JPH02112469U

JPH02112469U -

Info

Publication number: JPH02112469U
Application number: JP2352189U
Authority: JP
Priority date: 1989-02-28
Filing date: 1989-02-28
Publication date: 1990-09-07

Description

[Brief explanation of drawings]

第１図及び第２図は本考案の実施例を示すもの
で、第１図は本考案に係る凸版の断面図、第２図
は該凸版の製造過程の１部を示す断面図である。
また、第３図はホツトスタンプに用いられる熱転
写装置の概略構成図、第４図及び第５図はホツト
スタンプ用凸版の従来例をそれぞれ示す断面図で
ある。２０……凸版、２１……基板、２２……第１樹
脂層、２３……第２樹脂層、２４……転写パター
ン。 1 and 2 show an embodiment of the present invention. FIG. 1 is a cross-sectional view of a relief plate according to the present invention, and FIG. 2 is a cross-sectional view showing a part of the manufacturing process of the relief plate.
Further, FIG. 3 is a schematic diagram of a thermal transfer device used for hot stamping, and FIGS. 4 and 5 are sectional views showing conventional examples of letterpress plates for hot stamping. 20... Letterpress, 21... Substrate, 22... First resin layer, 23... Second resin layer, 24... Transfer pattern.

Claims

[Scope of utility model registration request]

A transfer pattern is provided on the surface, and the pattern is attached to a heating plate so as to protrude, and is pressed onto the object to be transferred via the transfer film by the heating plate, and the pressure and heat are used to transfer the pattern onto the film. A relief plate for hot stamping that transfers a transfer layer to an object according to the above pattern, which comprises a substrate, a first soft resin layer laminated on one surface of the substrate, and the first resin layer. 1. A letterpress printing plate for hot stamping, characterized in that the letterpress printing plate is composed of a second hard resin layer laminated on the first resin layer, and at least the second resin layer is provided with the above-mentioned transfer pattern.