JPH02108878U - - Google Patents
Info
- Publication number
- JPH02108878U JPH02108878U JP1989015284U JP1528489U JPH02108878U JP H02108878 U JPH02108878 U JP H02108878U JP 1989015284 U JP1989015284 U JP 1989015284U JP 1528489 U JP1528489 U JP 1528489U JP H02108878 U JPH02108878 U JP H02108878U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- cover tape
- heat
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 239000004922 lacquer Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
- Adhesive Tapes (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015284U JPH0635964Y2 (ja) | 1989-02-14 | 1989-02-14 | チップ型電子部品包装用カバーテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015284U JPH0635964Y2 (ja) | 1989-02-14 | 1989-02-14 | チップ型電子部品包装用カバーテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108878U true JPH02108878U (US20020051482A1-20020502-M00012.png) | 1990-08-29 |
| JPH0635964Y2 JPH0635964Y2 (ja) | 1994-09-21 |
Family
ID=31227201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989015284U Expired - Fee Related JPH0635964Y2 (ja) | 1989-02-14 | 1989-02-14 | チップ型電子部品包装用カバーテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635964Y2 (US20020051482A1-20020502-M00012.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06336210A (ja) * | 1993-05-31 | 1994-12-06 | Sumitomo Bakelite Co Ltd | 電子部品包装用キャリアテープのシール方法 |
| JP2017222387A (ja) * | 2016-06-15 | 2017-12-21 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623466A (en) * | 1979-07-25 | 1981-03-05 | Mitsubishi Plastics Ind | Packed vessel having easy unsealing property |
| JPS6437367A (en) * | 1987-07-21 | 1989-02-08 | Taiyo Yuden Kk | Cover tape for part receiving strip |
-
1989
- 1989-02-14 JP JP1989015284U patent/JPH0635964Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623466A (en) * | 1979-07-25 | 1981-03-05 | Mitsubishi Plastics Ind | Packed vessel having easy unsealing property |
| JPS6437367A (en) * | 1987-07-21 | 1989-02-08 | Taiyo Yuden Kk | Cover tape for part receiving strip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06336210A (ja) * | 1993-05-31 | 1994-12-06 | Sumitomo Bakelite Co Ltd | 電子部品包装用キャリアテープのシール方法 |
| JP2017222387A (ja) * | 2016-06-15 | 2017-12-21 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635964Y2 (ja) | 1994-09-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |