JPH02108491A - Solder alloy composition - Google Patents
Solder alloy compositionInfo
- Publication number
- JPH02108491A JPH02108491A JP26195388A JP26195388A JPH02108491A JP H02108491 A JPH02108491 A JP H02108491A JP 26195388 A JP26195388 A JP 26195388A JP 26195388 A JP26195388 A JP 26195388A JP H02108491 A JPH02108491 A JP H02108491A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder alloy
- melting point
- weight
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 27
- 239000000956 alloy Substances 0.000 title claims abstract description 27
- 239000000203 mixture Substances 0.000 title claims description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 abstract description 19
- 238000002844 melting Methods 0.000 abstract description 19
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 229910052733 gallium Inorganic materials 0.000 abstract description 6
- 230000005496 eutectics Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
半導体パッケージなどの組み立てに使用する高融点の半
田合金に関し、
半田濡れ性および耐酸化性が優れ、且つ引張り試験にお
ける伸びの大きな半田合金を実用化することを目的とし
、
金属部材相互の接合に使用する半田合金が、ガリウム０
．０５〜０．３重量％、錫０．５〜１．５重量％。[Detailed Description of the Invention] [Summary] With regard to high melting point solder alloys used in the assembly of semiconductor packages, etc., the present invention aims to commercialize solder alloys that have excellent solder wettability and oxidation resistance, and have high elongation in tensile tests. For this purpose, the solder alloy used for joining metal parts is gallium 0
．． 05-0.3% by weight, tin 0.5-1.5% by weight.
１１１．０〜２．０重量％、残部器の組成比で半田合金
〔産業上の利用分野〕
本発明は耐酸化性を改良した半田合金組成物に関する。Solder alloy with composition ratio of 111.0 to 2.0% by weight, remaining component [Field of Industrial Application] The present invention relates to a solder alloy composition with improved oxidation resistance.
大量の情報を迅速に処理するため情報処理装置の主体を
占める半導体装置は単位素子の小形化による集積化が進
んでＬＳＩやＶＬＳＩなどの半導体集積回路が実用化さ
れているが、パフケージング構造や冷却構造なども改良
されており、これには凝固温度の異なる各種の半田が使
い分けられている。Semiconductor devices, which are the mainstay of information processing equipment in order to quickly process large amounts of information, have become increasingly integrated through miniaturization of unit elements, and semiconductor integrated circuits such as LSI and VLSI have been put into practical use. The cooling structure has also been improved, and various types of solder with different solidification temperatures are used for this purpose.
すなわち、半導体チップ周辺部の半田バンプの形成、半
導体チップのセラミック基板への装着。That is, forming solder bumps around the semiconductor chip and mounting the semiconductor chip on a ceramic substrate.
ハーメチックシールのための半田シートなど、半導体装
置の形成には凝固温度の異なる各種の半田が使用されて
おり、またセラミック多層回路基板上に搭載した半導体
装置を冷却するための冷却構造体の接合にも半田が使用
されている。Various solders with different solidification temperatures are used to form semiconductor devices, such as solder sheets for hermetic seals, and are also used to join cooling structures for cooling semiconductor devices mounted on ceramic multilayer circuit boards. Solder is also used.
こ＼で、半導体装置は使用時には発熱が大きいために使
用時と休止時での温度差が大きく、そのため機械的性質
に優れ、且つ熱疲労寿命に優れた半田材料の使用が必要
となる。Semiconductor devices generate a large amount of heat when in use, resulting in a large temperature difference between when in use and when not in use. Therefore, it is necessary to use a solder material that has excellent mechanical properties and a long thermal fatigue life.
本発明は３００℃程度の温度で使用される高融点半田に
関するものである。The present invention relates to a high melting point solder used at a temperature of about 300°C.
使用温度が３００℃程度の高融点半田として代表的なも
のとしては融点が２８０℃の金（Ａｕ）−２０％錫（Ｓ
ｎ）半田が挙げられる。A typical high melting point solder with a usage temperature of about 300℃ is gold (Au)-20% tin (S) with a melting point of 280℃.
n) Solder.
この半田は経時的には安定な材料ではあるが、材質が非
常に硬いために、接合部に柔軟性が必要な用途には使用
することができない。Although this solder is a stable material over time, it is extremely hard and cannot be used in applications that require flexibility in the joint.
また、Ａｕの組成比が大きいためにコストが高いことも
問題である。Another problem is that the cost is high due to the high composition ratio of Au.
また、安価で且つ強度に優れている半田材料として鉛（
Ｐｂ）−９％錫（Ｓｎ）合金がある。In addition, lead (
Pb)-9% tin (Sn) alloy.
