JPH02113387U - - Google Patents
Info
- Publication number
- JPH02113387U JPH02113387U JP2061289U JP2061289U JPH02113387U JP H02113387 U JPH02113387 U JP H02113387U JP 2061289 U JP2061289 U JP 2061289U JP 2061289 U JP2061289 U JP 2061289U JP H02113387 U JPH02113387 U JP H02113387U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- circuit board
- printed circuit
- heat
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 13
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061289U JPH02113387U (enrdf_load_stackoverflow) | 1989-02-23 | 1989-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061289U JPH02113387U (enrdf_load_stackoverflow) | 1989-02-23 | 1989-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113387U true JPH02113387U (enrdf_load_stackoverflow) | 1990-09-11 |
Family
ID=31237128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2061289U Pending JPH02113387U (enrdf_load_stackoverflow) | 1989-02-23 | 1989-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113387U (enrdf_load_stackoverflow) |
-
1989
- 1989-02-23 JP JP2061289U patent/JPH02113387U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02113387U (enrdf_load_stackoverflow) | ||
| JPH0383949U (enrdf_load_stackoverflow) | ||
| JPS6416690U (enrdf_load_stackoverflow) | ||
| JPS619851U (ja) | パワ−トランジスタの固定装置 | |
| JPH0312492U (enrdf_load_stackoverflow) | ||
| JPS63200346U (enrdf_load_stackoverflow) | ||
| JPH02125348U (enrdf_load_stackoverflow) | ||
| JPH0350787U (enrdf_load_stackoverflow) | ||
| JPS59185843U (ja) | 電気素子用放熱器 | |
| JPH031586U (enrdf_load_stackoverflow) | ||
| JPS61177475U (enrdf_load_stackoverflow) | ||
| JPH0160545U (enrdf_load_stackoverflow) | ||
| JPS60167395U (ja) | プリント配線基板装置 | |
| JPS6139952U (ja) | 半導体装置 | |
| JPS594646U (ja) | 放熱板の取付装置 | |
| JPS5944051U (ja) | 半導体装置 | |
| JPS5939991U (ja) | 放熱板の基板への取付装置 | |
| JPS5952643U (ja) | 半導体パツケ−ジの放熱装置 | |
| JPS59127270U (ja) | プリント基板装置 | |
| JPS5911452U (ja) | 放熱器付き電子部品装置 | |
| JPS60121689U (ja) | 電気部品の保持装置 | |
| JPS5952641U (ja) | 半導体パツケ−ジの放熱装置 | |
| JPS5958947U (ja) | 半導体素子取付装置 | |
| JPS5939993U (ja) | プリント回路基板の放熱構造 | |
| JPS5873548U (ja) | 温度ヒユ−ズの取付装置 |