JPH02111873A - 蒸着装置用クヌードセン型蒸発源装置 - Google Patents
蒸着装置用クヌードセン型蒸発源装置Info
- Publication number
- JPH02111873A JPH02111873A JP25975988A JP25975988A JPH02111873A JP H02111873 A JPH02111873 A JP H02111873A JP 25975988 A JP25975988 A JP 25975988A JP 25975988 A JP25975988 A JP 25975988A JP H02111873 A JPH02111873 A JP H02111873A
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- net
- refrigerant container
- cooling
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title claims description 4
- 230000008016 vaporization Effects 0.000 title abstract 3
- 238000009834 vaporization Methods 0.000 title abstract 3
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000001704 evaporation Methods 0.000 claims description 31
- 230000008020 evaporation Effects 0.000 claims description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 240000000731 Fagus sylvatica Species 0.000 description 1
- 235000010099 Fagus sylvatica Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- AFYPFACVUDMOHA-UHFFFAOYSA-N chlorotrifluoromethane Chemical compound FC(F)(F)Cl AFYPFACVUDMOHA-UHFFFAOYSA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25975988A JPH02111873A (ja) | 1988-10-15 | 1988-10-15 | 蒸着装置用クヌードセン型蒸発源装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25975988A JPH02111873A (ja) | 1988-10-15 | 1988-10-15 | 蒸着装置用クヌードセン型蒸発源装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02111873A true JPH02111873A (ja) | 1990-04-24 |
| JPH0516400B2 JPH0516400B2 (enrdf_load_stackoverflow) | 1993-03-04 |
Family
ID=17338564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25975988A Granted JPH02111873A (ja) | 1988-10-15 | 1988-10-15 | 蒸着装置用クヌードセン型蒸発源装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02111873A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168543A (en) * | 1991-04-05 | 1992-12-01 | The Boeing Company | Direct contact heater for vacuum evaporation utilizing thermal expansion compensation means |
| WO2003079420A1 (en) * | 2002-03-19 | 2003-09-25 | Innovex. Inc. | Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire |
| JP2014237885A (ja) * | 2013-06-10 | 2014-12-18 | 長州産業株式会社 | 蒸着源 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140048824A1 (en) | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
-
1988
- 1988-10-15 JP JP25975988A patent/JPH02111873A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168543A (en) * | 1991-04-05 | 1992-12-01 | The Boeing Company | Direct contact heater for vacuum evaporation utilizing thermal expansion compensation means |
| WO2003079420A1 (en) * | 2002-03-19 | 2003-09-25 | Innovex. Inc. | Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire |
| JP2014237885A (ja) * | 2013-06-10 | 2014-12-18 | 長州産業株式会社 | 蒸着源 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0516400B2 (enrdf_load_stackoverflow) | 1993-03-04 |
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