然し、この材料の液相線温度は３１０℃、固相線温度は
２８０℃と凝固時の温度幅が広いために析出した結晶が
発達して組織が粗大化し、柔軟性の目安となる引張り試
験で伸びが少ない。However, because the liquidus temperature of this material is 310°C and the solidus temperature is 280°C, which is a wide temperature range during solidification, the precipitated crystals develop and the structure becomes coarse, making it impossible to perform a tensile test, which is a measure of flexibility. There is little elongation.
そのため、半田接合部に高い熱疲労寿命が必要な用途に
は不適当である。Therefore, it is unsuitable for applications requiring a high thermal fatigue life for solder joints.
そこで、ｐｂ系の共晶半田のうちで、機械的性質に優れ
、また熱疲労寿命に優れた半田材料として鉛（Ｐｂ）−
２，５％銀（Ａｇ）とＰｂ−１％５ｎ−１，５％Ａｇが
ある。Therefore, among Pb-based eutectic solders, lead (Pb) is a solder material with excellent mechanical properties and excellent thermal fatigue life.
There are 2,5% silver (Ag) and Pb-1%5n-1,5% Ag.
然し、前者のＰｂ−２，５％Ａｇは半田濡れ性が不充分
なことが問題であり、また後者のＰｂ−１％５ｎ−１，
５％Ａｇは融点が３０９℃と高温であるために半田付は
温度が高く、ロジン系のフラックスが炭化すると云う問
題があった。However, the former Pb-2,5%Ag has a problem of insufficient solder wettability, and the latter Pb-1%5n-1,
Since 5% Ag has a high melting point of 309° C., the soldering temperature is high and there is a problem in that the rosin-based flux carbonizes.
以上記したように、使用温度が３００℃付近の半田とし
て数種の半田があるが、半導体装置は使用時には素子の
発熱による温度上昇を伴うために接合部に柔軟性が要求
されている。As described above, there are several types of solder that can be used at temperatures around 300° C., but when semiconductor devices are used, the temperature rises due to heat generation of the elements, so flexibility is required in the joints.
そこで、熱疲労寿命の優れた材料が必要で、ｐｂ−１％
５ｎ−１，５％Ａｇの共晶半田はこの目的に適している
が、半田付は温度が高く、フラックスが炭化することが
問題である。Therefore, a material with excellent thermal fatigue life is required, and pb-1%
A 5n-1,5%Ag eutectic solder is suitable for this purpose, but the problem is that the soldering temperature is high and the flux carbonizes.
上記の課題は金属部材相互の接合に使用する半田合金と
して、ガリウム（Ｇａ）０．０５〜０．３重量％。The above-mentioned problem requires 0.05 to 0.3% by weight of gallium (Ga) as a solder alloy used for joining metal members together.
錫（Ｓｎ）０．５〜１．５重量％、銀（Ａｇ）１．０〜
２．０重景％９残部鉛（Ｐｂ）の組成比で半田合金組成
物を構成することにより解決することができる。Tin (Sn) 0.5~1.5% by weight, silver (Ag) 1.0~
This problem can be solved by forming the solder alloy composition at a composition ratio of 2.0% weight and 9% lead (Pb).
本発明は熱疲労寿命特性に優れた従来のｐｂ−１％５ｎ
−１，５％Ａｇの共晶半田からなる合金組成に微量のＧ
ａを添加することにより目的を達成するものである。The present invention is a conventional pb-1%5n with excellent thermal fatigue life characteristics.
-A trace amount of G in the alloy composition consisting of 1.5%Ag eutectic solder
The purpose is achieved by adding a.
発明者は従来のＰｂ−１％５ｎ−１，５％Ａｇの共晶半
田を用いる場合にロジン系フラックスが炭化し、外観を
損なう問題について調査した結果、半田付は温度を僅か
数℃下げるだけで炭化を防げることが判った。The inventor investigated the problem of rosin-based flux carbonizing and damaging the appearance when using conventional Pb-1%5n-1,5%Ag eutectic solder, and found that soldering only lowers the temperature by a few degrees Celsius. It was found that carbonization can be prevented.
そこで、この組成物にＧａを少量添加することによって
融点を下げるものである。Therefore, by adding a small amount of Ga to this composition, the melting point is lowered.
こ＼で、Ｇａを選んだ理由は、Ｇａは融点が２９．７℃
と低い金属であり、金属に添加した場合、少量の添加で
融点を大きく下げることができ、そのため例えばインジ
ウム（Ｉｎ）−Ｇａ系半田が実用化されている。The reason why I chose Ga is that the melting point of Ga is 29.7℃.
