JPH02114468A - Connection part of printed circuit board - Google Patents
Connection part of printed circuit boardInfo
- Publication number
- JPH02114468A JPH02114468A JP63267670A JP26767088A JPH02114468A JP H02114468 A JPH02114468 A JP H02114468A JP 63267670 A JP63267670 A JP 63267670A JP 26767088 A JP26767088 A JP 26767088A JP H02114468 A JPH02114468 A JP H02114468A
- Authority
- JP
- Japan
- Prior art keywords
- connection part
- shape memory
- memory alloy
- shape
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000011084 recovery Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 abstract description 10
- 238000010276 construction Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229910001000 nickel titanium Inorganic materials 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910018195 Ni—Co—Ti Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器製品の機器内配線材として用いられ
るフレキシブルプリント配線板と硬質プリント配線板の
接続部に関し、特に接続が容易で高密度接続部での接続
スペースを少なくしたプリント配線板の接続部に係るも
のである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a connecting portion between a flexible printed wiring board and a rigid printed wiring board used as internal wiring materials of electronic equipment products, and particularly relates to a connecting portion that is easy to connect and has a high density. This invention relates to a connection part of a printed wiring board that reduces the connection space at the connection part.
近年電子機器製品の機内配線は益々高密度化され小型さ
れるようになって来た。このためフレキシブルプリント
配線板（以下Ｆ、Ｐ、Ｃと略記する）が採用されるケー
スが増加している。そしてこのＦ、Ｐ、Ｃと共用される
硬質プリント配線板の使用も増加している。Ｆ、Ｐ、Ｃ
と硬質プリント板を共用する際に問題となるのは接続が
最大の悩みとなるといわれている。In recent years, the internal wiring of electronic equipment products has become increasingly denser and smaller. For this reason, flexible printed wiring boards (hereinafter abbreviated as F, P, and C) are increasingly being adopted. The use of rigid printed wiring boards, which are commonly used for F, P, and C, is also increasing. F, P, C
Connections are said to be the biggest problem when sharing rigid printed circuit boards.
すなわち小さなスペースの中で、容易に確実に、かつ小
型化が可能な接続部が要望されている。ところで従来Ｆ
、Ｐ、Ｃと硬質プリント板との接続は、コネクターを介
して接続する方法、厚銅端子付きＦ、Ｐ、Ｃを使用して
接続方法が主として行なわれている。In other words, there is a need for a connection part that can be easily and reliably miniaturized within a small space. By the way, conventional F
, P, C and a rigid printed board are mainly connected through a connector or by using F, P, and C with thick copper terminals.
しかしコネクタを介して接続する方法においては、ハン
ダ付けを要するため手間がかかり、スペースを多く要し
、高密度化に限界があり、またコストも高いなどの問題
がある。また厚銅端子付きＦ、Ｐ、Ｃを使用する場合は
、Ｆ、Ｐ、Ｃのｗ４箔を厚くする特殊な設計が必要なた
めコスト高になる問題があり、上記の要望を満足するに
至っていないのが現状である。However, the method of connecting via a connector requires soldering, which is time-consuming, requires a large amount of space, limits high density, and is high in cost. In addition, when using F, P, and C with thick copper terminals, a special design is required to thicken the W4 foil of F, P, and C, which raises the issue of high costs. The current situation is that there is no one.
本発明は上記の問題について種々検討の結果、厚銅端子
付きＦ、Ｐ、Ｃを使用することなく、またハンダ付けが
不用でしかも簡単な構造により、容易に、確実に接続で
き、かつ小型化が可能なＦ。As a result of various studies regarding the above-mentioned problems, the present invention has a simple structure that does not require the use of F, P, or C with thick copper terminals, does not require soldering, and can be easily and reliably connected, while being compact. F that is possible.
Ｐ、Ｃと硬質プリント板との接続部を開発したちである
。We have developed a connection between P and C and a rigid printed board.
〔課題を解決するための手段および作用〕本発明は、フ
レキシブルプリント配線板と硬質プリント配線板との接
続部において、フレキシブルプリント配線板と形状記憶
合金を一体化して接続部を形成し、上記硬質プリント板
に押え金具を設けて他方の接続部とし、該接続部に形状
記憶合金を設けた接続部を挿入し、形状記憶合金の形状
回復力により接続部を押圧することを特徴とするプリン
ト配線板の接続部である。[Means and Effects for Solving the Problems] The present invention provides that, in the connecting portion between the flexible printed wiring board and the rigid printed wiring board, the flexible printed wiring board and the shape memory alloy are integrated to form the connecting portion; A printed wiring characterized in that a holding metal fitting is provided on a printed board to serve as the other connection part, a connection part provided with a shape memory alloy is inserted into the connection part, and the connection part is pressed by the shape recovery force of the shape memory alloy. This is the connection part of the plate.
すなわち本発明は第１図（ａ）に示すように７字状に形
状記憶処理した板状または線状（図では板状）の形状記
憶合金（１）を例えば両面テープ接着剤（２）で裏面に
導体パターンを有するＦ 、 Ｐ 、 Ｃ（３）に貼り
合わせてＦ、Ｐ、Ｃ配線板の接着部（４）とし、これを
冷却して室温以下、望ましくは一２０°Ｃ以下に冷却し
、加圧して同図（ロ）に示すように平板状にする。That is, as shown in FIG. 1(a), the present invention uses a plate-shaped or linear (plate-shaped in the figure) shape memory alloy (1) that has been subjected to shape memory treatment in a 7-shape shape using, for example, a double-sided tape adhesive (2). It is bonded to the F, P, C (3) having a conductor pattern on the back side to form the adhesive part (4) of the F, P, C wiring board, and then cooled to below room temperature, preferably below -20°C. Then, pressurize it to make it into a flat plate as shown in the same figure (b).
一方第１図（Ｃ１に示すように導体パターン（５）を有
する硬質プリント板（６）に押え金具（７）を固定ネジ
（８）により固定して硬質プリント板の接続部（９）と
する。On the other hand, as shown in Fig. 1 (C1), a presser metal fitting (7) is fixed to a rigid printed board (6) having a conductive pattern (5) with a fixing screw (8) to form a connection part (9) of the rigid printed board. .
そして上記の硬質プリント板の接続部（９）の導体パタ
ーン（５）と押え金具（７）の間に前記の冷却して平板
状にした形状記憶合金板の接続部（４）を位置合せして
挿入する。このように両者の接続部が接続され室温に達
すると第２図に示すように、押え金（７）と硬質プリン
ト板（６）間に挿入された形状記憶合金板（１）が記憶
された元の７字状に回復して、この回復力により硬質プ
リント板上の導体パターン（５）とＦ。Then, the connecting portion (4) of the shape memory alloy plate, which has been cooled and made into a flat plate, is positioned between the conductor pattern (5) of the connecting portion (9) of the hard printed board and the holding metal fitting (7). and insert it. When the two connections are connected in this way and the temperature reaches room temperature, the shape memory alloy plate (1) inserted between the presser foot (7) and the hard printed board (6) is memorized, as shown in Figure 2. It recovers to its original figure 7 shape, and due to this recovery force, the conductor pattern (5) and F on the rigid printed board.
Ｐ、Ｃの導体パターン０ＩＩＩ）を押圧して接続し、Ｆ
、Ｐ。Press and connect the conductor patterns 0III) of P and C, and
,P.
Ｃと硬質プリント配線板を導通させるものである。C and the hard printed wiring board.
しかして本発明において形状記憶合金とはＮｉＴｉ系合
金（金属間化合物ＮｉＴｉを主体とする合金またはＮｉ
とＴｉの何れか一方または双方の一部をＦｅ５Ｃｏ、Ｃ
ｕ、Ｃｒ等の他元素で置換した合金）およびＣｕ−Ｚｎ
系、Ｃｕ−Ａｒ４系、ＦｅＦｅ−３ｉ−系、Ｆｅ−Ｎｉ
−Ｃｒ系、Ｆｅ−Ｎｉ−Ｃｏ−Ｔｉ系合金を意味し、室
温付近でマルテンサイト変態を起し、該変態点以上の温
度で一定の形状を記憶させると、これを変態点以下の温
度で変形しても変態点以上に加熱するだけで記憶させた
形状に戻る形状記憶効果を示すものである。またこの合
金は変態点以上で超弾性を示すことが知られている。そ
して上記の形状回復温度は合金の組成、加工条件１．形
状記憶処理により変動する。そこで本発明においては形
状回復温度が室温付近もしくはプリント配線板の昇温温
度付近の合金を用い、これを前記の７字状もしくは第２
図（ａ）に示すようなスリットを有する円状、または同
図ら）に示すように０字状に記憶させたものを使用する
。この際形状記憶合金は板状のものを用いた方がＦ、Ｐ
、Ｃと接着し易いため望ましいが、線状のものを用いて
もよい、このようにしてＦ、Ｐ。However, in the present invention, shape memory alloys are NiTi-based alloys (alloys mainly composed of intermetallic compounds NiTi or NiTi-based alloys).
