JPH02116558A - Edge face type thermal head - Google Patents
Edge face type thermal headInfo
- Publication number
- JPH02116558A JPH02116558A JP26906288A JP26906288A JPH02116558A JP H02116558 A JPH02116558 A JP H02116558A JP 26906288 A JP26906288 A JP 26906288A JP 26906288 A JP26906288 A JP 26906288A JP H02116558 A JPH02116558 A JP H02116558A
- Authority
- JP
- Japan
- Prior art keywords
- edge face
- thermal resistant
- layer
- resistant layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000001259 photo etching Methods 0.000 abstract description 2
- 230000008021 deposition Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は感熱式や熱転写式のプリンターやファクシミリ
に使用する端面型サーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an end-face type thermal head used in a thermal type or thermal transfer type printer or facsimile.
従来のサーマルヘッドとしては、絶縁基板上に発熱抵抗
層、給電用電極層、及び耐摩耗層を順次積層し、給電用
電極層の個別電極層と共通電極層との間の発=ti抗層
部分を記録部としているものである。In a conventional thermal head, a heating resistance layer, a power supply electrode layer, and a wear-resistant layer are sequentially laminated on an insulating substrate, and a heat-generating resistance layer is formed between the individual electrode layer of the power supply electrode layer and the common electrode layer. This section is used as a recording section.
しかしながら、上記のものは前記発熱抵抗層が基板上に
薄膜で作製されているため、耐久性を維持するためにガ
ラス質等の耐摩耗層をコーティングしなければならず、
複雑な製造工程に加え、ヘッドの暑熱が多く印字速度を
上げられないという欠点があった。However, in the above method, the heating resistance layer is formed as a thin film on the substrate, so it must be coated with a wear-resistant layer such as glass to maintain durability.
In addition to the complicated manufacturing process, there was a drawback that the print head was extremely hot, making it impossible to increase printing speed.
本発明は上記点に迄みてなされたもので、安価で高速、
高品位印字を可能にした端面型サーマルヘッドを提供す
ることを目的とする。The present invention has been made in view of the above points, and is inexpensive, high-speed,
The purpose of the present invention is to provide an edge-type thermal head that enables high-quality printing.
本発明の端面型サーマルヘッドの構成は、ヘッド基板上
に複数本の発熱抵抗層と、これらの発熱抵抗層に個別に
接続する複数本の給電用個別電極層と、前記複数の発熱
抵抗層に接続する共通電極層とを設け、前記ヘッド基板
の端面と面一をなす前記発熱抵抗層の露出先端面を記録
部とするものである。The configuration of the end face type thermal head of the present invention includes a plurality of heat generating resistor layers on a head substrate, a plurality of individual electrode layers for power feeding that are individually connected to these heat generating resistor layers, and a plurality of individual power feeding electrode layers connected to the plurality of heat generating resistor layers. A connecting common electrode layer is provided, and the exposed end surface of the heating resistor layer flush with the end surface of the head substrate serves as a recording section.
そして、前記ヘッド基板を前記発熱抵抗層の硬さと同等
もしくはそれよりも低いセラミックで形成するのが好ま
しい。Preferably, the head substrate is made of ceramic having a hardness equal to or lower than that of the heating resistance layer.
発熱抵抗層の記録部先端面が露出しているため、発熱抵
抗層の記録部の暑熱が少なく、高速印字が行える。また
、ヘッド基板に発熱抵抗層の硬さと同等もしくはそれよ
りも低いセラミックを用いることにより、発熱抵抗層の
記録部先端面が基板端面よりも後退することがなく、鮮
明な高品位印字を維持できる。Since the leading end surface of the recording portion of the heating resistor layer is exposed, the recording portion of the heating resistor layer receives less heat, allowing high-speed printing. In addition, by using ceramic for the head substrate that has a hardness equal to or lower than that of the heating resistance layer, the leading edge of the recording part of the heating resistance layer does not recede from the edge of the substrate, making it possible to maintain clear, high-quality printing. .
第1図は本発明の一実施例を示し、ヘッド基板2の材料
はシリカを主成分とするセラミック(通称マシナブルセ
ラミック)を用いた。このセラミック組成を下記に示す
。FIG. 1 shows an embodiment of the present invention, in which the head substrate 2 is made of ceramic containing silica as a main component (commonly known as machinable ceramic). The composition of this ceramic is shown below.