It is a metal with a low melting point, and when added to a metal, the melting point can be significantly lowered by adding a small amount, and for this reason, for example, indium (In)-Ga based solder has been put into practical use.
さて、ＧａをＰｂ−１％５ｎ−１，５％Ａｇの共晶半田
に添加する場合に問題となるのは共晶組成からずれるた
めに液相線温度と固相線温度との温度幅（凝固温度幅）
を生ずることであり、温度幅が大きいと先に記したよう
に析出した結晶が成長して組織が粗大化し、引張り試験
における伸びが小さくなって熱疲労寿命が低下してしま
う。Now, when adding Ga to Pb-1%5n-1,5%Ag eutectic solder, the problem is that the temperature width between the liquidus temperature and the solidus temperature ( solidification temperature range)
If the temperature range is large, as mentioned above, the precipitated crystals will grow and the structure will become coarser, resulting in less elongation in the tensile test and a reduced thermal fatigue life.
事実、Ｐｂ−１％５ｎ−１，５％Ａｇの組成にＧａを添
加する場合、Ｇａの添加量が０．３重量％より多いと凝
固温度幅が大きくなり、Ｇａの偏析によって凝固組織が
針状となって疲労寿命が低下することが判った。In fact, when Ga is added to a composition of Pb-1%5n-1.5%Ag, if the amount of Ga added is more than 0.3% by weight, the solidification temperature range becomes large, and the solidification structure becomes acicular due to the segregation of Ga. It was found that the fatigue life was reduced as a result.
一方、Ｇａの添加量が０．０５重量％未満では融点を下
げる効果が無いことが判った。On the other hand, it has been found that if the amount of Ga added is less than 0.05% by weight, there is no effect of lowering the melting point.
そこで、本発明はＰｂ−１％５ｎ−１，５％Ａｇの共晶
組成を中心としてＧａを０．０５〜０．３％添加するこ
とにより半田合金組成物の融点を下げ、これによりロジ
ン系のフラックスが炭化すると云う問題を解決するもの
である。Therefore, the present invention lowers the melting point of the solder alloy composition by adding 0.05 to 0.3% of Ga to a eutectic composition of Pb-1%5n-1.5%Ag, thereby reducing the melting point of the solder alloy composition. This solves the problem of carbonization of the flux.
Ｐｂ−１％５ｎ−１，５％Ａｇの共晶組成を中心として
Ｇａを０．０５〜０．３％添加することを目的とし、第
１表に示すように組成比を１６種類に変えて半田合金を
作り、これを用いて第１図に示すアルミナ（α−Ａ Ｉ
ｔ ｚｏ３”）よりなるセラミック基板１と鉄（Ｆｅ）
−ニッケル（Ｎｉ）合金からなるフランジ２との半田接
合３を行い、接合部の半田付は性と気密性とを調べ、ま
た半田合金の機械的性質を調べるためにＪＩＳ規格規格
１註
加工により作り、引張り試験を行った。The aim was to add 0.05 to 0.3% Ga to a eutectic composition of Pb-1%5n-1.5%Ag, and the composition ratio was changed to 16 types as shown in Table 1. A solder alloy is made and used to produce alumina (α-A I) as shown in Figure 1.
Ceramic substrate 1 made of tzo3'') and iron (Fe)
- Solder joint 3 with the flange 2 made of nickel (Ni) alloy is performed, and the soldering of the joint is examined for properties and airtightness, and in order to examine the mechanical properties of the solder alloy, JIS standard standard 1 note processing is performed. was made and subjected to a tensile test.
すなわち、アルゴン（Ａｒ）ガス雰囲気中でＧａ，Ｓｎ
。That is, Ga, Sn in an argon (Ar) gas atmosphere
.
八ｇを所定の組成に溶解鋳造し、この合金とｐｂを大気
中において溶解炉を用いて溶解合金化して１６種類の半
田合金を作り、圧延加工して厚さが０．２ ０の板材と
した。This alloy and PB are melted and alloyed in the atmosphere using a melting furnace to create 16 types of solder alloys, which are then rolled into plates with a thickness of 0.20. did.
変、験１；４欠用しに高１半田の組べ也毛
炙
こ＼で、引張り試験における歪み速度は０．５鶴／分で
ある。For example, test 1; 4, the strain rate in the tensile test is 0.5 Tsuru/min with a high-1 solder assembly.
第１表において、Ｌ．Ｔ．とＳ．Ｔ．はそれぞれ液相線
温度と固相線温度を示しており、また濡れ性の評価法と
しては半田が接着面に回っている場合を○、また一部欠
けている場合を△とした。In Table 1, L. T. and S. T. indicate the liquidus temperature and the solidus temperature, respectively, and the wettability was evaluated as ○ if the solder covered the adhesive surface, and △ if the solder was partially chipped.