and Ti or a part of both Fe5Co, C
alloys substituted with other elements such as u, Cr) and Cu-Zn
system, Cu-Ar4 system, FeFe-3i- system, Fe-Ni
- Cr-based, Fe-Ni-Co-Ti-based alloys, which undergo martensitic transformation near room temperature and memorize a certain shape at temperatures above the transformation point; Even if it is deformed, it exhibits a shape memory effect in which it returns to its memorized shape simply by heating it above its transformation point. This alloy is also known to exhibit superelasticity above its transformation point. The above shape recovery temperature is based on the composition of the alloy and processing conditions 1. Varies depending on shape memory processing. Therefore, in the present invention, we use an alloy whose shape recovery temperature is around room temperature or around the heating temperature of the printed wiring board, and we use an alloy that has a shape recovery temperature around room temperature or around the heating temperature of the printed wiring board, and
A circular shape with slits as shown in FIG. In this case, it is better to use a plate-shaped shape memory alloy.
, C is preferable because it easily adheres to F, P, but a linear one may also be used.
Ｃと接着された形状記憶合金は低温に冷却して平板状と
し、硬質プリント板に設けられた押え金と硬質プリント
板の間に挿入された後、室温に達すると記憶形状に回復
してＦ、Ｐ、Ｃと硬質プリント板の導体パターンを押圧
して接続するものである。The shape memory alloy bonded to C is cooled to a low temperature to form a flat plate, and is inserted between a presser foot provided on a rigid printed board and the rigid printed board. When it reaches room temperature, it recovers to its memorized shape and becomes F, P. , C and the conductor pattern of the rigid printed board are pressed and connected.
本発明においては上記ように形状記憶合金を軟かいＦ、
Ｐ、Ｃ板に接着して設けたので取付けが容易であると共
に比較的弱い力で変形するので形状記憶合金の小さい応
力で密着するもので、両基板間の良好な安定した導通が
得られ、また小型化が可能となるものである。In the present invention, as mentioned above, the shape memory alloy is soft F,
Since it is attached to the P and C plates, it is easy to install, and it deforms with a relatively weak force, so it adheres with the small stress of the shape memory alloy, resulting in good and stable conduction between the two boards. It also allows for miniaturization.
以下に本発明の一実施例について説明する。 An embodiment of the present invention will be described below.
厚さ２．０履のＦ、Ｐ、ＣＦｉの裏面に導体パターンを
有するＦ、Ｐ、Ｃ板の表面に厚さ０．３ｍｍ、中５．０
閣、長さ１０ｍのＮｉ−Ｔｉ合金の形状回復温度が２０
°Ｃのもの用い、これを７字状に開いた形状に記憶させ
た形状記憶合金板を貼付けて第１図（ａ）に示すような
Ｆ、Ｐ、Ｃ接続部とした。これを−３０°Ｃに冷却し加
圧して同図（ｂ）のように平板状とした。一方厚さ２．
０−の硬質プリント板に導体パターンと押え金を設けて
同図（Ｃ）のような硬質プリント板の接続とした。この
接続部に上記のＦ、Ｐ、Ｃの接続部を挿入し、常温にし
て形状記憶合金の形状を回復させＦ、Ｐ、Ｃと硬質プリ
ント板の導体パターンを接続した。F, P, CFi with a thickness of 2.0 mm and a conductor pattern on the back side of the F, P, and C plates with a thickness of 0.3 mm and a medium size of 5.0 mm on the front surface.
The shape recovery temperature of a 10 m long Ni-Ti alloy is 20
°C, and a shape memory alloy plate memorized in a 7-shaped open shape was pasted thereon to form the F, P, and C connections as shown in FIG. 1(a). This was cooled to −30° C. and pressurized to form a flat plate as shown in FIG. 3(b). On the other hand, the thickness is 2.
