that does not require cleaning after bonding
Regarding the connection structure.
【0002】[0002]
【従来の技術】従来のソルダーペーストは、はんだ合金
の粉末100重量部に対し5〜20重量部の液状の熱硬
化性樹脂オリゴマーまたは液状の熱可塑性樹脂と5重量
部以下のアミンの塩酸塩、イミダゾール、カルボン酸、
および燐酸から選ばれる少なくとも一種以上の化合物と
を混練してなる。(例えば、特開平2−80194号公
報参照)。2. Description of the Related Art A conventional solder paste is prepared by adding 5 to 20 parts by weight of a liquid thermosetting resin oligomer or a liquid thermoplastic resin to 5 parts by weight or less of an amine hydrochloride, based on 100 parts by weight of a solder alloy powder. Imidazole, carboxylic acid,
And at least one compound selected from phosphoric acid. (See, for example, JP-A-2-80194).
【0003】はんだ合金は通常200メッシュ前後の球
状のものが用いられ、活性剤としてはアミンの塩酸塩、
イミダゾール、カルボン酸、燐酸、ZnCl2 ・NH4
Cl等が好ましく、ベーストの粘度調整剤として水素添
加ヒマシ油、有機べントナイトなどのチキソ剤も加えら
れる。 従来例1 エピコート828(エポキシ) 10 部 イミダゾール塩酸塩 0.3部 はんだ粉末(300メッシュ以下) 87.7部 硬化ヒマシ油 1 部 従来例2 アデカレジンEP−600(ポリオール) 10 部 モノメチルアミン塩酸塩 0.5部 はんだ粉末(300メッシュ以下) 89.5部 硬化ヒマシ油 1 部 従来例3 日立ポリセットレジンPS−51(ポリエステル) 10 部 ZNCl2 ・NH4 Cl 1 部 はんだ粉末 88 部 硬化ヒマシ油(300メッシュ以下) 1 部 以上2例のクリームはんだを製作し、シルクスクリーン
印刷を行なうと8時間以上の大気露出によっても粘度が
変化せず良好な印刷性を維持できたと報告されている。[0003] A solder alloy is usually used in the form of a sphere having a mesh size of about 200 mesh.
Imidazole, carboxylic acid, phosphoric acid, ZnCl 2 · NH 4
Cl or the like is preferable, and a thixotropic agent such as hydrogenated castor oil or organic bentonite is also added as a base viscosity modifier. Conventional Example 1 Epicoat 828 (epoxy) 10 parts Imidazole hydrochloride 0.3 part Solder powder (300 mesh or less) 87.7 parts Hardened castor oil 1 part Conventional Example 2 Adekalesin EP-600 (polyol) 10 parts Monomethylamine hydrochloride 0 5.5 parts Solder powder (300 mesh or less) 89.5 parts Hardened castor oil 1 part Conventional example 3 Hitachi polyset resin PS-51 (polyester) 10 parts ZNCl 2 · NH 4 Cl 1 part Solder powder 88 parts Hardened castor oil ( It is reported that when the cream solder of the above two examples was manufactured and silk screen printing was performed, the viscosity did not change even after exposure to the atmosphere for 8 hours or more, and good printability was maintained.
【0004】クリームはんだにカプリル酸を配合する
と、ファインパターンに適用できるものが得られる。
(例えば、特開平3−151189号公報参照) 0.5mmピッチのパッドパターンに対しては洗浄不用
のものが、0.3mmピッチのパッドパターンに対して
は洗浄後の活性剤残渣が少ないものがある。 従来例4 (洗浄不用,ハロゲン系活性剤不用,0.5mmピッチ) Sn63−Pb37 90.0% 重合ロジン 5.0% ブチルカルビートル 3.4% カプリル酸 1.3% ヒマシ油 0.3% 従来例5 (洗浄必要,ハロゲン系活性剤必要,0.3mmピッチ) Sn63−Pb37(粒径20μm以下) 90.0% 重合ロジン 5.0% ブチルカルビートル 1.5% カプリル酸 3.0% ヒマシ油 0.3% 塩酸ジエチルアミン 0.2% はんだ接合後、印刷配線基板上にソルダーペースト中の
活性剤,ロジン等の残渣があると、印刷配線基板の導電
性パターンの腐食,リード間のマイグレーションや、フ
リップチップ型のベアチップ実装ではベアチップ側のア
ルミパッド,配線の腐食が発生する。従来使用されてい
る松ヤニ(いわゆるロジン)は、それ自身に活性剤であ
るカルボン酸(カルボキシル基)を含有してる。[0004] When caprylic acid is blended with a cream solder, one that can be applied to a fine pattern is obtained.
