JPH02116790U - - Google Patents
Info
- Publication number
- JPH02116790U JPH02116790U JP2505989U JP2505989U JPH02116790U JP H02116790 U JPH02116790 U JP H02116790U JP 2505989 U JP2505989 U JP 2505989U JP 2505989 U JP2505989 U JP 2505989U JP H02116790 U JPH02116790 U JP H02116790U
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- circuit board
- sub
- notch
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 12
- 238000007598 dipping method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2505989U JPH02116790U (en, 2012) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2505989U JPH02116790U (en, 2012) | 1989-03-03 | 1989-03-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02116790U true JPH02116790U (en, 2012) | 1990-09-19 |
Family
ID=31245454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2505989U Pending JPH02116790U (en, 2012) | 1989-03-03 | 1989-03-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02116790U (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017195307A (ja) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | 基板ユニット |
-
1989
- 1989-03-03 JP JP2505989U patent/JPH02116790U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017195307A (ja) * | 2016-04-21 | 2017-10-26 | 株式会社東海理化電機製作所 | 基板ユニット |