A conductive pattern and a presser foot were provided on a 0- hard printed board to connect the hard printed board as shown in FIG. 2(C). The above connection parts F, P, and C were inserted into this connection part, and the shape memory alloy was brought to room temperature to recover its shape, and F, P, and C were connected to the conductor pattern of the hard printed board.
この接続部の接触抵抗を測定したところ、従来のハンダ
付は接続と同程度の接触抵抗を示した。When the contact resistance of this connection was measured, it was found that the contact resistance was comparable to that of the conventional soldered connection.
（効果〕
以上に説明したように本発明はフレキシブルプリント板
の柔軟性と形状記憶合金の形状回復力および超弾性を利
用して接続部を確実に良好で安定して接続ができるもの
で、簡単な構造であるため、取付けが容品で小型化が可
能であるなど工業上顕著な効果を奏するものである。(Effects) As explained above, the present invention utilizes the flexibility of a flexible printed board and the shape recovery force and superelasticity of a shape memory alloy to reliably and stably connect a connection part. Because of its simple structure, it is easy to install and can be miniaturized, which brings about significant industrial effects.
第１図は本発明の一実施例に係る接続部の斜視図、第２
図は本発明の一実施例に係る接続部の断面図、第３図は
本発明に用いる形状記憶合金板の形状を示す断面図であ
る。
１・・・形状記憶合金板、 ２・・・接着剤、 ３・・
・Ｆ。
ｐ、ｃ、 ４・Ｆ、Ｐ、Ｃ接続部、 ５．１０・・・導
体パターン、 ６・・・硬質プリント板、 ７・・・押
え金具、 ８・・・固定ネジ、 ９用硬質プリント板接
続部。FIG. 1 is a perspective view of a connecting portion according to an embodiment of the present invention, and FIG.
The figure is a cross-sectional view of a connecting portion according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view showing the shape of a shape memory alloy plate used in the present invention. 1... Shape memory alloy plate, 2... Adhesive, 3...
・F. p, c, 4・F, P, C connection part, 5. 10... Conductor pattern, 6... Rigid printed board, 7... Holding metal fitting, 8... Fixing screw, Rigid printed board for 9 Connection part.
Claims (2)
板との接続部において、フレキシブルプリント配線板と
形状記憶合金を一体化して接続部を形成し、上記硬質プ
リント板に押え金具を設けて他方の接続部とし、該接続
部に形状記憶合金板を設けた接続部を挿入し、形状記憶
合金板の形状回復力により接続部を押圧することを特徴
とするプリント配線板の接続部。(1) At the connecting portion between the flexible printed wiring board and the rigid printed wiring board, the flexible printed wiring board and the shape memory alloy are integrated to form the connecting portion, and a holding metal fitting is provided on the rigid printed wiring board to form the other connecting portion. A connecting portion of a printed wiring board, characterized in that a connecting portion provided with a shape memory alloy plate is inserted into the connecting portion, and the connecting portion is pressed by the shape recovery force of the shape memory alloy plate.
字状、Ｕ字状、スリットを有する円状とすることを特徴
とする請求項１記載のプリント配線板の接続部。(2) Shape memory alloy is plate-shaped or linear, and the memory shape is V
The connecting portion of a printed wiring board according to claim 1, characterized in that the connecting portion has a shape of a letter, a U-shape, or a circle having a slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267670A JPH02114468A (en) | 1988-10-24 | 1988-10-24 | Connection part of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267670A JPH02114468A (en) | 1988-10-24 | 1988-10-24 | Connection part of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114468A true JPH02114468A (en) | 1990-04-26 |
Family
ID=17447897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63267670A Pending JPH02114468A (en) | 1988-10-24 | 1988-10-24 | Connection part of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114468A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5383788A (en) * | 1993-05-20 | 1995-01-24 | W. L. Gore & Associates, Inc. | Electrical interconnect assembly |
-
1988
- 1988-10-24 JP JP63267670A patent/JPH02114468A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5383788A (en) * | 1993-05-20 | 1995-01-24 | W. L. Gore & Associates, Inc. | Electrical interconnect assembly |
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