(See, for example, Japanese Patent Application Laid-Open No. 3-151189.) A pad pattern of 0.5 mm pitch does not require cleaning, and a pad pattern of 0.3 mm pitch has a small amount of activator residue after cleaning. is there. Conventional Example 4 (No need for cleaning, no use of halogen-based activator, 0.5 mm pitch) Sn63-Pb37 90.0% Polymerized rosin 5.0% Butyl carb beetle 3.4% Caprylic acid 1.3% Castor oil 0.3% Conventional Example 5 (Washing required, halogen-based activator required, 0.3 mm pitch) Sn63-Pb37 (particle size: 20 μm or less) 90.0% Polymerized rosin 5.0% Butylcarbitol 1.5% Caprylic acid 3.0% Castor oil 0.3% Diethylamine hydrochloride 0.2% After soldering, if there are residues such as activator and rosin in the solder paste on the printed wiring board, corrosion of the conductive pattern of the printed wiring board and migration between leads Also, in flip chip type bare chip mounting, corrosion of aluminum pads and wiring on the bare chip side occurs. The conventionally used pine tar (so-called rosin) itself contains a carboxylic acid (carboxyl group) as an activator.
【0005】図4はロジンの代表的なアビエチン酸の構
造を示す図である。ここに示されたカルボン酸は、はん
だ付け後でも消失せずロジン中に存在しているため、ロ
ジンの洗浄処理が必要となる。FIG. 4 is a diagram showing a structure of a typical abietic acid of rosin. Since the carboxylic acid shown here does not disappear even after soldering and is present in the rosin, the rosin needs to be washed.
【0006】現在,0.3mm程度のファインなパッド
ピッチのパターンに使用できるソルダーペーストの要求
があり、これに応えるためには20μm以下の粉末はん
だを使用する必要があるが、はんだ粉末が微細になると
共に表面積は増大し、酸素量も表面積に比例して増加し
て、リフロー時に未溶解やハンダボール(絶縁テストで
短絡してしまう)が発生しやすくなる。従来例5にて
0.3mm程度のファインなパッドピッチのパターンに
使用できると報告されているソルダーペーストには活性
剤を必要としている。At present, there is a demand for a solder paste which can be used for a pattern having a fine pad pitch of about 0.3 mm. In order to meet this demand, it is necessary to use a powder solder of 20 μm or less. As the surface area increases, the amount of oxygen increases in proportion to the surface area, and unresolved or solder balls (short-circuited in the insulation test) easily occur during reflow. Activator is required for the solder paste which is reported in Conventional Example 5 to be usable for a fine pad pitch pattern of about 0.3 mm.
【0007】[0007]
【発明が解決しようとする課題】従来のソルダーペース
トは、ファインパターンのはんだ接合において、活性剤
が添加(または含有)されているので、はんだ接合後に
残渣を完全に洗浄しなけばならない(洗浄困難)という
欠点があった。In a conventional solder paste, an activator is added (or contained) in a solder joint of a fine pattern, so that the residue must be completely washed after the solder joint (difficult to wash). ).
【0008】[0008]
【課題を解決するための手段】本発明のソルダーペース
トは、粉末状はんだ、樹脂および溶剤を含有するソルダ
ーペーストにおいて、前記樹脂がカルボン酸付加熱硬化
性樹脂であり、硬化剤が添加されたものである。 また、
本発明の半導体装置の接続方法は、半導体装置を、粉末
状はんだ、カルボン酸付加熱硬化性樹脂および溶剤を含
有し硬化剤が添加されたソルダーペーストを用いて基板
に接続する方法であって、半導体装置上に形成されたバ
ンプと基板上に形成された実装用パッドとを前記ソルダ
ーペーストを介して接合し、加熱することによって前記
樹脂を硬化するものである。また、本発明の半導体装置
の接続構造は、半導体装置が、粉末状はんだ、カルボン
酸付加熱硬化性樹脂および溶剤を含有し硬化剤が添加さ
れたソルダーペーストを用いて基板に接続された構造で
あって、半導体装置上に形成されたバンプと基板上に形
成された実装用パッドとがはんだを介して接合され、該
はんだの周囲が硬化された樹脂で取り囲まれるものであ
る。 Means for Solving the Problems] solder paste of the present invention, powdery solder, the solder paste containing a resin and a solvent, wherein the resin is a thermosetting resin with a carboxylic acid, which curing agent is added It is. Also,
The method for connecting a semiconductor device according to the present invention includes the steps of:
Solder, carboxylic acid-added thermosetting resin and solvent
Substrate using solder paste with hardener added
A method for connecting to a semiconductor device.
The solder and the mounting pad formed on the substrate
-Joined via paste and heated
It cures the resin. Further, the connection structure of the semiconductor device according to the present invention is such that the semiconductor device is formed of a powdery solder,
Contains an acid-added thermosetting resin and a solvent and a curing agent added.
Connected to the board using the solder paste
The bumps formed on the semiconductor device and the
The mounting pads thus formed are joined via solder.
The solder is surrounded by the cured resin.
You.
【0009】[0009]
【作用】カルボン酸付加熱硬化性樹脂は、カルボン酸が
はんだ付け面の酸化被膜を除去する働きがあり、はんだ
付け後にこの樹脂を硬化させる場合カルボン酸が硬化反
応に寄与し、カルボン酸は消失し、安定した樹脂硬化物
だけが残り、さらにこの樹脂硬化物がはんだ接合部の周
囲を取り囲むので、接合部分が機械的に強固な構造にな
る。The carboxylic acid-added thermosetting resin has a function of removing the oxide film on the soldering surface by the carboxylic acid. When the resin is cured after soldering, the carboxylic acid contributes to the curing reaction and the carboxylic acid disappears. However, only a stable resin cured product remains, and further, this resin cured material surrounds the periphery of the solder joint, so that the joint has a mechanically strong structure.
【0010】[0010]
【実施例】以下、本発明を詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
【0011】図1はカルボン酸付加熱硬化性樹脂が、銅
の酸化被膜を除去する場合の化学反応を示す図である。FIG. 1 is a diagram showing a chemical reaction when a carboxylic acid-added thermosetting resin removes an oxide film of copper.
【0012】図2はカルボン酸付加熱硬化性樹脂中のカ
ルボン酸が消失する化学反応を示す図である。 実施例1 In52−Sn48(融点117℃,粒径20μm以
下) 90.0% ビキシレノールジグリシジルエーテル 7.5% ヒマシ油 1.0% ブチルカルビートル 1.0% 硬化触媒(130℃以上で作用) 0.5% 図3は本発明の一使用例を示す断面図であ
る。上記重量配合率でカルボン酸付加熱硬化性樹脂と溶
剤と硬化剤とを混練りしたソルダーペーストを用いて、
フリップチップ型のLSIチップ1の金バンプ2とプリ
ント基板6の基板パッド5(接続パッドピッチ120μ
m)とを接合(リフロー温度130℃)し、その後15
0℃で1時間の樹脂硬化を行った。はんだ3の周囲はエ
ポキシ樹脂4で取り囲まれており、洗浄処理をせずに表
面のイオン残渣をイオノグラフで測定したところ、はん
だ接合前のイオン残渣と同等の結果が得られ、印刷特
性,電気特性とも良好であった。 実施例2 Sn63−Pb37(粒径20μm以下,表面に酸化防止処理) 90.0% THPA付加クレゾールノボラックアクリレート 7.5% 硬化ヒマシ油 1.0% ブチルカルビトール 1.0% ジシアンジアミド 0.5% 実施例3 Sn96.5−Ag3.5 91.0% THPA付加クレゾールノボラックアクリレート 6.0% 水素添加ヒマシ油 1.0% エチル・セルローズ 1.5% 硬化触媒 0.5% これらの構成においても実施例1と同様の良好な結果を
