JPH0211367U - - Google Patents
Info
- Publication number
- JPH0211367U JPH0211367U JP8942488U JP8942488U JPH0211367U JP H0211367 U JPH0211367 U JP H0211367U JP 8942488 U JP8942488 U JP 8942488U JP 8942488 U JP8942488 U JP 8942488U JP H0211367 U JPH0211367 U JP H0211367U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor laser
- jig
- cleavage
- laser wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000003776 cleavage reaction Methods 0.000 claims 3
- 230000007017 scission Effects 0.000 claims 3
- 238000012544 monitoring process Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8942488U JPH0211367U (enrdf_load_html_response) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8942488U JPH0211367U (enrdf_load_html_response) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211367U true JPH0211367U (enrdf_load_html_response) | 1990-01-24 |
Family
ID=31313974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8942488U Pending JPH0211367U (enrdf_load_html_response) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211367U (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012136632A (ja) * | 2010-12-27 | 2012-07-19 | Furukawa Electric Co Ltd:The | ウエハ貼着用粘着シート |
-
1988
- 1988-07-05 JP JP8942488U patent/JPH0211367U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012136632A (ja) * | 2010-12-27 | 2012-07-19 | Furukawa Electric Co Ltd:The | ウエハ貼着用粘着シート |
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