JPH02110851U - - Google Patents
Info
- Publication number
- JPH02110851U JPH02110851U JP1882589U JP1882589U JPH02110851U JP H02110851 U JPH02110851 U JP H02110851U JP 1882589 U JP1882589 U JP 1882589U JP 1882589 U JP1882589 U JP 1882589U JP H02110851 U JPH02110851 U JP H02110851U
- Authority
- JP
- Japan
- Prior art keywords
- package
- presses
- lead frame
- mold
- mold package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第４図は本考案の第１の実施例を示
す側面図、第２図は第１図のＡ矢視図、第３図は
リードフレーム状態の半導体装置のモールドパツ
ケージ外観図、第５図ａ，ｂは表面欠陥の一例で
あり、ａはその外観図、ｂは二値化画像を示す図
、第６図は本考案の第２の実施例を示す平面図、
第７図は従来の表面欠陥検査装置を示す側面図で
ある。
１……モールドパツケージ、２……リードフレ
ーム搬送レール、３……リードフレーム押え、４
……ピン、５……パツケージ押え、５′，５″…
…リブ、６……カメラ、７……レンズ、８……光
学系、９……孔、１０……認識制御部、１１……
モニター、１２，１２′……表面欠陥、１３……
照明ユニツト。
1 and 4 are side views showing the first embodiment of the present invention, FIG. 2 is a view taken along arrow A in FIG. 1, and FIG. 3 is an external view of a molded package of a semiconductor device in a lead frame state. 5a and 5b are examples of surface defects, a is an external view thereof, b is a diagram showing a binarized image, FIG. 6 is a plan view showing a second embodiment of the present invention,
FIG. 7 is a side view showing a conventional surface defect inspection device. 1...Mold package cage, 2...Lead frame transport rail, 3...Lead frame holder, 4
...Pin, 5...Package cage presser, 5', 5''...
... Rib, 6 ... Camera, 7 ... Lens, 8 ... Optical system, 9 ... Hole, 10 ... Recognition control section, 11 ...
Monitor, 12, 12'...Surface defect, 13...
lighting unit.
Claims (1)
置の表面欠陥検査を行う装置において、モールド
パツケージ表面の一部を押える極めて細いリブを
備えたパツケージ押えと、該パツケージ押えにモ
ールドパツケージを押しつけるピンとを有するこ
とを特徴とする半導体装置の位置決め機構。 An apparatus for inspecting surface defects of a semiconductor device molded into a lead frame, characterized by having a package holder equipped with an extremely thin rib that presses a part of the surface of the mold package, and a pin that presses the mold package against the package holder. A positioning mechanism for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1882589U JPH02110851U (en) | 1989-02-20 | 1989-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1882589U JPH02110851U (en) | 1989-02-20 | 1989-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110851U true JPH02110851U (en) | 1990-09-05 |
Family
ID=31233810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1882589U Pending JPH02110851U (en) | 1989-02-20 | 1989-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110851U (en) |
-
1989
- 1989-02-20 JP JP1882589U patent/JPH02110851U/ja active Pending
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