得た。FIG. 2 is a diagram showing a chemical reaction in which the carboxylic acid in the carboxylic acid-added thermosetting resin disappears. Example 1 In52-Sn48 (melting point: 117 ° C., particle size: 20 μm or less) 90.0% Bixylenol diglycidyl ether 7.5% Castor oil 1.0% Butyl carbitol 1.0% Curing catalyst (acts at 130 ° C. or higher) FIG. 3 is a sectional view showing an example of use of the present invention. Using a solder paste obtained by kneading a carboxylic acid-added thermosetting resin, a solvent, and a curing agent at the weight ratio described above,
The gold bumps 2 of the flip chip type LSI chip 1 and the substrate pads 5 of the printed circuit board 6 (connection pad pitch 120 μm)
m) (reflow temperature 130 ° C.) and then 15
The resin was cured at 0 ° C. for 1 hour. The periphery of the solder 3 is surrounded by the epoxy resin 4. When the ion residue on the surface was measured by ionography without cleaning, the same result as the ion residue before solder joining was obtained. Both were good. Example 2 Sn63-Pb37 (particle size: 20 μm or less, antioxidant treatment on the surface) 90.0% Cresol novolak acrylate with THPA 7.5% Hardened castor oil 1.0% Butyl carbitol 1.0% Dicyandiamide 0.5% Example 3 Sn96.5-Ag3.5 91.0% THPA-added cresol novolak acrylate 6.0% Hydrogenated castor oil 1.0% Ethyl cellulose 1.5% Curing catalyst 0.5% Also implemented in these configurations The same good results as in Example 1 were obtained.
【0013】[0013]
【発明の効果】本発明のソルダーペーストは、カルボン
酸付加熱硬化性樹脂中のカルボン酸により、はんだ付け
面の酸化被膜を除去し、はんだ付け後にこの樹脂を硬化
することによりカルボン酸を消失させ安定した樹脂硬化
物だけを残すので、ファインパターンのはんだ接合にお
いて、洗浄工程を省略できるという効果がある。According to the solder paste of the present invention, the carboxylic acid in the carboxylic acid-added thermosetting resin is used to remove the oxide film on the soldered surface and to cure the resin after soldering to eliminate the carboxylic acid. Since only a stable resin cured product is left, there is an effect that a washing step can be omitted in soldering a fine pattern.
【図1】カルボン酸付加熱硬化性樹脂が、銅の酸化被膜
を除去する場合の化学反応を示す図である。FIG. 1 is a diagram showing a chemical reaction when a carboxylic acid-added thermosetting resin removes an oxide film of copper.
【図2】カルボン酸付加熱硬化性樹脂中のカルボン酸が
消失する化学反応を示す図である。FIG. 2 is a diagram showing a chemical reaction in which a carboxylic acid in a carboxylic acid-added thermosetting resin disappears.
【図3】本発明の一使用例を示す断面図である。FIG. 3 is a sectional view showing an example of use of the present invention.
【図4】ロヂンの代表的なアビエチン酸の構造を示す図
である。FIG. 4 is a view showing a structure of a typical abietic acid of pine.
1 LSIチップ 2 金バンプ 3 はんだ 4 エポキシ樹脂 5 基板パッド 6 プリント基板 Reference Signs List 1 LSI chip 2 Gold bump 3 Solder 4 Epoxy resin 5 Board pad 6 Printed board
Claims (7)
るソルダーペーストにおいて、前記樹脂がカルボン酸付
加熱硬化性樹脂であり、硬化剤を添加したことを特徴と
するソルダーペースト。1. A solder paste containing a powdery solder, a resin and a solvent, wherein the resin is a carboxylic acid-added thermosetting resin and a curing agent is added.