次に、気密性はプローブ法Ｈｅリーク試験によりＩ Ｘ
１０−”ａｔｌｌ・ｃｃ／ｓｅｃ以下を気密性が良好
と評価した。 また、酸化防止効果は溶融時の半田の表
面と半田付は後の接合部を母合金と比較することにより
評価した。Next, the airtightness was determined by a probe method He leak test.
The airtightness was evaluated to be good when it was 10-''atll.cc/sec or less.The anti-oxidation effect was evaluated by comparing the surface of the solder during melting and the joint after soldering with the mother alloy.
綜合判定として、ＮＯ３９〜Ｎｏ． １６の試験試料が
不良であり、この内Ｎ００９は濡れ性，伸び，気密性な
どは良好であるが、Ｇａの添加量が０．０１重量％と少
ないために融点が３０９℃と従来の共晶半田（Ｐｂ−１
．５％Ａｇ−１％Ｓｎ）と同じであり、半田付は温度が
高く、表面が酸化し不良となっている。As a comprehensive judgment, No. 39 to No. 16 test samples were defective, and among these, N009 had good wettability, elongation, airtightness, etc., but because the amount of Ga added was small at 0.01% by weight, the melting point was 309°C, which was a conventional eutectic. Solder (Pb-1
．． 5%Ag-1%Sn), and the soldering temperature is high and the surface is oxidized, resulting in defects.
この第１表から判るように、Ｇａの組成比が０．０５〜
０．３重量％， Ｓｎの組成比が０．５〜１．５重量％
。As can be seen from Table 1, the composition ratio of Ga is from 0.05 to
0.3% by weight, Sn composition ratio is 0.5-1.5% by weight
.
Ａｇの組成比が１．０〜２．０重量％，残部ｐｂからな
る高融点半田合金は従来のＰｂ−１．５％Ａｇ−１％Ｓ
ｎ共晶合金と比較して同様の濡れ性，気密性１機械的性
質を保持しつ＼溶融温度を僅かではあるが低下させるこ
とができ、これにより接合部の酸化やフラックスの炭化
を防ぐことができる。The high melting point solder alloy with a composition ratio of 1.0 to 2.0% by weight of Ag and the balance being PB is the conventional Pb-1.5%Ag-1%S.
Compared to n-eutectic alloys, it maintains the same wettability and airtightness 1 while maintaining the same mechanical properties and can lower the melting temperature, albeit slightly, thereby preventing oxidation of the joint and carbonization of the flux. Can be done.
以上記したように本発明の実施により母合金の特性を損
なわずに半田の融点を下げることが可能となり、これに
より耐酸化性が改善されるので、良好な半田接合部を形
成でき、半導体装置の品質を向上することができる。As described above, by carrying out the present invention, it is possible to lower the melting point of solder without impairing the properties of the master alloy, and this improves oxidation resistance, making it possible to form good solder joints and improve semiconductor devices. quality can be improved.
第１図は半田接合部の状態を示す断面図である。
図において、
１はセラミック基板、 ２はフランジ、３は半田接
合、FIG. 1 is a sectional view showing the state of the solder joint. In the figure, 1 is a ceramic substrate, 2 is a flange, 3 is a solder joint,
Claims (1)
．０５〜０．３重量％、錫０．５〜１．５重量％、銀１
．０〜２．０重量％、残部鉛の組成比で構成されている
ことを特徴とする半田合金組成物。The solder alloy used to join metal parts is gallium-0.
．． 05-0.3% by weight, tin 0.5-1.5% by weight, silver 1
．． 1. A solder alloy composition characterized by having a composition ratio of 0 to 2.0% by weight, and the balance being lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26195388A JPH02108491A (en) | 1988-10-18 | 1988-10-18 | Solder alloy composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26195388A JPH02108491A (en) | 1988-10-18 | 1988-10-18 | Solder alloy composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108491A true JPH02108491A (en) | 1990-04-20 |
Family
ID=17368957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26195388A Pending JPH02108491A (en) | 1988-10-18 | 1988-10-18 | Solder alloy composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108491A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| EP3452241A4 (en) * | 2016-05-06 | 2019-11-13 | Honeywell International Inc. | High quality, void and inclusion free alloy wire |
-
1988
- 1988-10-18 JP JP26195388A patent/JPH02108491A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| EP3452241A4 (en) * | 2016-05-06 | 2019-11-13 | Honeywell International Inc. | High quality, void and inclusion free alloy wire |
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