SiO□ 64% kittys 25% に20 5% その他 6% この基板2の硬さは+]v380であった。SiO□ 64% kittys 25% 20 5% to Others 6% The hardness of this substrate 2 was +]v380.
3は、細長い帯状の無電解N1−P−Wめっきの発熱抵
抗層で、基板2上に所定のピッチで複数本形成されてい
る。この発熱抵抗層3の先端面4はヘッド基板2の端面
5と面一をなし、この発熱抵抗層3の先端面4が記録部
をなす。発熱抵抗層3の硬さはHv500〜600であ
った。Reference numeral 3 denotes an elongated band-shaped heating resistance layer of electroless N1-P-W plating, which is formed in plural on the substrate 2 at a predetermined pitch. The end surface 4 of the heat generating resistor layer 3 is flush with the end surface 5 of the head substrate 2, and the end surface 4 of the heat generating resistor layer 3 forms a recording section. The hardness of the heat generating resistor layer 3 was Hv500-600.
6は、記録部先端面4側の端部部分を除いてそれぞれの
発熱抵抗層3上に形成された電解Niめっきの給電用個
別電極層である。Reference numeral 6 denotes an individual electrode layer for power supply of electrolytic Ni plating formed on each heating resistor layer 3 except for the end portion on the side of the front end surface 4 of the recording section.
7は、発熱抵抗層3間に跨がる共1ffi電極層であり
、この共通電極N7は発熱抵抗層3の記録部先端面4の
近傍位置に銅の芸着により形成される。Reference numeral 7 denotes a common 1ffi electrode layer spanning between the heat generating resistor layers 3, and this common electrode N7 is formed of copper at a position near the recording portion tip surface 4 of the heat generating resistor layer 3.
以上の端面型サーマルへフド1は、基板2上に抵抗体と
して知られる無電解N1−P−Wめっきを施し、フォト
エツチングにより前記発熱抵抗層3を形成し、次に、発
熱抵抗層3を通電用電極として、発熱抵抗N3上に電解
Niめっきを施して前記給電用個別電極層6を形成し、
先端部を切断後、前記共通電極層7をヘッド基板2と発
熱抵抗層3上に銅の蒸着により形成した。The above-mentioned end face type thermal head 1 is constructed by applying electroless N1-P-W plating known as a resistor on a substrate 2, forming the heat generating resistor layer 3 by photo-etching, and then forming the heat generating resistor layer 3 on the substrate 2. As a current-carrying electrode, the heating resistor N3 is electrolytically plated with Ni to form the power-feeding individual electrode layer 6;
After cutting the tip, the common electrode layer 7 was formed on the head substrate 2 and the heating resistor layer 3 by vapor deposition of copper.
したがって、本発明の端面型サーマルへ7ド1は、給電
用個別電極層6に通電することにより、給電用個別電極
層6と共通電極層7との間の発熱抵抗層3部分が発熱し
、その熱が記録部先端面4に伝熱し、記録部先端面4に
発生する熱により、例えば記録部先端面4に接触するイ
ンクリボン8(第2図参照)のインクが溶融して記録紙
9に転写される。Therefore, in the end-face type thermal conductor 1 of the present invention, when the individual electrode layer 6 for power feeding is energized, the portion of the heating resistor layer 3 between the individual electrode layer 6 for power feeding and the common electrode layer 7 generates heat. The heat is transferred to the leading end surface 4 of the recording section, and the heat generated at the leading end surface 4 of the recording section melts, for example, the ink on the ink ribbon 8 (see FIG. 2) that is in contact with the leading end surface 4 of the recording section, and the recording paper 9 transcribed into.
この場合、発熱抵抗層3の記録部先端面4は露出してい
るため、この部分の暑熱は少ないので、高速印字が可能
となる。また、ヘッド基板2が低硬度のセラミックで形
成しているため、発熱抵抗N3の記録部先端面4が基板
端面5よりも後退することもないので、鮮明な高品位印
字を維持できる。In this case, since the leading end surface 4 of the recording portion of the heat generating resistor layer 3 is exposed, there is little heat in this portion, so high-speed printing is possible. Furthermore, since the head substrate 2 is made of low-hardness ceramic, the recording portion tip end surface 4 of the heat generating resistor N3 does not recede from the substrate end surface 5, so that clear, high-quality printing can be maintained.
なお、本実施例では発熱抵抗層3を無電解Ni−p−w
めっきで形成したが、これに限るものではなく、例えば
スパッター法や蒸着法などにより導電性セラミックで形
成してもよい。また、給電用個別電極N6及び共通電極
層7並びにヘッド基板2も前記のものに限られるもので
はないのは勿論である。In this example, the heating resistance layer 3 is made of electroless Ni-p-w.
Although it is formed by plating, it is not limited to this, and may be formed from conductive ceramic by, for example, a sputtering method or a vapor deposition method. Furthermore, it goes without saying that the individual power feeding electrodes N6, the common electrode layer 7, and the head substrate 2 are not limited to those described above.
以上説明したように本発明によれば、ヘッド基板上に複
数本の発熱抵抗層と、これらの発熱抵抗層に個別に接続
する複数本の給電用個別電極層と、前記複数の発熱抵抗
層に接続する共通電極層とを設け、前記ヘッド基板の端
面と面一をなす前記発熱抵抗層の露出先端面を記録部と
することにより、構造が簡単で安価なサーマルヘッドを
提供できる。As explained above, according to the present invention, a plurality of heat generating resistor layers are provided on a head substrate, a plurality of individual electrode layers for power feeding are individually connected to these heat generating resistor layers, and a plurality of power supplying individual electrode layers are connected to the plurality of heat generating resistor layers. By providing a connecting common electrode layer and using the exposed end surface of the heating resistor layer flush with the end surface of the head substrate as a recording section, it is possible to provide a thermal head with a simple structure and low cost.
そして、発熱抵抗層の記録部が露出しているため、記録
部の暑熱が少な(、高速印字を行える。そして、ヘッド
基板を発熱抵抗層の硬さと同等もしくはそれよりも低い
セラミックで形成することにより、発熱抵抗層の記録部
先端面が基板端面よりも後退することがなく、鮮明な高
品位印字を維持できる。Since the recording part of the heating resistor layer is exposed, there is less heat in the recording part (high-speed printing is possible.Then, the head substrate is made of ceramic that has a hardness equal to or lower than that of the heating resistor layer). As a result, the leading end surface of the recording portion of the heating resistor layer does not recede from the end surface of the substrate, and clear, high-quality printing can be maintained.
図面ば本発明の一実施例を示し、第1図は端面型サーマ
ルヘッドの一部分を示す斜視図、第2図は端面型サーマ
ルヘッドの使用状態を示す説明図である。
lは端面型サーマルヘッド、2はヘッド基板、3は発熱
抵抗層、4は記録部先端面、5は基板端面、6は給電用
個別電極層、7は共通電極層、8はインクリボン、9は
記録紙。
特許出願人 帝国ピストンリング株式会社The drawings show one embodiment of the present invention; FIG. 1 is a perspective view showing a portion of an end-face type thermal head, and FIG. 2 is an explanatory view showing the use state of the end-face type thermal head. 1 is an end face type thermal head, 2 is a head substrate, 3 is a heat generating resistor layer, 4 is a recording section tip surface, 5 is an end surface of a substrate, 6 is an individual electrode layer for power supply, 7 is a common electrode layer, 8 is an ink ribbon, 9 is recording paper. Patent applicant Teikoku Piston Ring Co., Ltd.
Claims (2)
発熱抵抗層に個別に接続する複数本の給電用個別電極層
と、前記複数の発熱抵抗層に接続する共通電極層とを設
け、前記ヘッド基板の端面と面一をなす前記発熱抵抗層
の露出先端面を記録部とする端面型サーマルヘッド。(1) A plurality of heat generating resistor layers, a plurality of individual power supply electrode layers individually connected to these heat generating resistor layers, and a common electrode layer connected to the plurality of heat generating resistor layers are provided on the head substrate. . An end face type thermal head in which an exposed end face of the heat generating resistor layer that is flush with the end face of the head substrate serves as a recording section.
しくはそれよりも低いセラミックで形成した請求項1記
載の端面型サーマルヘッド。(2) The end-face type thermal head according to claim 1, wherein the head substrate is formed of ceramic having a hardness equal to or lower than that of the heating resistance layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26906288A JPH02116558A (en) | 1988-10-25 | 1988-10-25 | Edge face type thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26906288A JPH02116558A (en) | 1988-10-25 | 1988-10-25 | Edge face type thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02116558A true JPH02116558A (en) | 1990-05-01 |
Family
ID=17467122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26906288A Pending JPH02116558A (en) | 1988-10-25 | 1988-10-25 | Edge face type thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02116558A (en) |
-
1988
- 1988-10-25 JP JP26906288A patent/JPH02116558A/en active Pending
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