るソルダーペーストにおいて、前記樹脂がカルボン酸付
加熱硬化性樹脂であり、前記粉末状はんだの表面に酸化
防止処理が施されており、硬化剤を添加したことを特徴
とするソルダーペースト。2. A solder paste containing a powdery solder, a resin and a solvent, wherein the resin is provided with a carboxylic acid.
A solder paste , which is a thermosetting resin, the surface of the powdery solder is subjected to an antioxidant treatment, and a curing agent is added .
ボン酸付加変成エポキシ樹脂である請求項1または2記
載のソルダーペースト。3. The method according to claim 1, wherein the carboxylic acid-added thermosetting resin is
3. The modified epoxy resin according to claim 1, wherein the modified epoxy resin is a boronic acid addition modified epoxy resin.
The above solder paste.
温度を、前記粉末状はんだの融点より高くした請求項1
または2記載のソルダーペースト。Wherein curing of the heat curable resin with the carboxylic acids
2. The method according to claim 1 , wherein the temperature is higher than a melting point of the powdery solder.
Or the solder paste according to 2 .
酸付加熱硬化性樹脂および溶剤を含有し硬化剤が添加さ
れたソルダーペーストを用いて基板に接続する方法であ
って、 半導体装置上に形成されたバンプと基板上に形成された
実装用パッドとを前記ソルダーペーストを介して接合
し、加熱することによって前記樹脂を硬化することを特
徴とする半導体装置の接続方法。 5. The method according to claim 1, wherein the semiconductor device is formed of a powdery solder,
Contains an acid-added thermosetting resin and a solvent and a curing agent added.
Using a solder paste
The bumps formed on the semiconductor device and the bumps formed on the substrate
Bonding to the mounting pad via the solder paste
And curing the resin by heating.
A method for connecting semiconductor devices.
酸付加熱硬化性樹脂および溶剤を含有し硬化剤が添加さContains an acid-added thermosetting resin and a solvent and a curing agent added.
れたソルダーペーストを用いて基板に接続された構造でConnected to the board using the solder paste
あって、So, 半導体装置上に形成されたバンプと基板上に形成されたBump formed on semiconductor device and formed on substrate
実装用パッドとがはんだを介して接合され、該はんだのThe mounting pads are joined via solder and the solder
周囲が硬化された樹脂で取り囲まれることを特徴とするCharacterized by being surrounded by hardened resin
半導体装置の接続構造。Connection structure of semiconductor device.
ボン酸付加変成エポキシ樹脂であり、A modified boronic acid epoxy resin, 前記はんだの周囲を取り囲む前記樹脂は、エポキシ樹脂The resin surrounding the periphery of the solder is an epoxy resin
であることを特徴とする請求項6記載の半導体装置の接7. The connection of a semiconductor device according to claim 6, wherein
続構造。Connection structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6317160A JP2606610B2 (en) | 1994-12-20 | 1994-12-20 | Solder paste, connection method and connection structure of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6317160A JP2606610B2 (en) | 1994-12-20 | 1994-12-20 | Solder paste, connection method and connection structure of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08174264A JPH08174264A (en) | 1996-07-09 |
JP2606610B2 true JP2606610B2 (en) | 1997-05-07 |
Family
ID=18085128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6317160A Expired - Fee Related JP2606610B2 (en) | 1994-12-20 | 1994-12-20 | Solder paste, connection method and connection structure of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2606610B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009110992A (en) * | 2007-10-26 | 2009-05-21 | Panasonic Corp | Part built-in printed wiring board, and manufacturing method of part built-in printed wiring board |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10200241A (en) * | 1997-01-06 | 1998-07-31 | Fujitsu Ltd | Conductive adhesive and method of mounting components, using the same |
TW527253B (en) * | 1999-10-05 | 2003-04-11 | Tdk Corp | Soldering flux, soldering paste and soldering process |
JP3397313B2 (en) * | 1999-12-20 | 2003-04-14 | 富士通株式会社 | Semiconductor device manufacturing method and electronic component mounting method |
JP2004103928A (en) * | 2002-09-11 | 2004-04-02 | Fujitsu Ltd | Substrate, forming method of solder ball, and mounting structure thereof |
WO2006030665A1 (en) * | 2004-09-13 | 2006-03-23 | Matsushita Electric Industrial Co., Ltd. | Solder paste and electronic device using same |
CN101232967B (en) * | 2005-08-11 | 2010-12-08 | 千住金属工业株式会社 | Lead free solder paste used for electronic component, soldering method and the electronic component |
JP4522939B2 (en) * | 2005-10-31 | 2010-08-11 | アルプス電気株式会社 | Bonding structure between substrate and component and manufacturing method thereof |
JP4905338B2 (en) * | 2007-12-10 | 2012-03-28 | パナソニック株式会社 | Manufacturing method of printed circuit board with built-in components |
