JPH02112010U - - Google Patents
Info
- Publication number
- JPH02112010U JPH02112010U JP2160989U JP2160989U JPH02112010U JP H02112010 U JPH02112010 U JP H02112010U JP 2160989 U JP2160989 U JP 2160989U JP 2160989 U JP2160989 U JP 2160989U JP H02112010 U JPH02112010 U JP H02112010U
- Authority
- JP
- Japan
- Prior art keywords
- copper film
- thickness
- base member
- loop antenna
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 1
Description
第１図は本考案の一実施例におけるアンテナエ
レメントの縦断面図、第２図は一般的なコの字型
ループアンテナの斜視図、第３図は従来のループ
アンテナにおけるアンテナエレメントの縦断面図
である。
１１…素地部材、１２……銅膜、１３……金膜
、２１……アンテナエレメント、２２……アンテ
ナ出力ピン、３１……素地部材、３２……銅膜、
３３……エポキシ膜。
Fig. 1 is a longitudinal sectional view of an antenna element in an embodiment of the present invention, Fig. 2 is a perspective view of a general U-shaped loop antenna, and Fig. 3 is a longitudinal sectional view of an antenna element in a conventional loop antenna. It is. 11...Base member, 12...Copper film, 13...Gold film, 21...Antenna element, 22...Antenna output pin, 31...Base member, 32...Copper film,
33...Epoxy film.
Claims (1)
において、前記導体の主要部が、導電性の素地部
材と、この素地部材上に該素地部材より薄い厚さ
にメツキされた銅の膜と、この銅膜上に該銅膜の
厚さの１０分の１以下の厚さにメツキされた金の
膜とからなることを特徴とするループアンテナ。 (2) 前記導体に流れる高周波電流のうちの半分
以上が前記銅膜に流れるのに足るだけの厚さを前
記銅膜が有することを特徴とする請求項１記載の
ループアンテナ。[Claims for Utility Model Registration] (1) In a loop antenna formed by forming a conductor into an annular shape, the main part of the conductor includes a conductive base member and a conductive base member with a thickness thinner than the base member. A loop antenna comprising a plated copper film and a gold film plated on the copper film to a thickness of one-tenth or less of the thickness of the copper film. (2) The loop antenna according to claim 1, wherein the copper film has a thickness sufficient to allow half or more of the high frequency current flowing through the conductor to flow through the copper film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160989U JPH02112010U (en) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160989U JPH02112010U (en) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02112010U true JPH02112010U (en) | 1990-09-07 |
Family
ID=31238998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2160989U Pending JPH02112010U (en) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02112010U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009540715A (en) * | 2006-06-16 | 2009-11-19 | オムニ−アイ・デイ・リミテツド | Enhancement and decoupling of electromagnetic radiation |
| JP2016530699A (en) * | 2013-05-31 | 2016-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Antenna array configuration for plasma processing systems |
-
1989
- 1989-02-27 JP JP2160989U patent/JPH02112010U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009540715A (en) * | 2006-06-16 | 2009-11-19 | オムニ−アイ・デイ・リミテツド | Enhancement and decoupling of electromagnetic radiation |
| JP2016530699A (en) * | 2013-05-31 | 2016-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Antenna array configuration for plasma processing systems |