JP5410397B2 (en) * | 2010-10-29 | 2014-02-05 | シャープ株式会社 | Manufacturing method of semiconductor device, manufacturing method of back electrode type solar cell with wiring substrate, manufacturing method of solar cell module, semiconductor device, back electrode type solar cell with wiring substrate and solar cell module |
MX2016008650A (en) * | 2013-12-31 | 2017-03-03 | Alpha Metals | Rosin-free thermosetting flux formulations. |
US11833622B2 (en) | 2018-08-10 | 2023-12-05 | Koki Company Limited | Flux and solder paste |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4298407A (en) * | 1980-08-04 | 1981-11-03 | E. I. Du Pont De Nemours And Company | Flux treated solder powder composition |
US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
JP2564152B2 (en) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | Solder paste |
JPH04237590A (en) * | 1991-01-22 | 1992-08-26 | Matsushita Electric Ind Co Ltd | Cream solder and production thereof and soldering material |
JPH05337679A (en) * | 1992-06-04 | 1993-12-21 | Matsushita Electric Ind Co Ltd | Solder powder for cream solder and its production |
-
1994
- 1994-12-20 JP JP6317160A patent/JP2606610B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009110992A (en) * | 2007-10-26 | 2009-05-21 | Panasonic Corp | Part built-in printed wiring board, and manufacturing method of part built-in printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPH08174264A (en) | 1996-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5953814A (en) | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | |
JP2662190B2 (en) | Electronic element assembly and rework method | |
JP3866591B2 (en) | Method for forming interelectrode connection structure and interelectrode connection structure | |
US7743966B2 (en) | Soldering flux and method for bonding semiconductor element | |
JP2606610B2 (en) | Solder paste, connection method and connection structure of semiconductor device | |
JPH04280443A (en) | Interconnection of electric parts on substrate | |
JP2002118209A (en) | Method for mounting semiconductor device and mounting structure | |
JPH04262890A (en) | Flux agent and adhesive containing metal particle | |
KR20050105499A (en) | Area-array device assembly with pre-applied underfill layers on printed wiring board | |
JPH08227613A (en) | Conductive material and usage thereof | |
JP2004523893A (en) | Flux and underfill material for wafer coating, and laminated electronic assembly manufactured using the same | |
WO2004059721A1 (en) | Electronic component unit | |
JP3644340B2 (en) | Epoxy resin composition | |
JP2004179552A (en) | Mounting structure and mounting method for semiconductor device, and reworking method | |
KR20040082956A (en) | Junction structure of conductive projection and junction method thereof | |
KR100612805B1 (en) | Epoxy Resin Composition | |
PL181590B1 (en) | System for and method of producing current-carrying connecting structures and method of making circuits and printed circuits | |
JP2004153113A (en) | Circuit wiring board, manufacturing method thereof, and sealing resin composition | |
JP4218181B2 (en) | Solder bonding method | |
JPH02234447A (en) | Method of connection semiconductor integrated circuit element | |
JP3893100B2 (en) | Electronic component mounting method on wiring board | |
JP4314718B2 (en) | Curable flux | |
Johnson et al. | Reflow-curable polymer fluxes for flip chip encapsulation | |
JPH11320176A (en) | Solder paste | |
KR20100067702A (en) | Fabricating method for solder ball having adhesion coating layer and the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19961217 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080213 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090213 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090213 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100213 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110213 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110213 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120213 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120213 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130213 Year of fee payment: 16 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140213 Year of fee payment: 17 |
|
LAPS | Cancellation because of no payment of annual fees |