JPH0210797A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH0210797A JPH0210797A JP15938888A JP15938888A JPH0210797A JP H0210797 A JPH0210797 A JP H0210797A JP 15938888 A JP15938888 A JP 15938888A JP 15938888 A JP15938888 A JP 15938888A JP H0210797 A JPH0210797 A JP H0210797A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heat
- holes
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 210000003608 fece Anatomy 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は多層印刷配線板に関し、特に、絶縁層にたまっ
た熱を放熱するための構造に係わる。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a multilayer printed wiring board, and particularly to a structure for dissipating heat accumulated in an insulating layer.
[従来の技術]
多層印刷配線板に搭載された電子部品から発生する熱が
、印刷配線板の温度を上昇させ、この印刷配線板に形成
されている電子回路の電気的特性を低下させることがあ
る。[Prior Art] Heat generated from electronic components mounted on a multilayer printed wiring board can increase the temperature of the printed wiring board and deteriorate the electrical characteristics of electronic circuits formed on this printed wiring board. be.
このような発熱による不都合を解決するため、各種の方
法が提案されている。Various methods have been proposed to solve such inconveniences due to heat generation.
装置筐体に開口を複数個設けて装置内部を流れる自然の
空気流を形成させて自然空冷により多層印刷配線板を冷
却する方法がある。しかし、この方法では放熱効果が低
い。また、腐食等が考慮されて筐体が密閉型に形成され
た場合には適用できない。There is a method of cooling a multilayer printed wiring board by natural air cooling by providing a plurality of openings in the device housing to form a natural air flow inside the device. However, this method has a low heat dissipation effect. Furthermore, this method cannot be applied when the housing is formed in a closed type due to corrosion or the like.
また、ファンモータを用いて空気流を形成させて強制的
に空冷させる方法がある。しかし、この方法では、モー
タが常時回転しているので、信頼性の問題があり、また
、モータの回転に伴なう騒音も問題となっていた。Another method is to use a fan motor to form an airflow to forcefully cool the device. However, in this method, since the motor is constantly rotating, there is a problem of reliability, and noise accompanying the rotation of the motor is also a problem.
さらに、各種電子部品に放熱用フィンを設けて放熱効果
を高める方法がある。しかし、この方法では、放熱フィ
ンを設ける分、電子部品が高価になると共に、量産し難
くなるという問題がある。Furthermore, there is a method of increasing the heat dissipation effect by providing heat dissipation fins on various electronic components. However, this method has the problem that the provision of heat dissipation fins makes the electronic components expensive and makes it difficult to mass-produce them.
上述の方法はいずれも、上述した不都合に加えて、主と
して表面から放熱させる方法であるため、内部の絶縁層
にたまった熱の放熱効果が低いという問題がある。In addition to the above-mentioned disadvantages, all of the above-mentioned methods have a problem in that the heat dissipation effect for the heat accumulated in the internal insulating layer is low because the methods mainly dissipate heat from the surface.
このような点に鑑み、多層印刷配線板の内部にたまった
熱をも良好に放熱できる放熱性の優れた第2図に示すよ
うな多層印刷配線板が既に提案されている(特開昭62
−281391号参照)。In view of these points, a multilayer printed wiring board as shown in FIG. 2, which has excellent heat dissipation properties and can effectively dissipate the heat accumulated inside the multilayer printed wiring board, has already been proposed (Japanese Patent Laid-Open No. 62
-281391).
第2図において、この多層印刷配線板1は、導体層2、
絶縁層3、放熱層4、絶縁層5及び導体層6をこの順序
で積層して構成されており、熱伝導性の良好な放熱層4
には、配線上必要となるスルーホールに対応した位置に
多数の孔が穿設されている。In FIG. 2, this multilayer printed wiring board 1 includes a conductor layer 2,
It is constructed by laminating an insulating layer 3, a heat dissipation layer 4, an insulating layer 5, and a conductor layer 6 in this order, and the heat dissipation layer 4 has good thermal conductivity.
A large number of holes are drilled at positions corresponding to through holes required for wiring.
かくして、熱伝導の悪い絶縁層3及び5にたまろうとす
る熱を、熱伝導の良好な放熱層4が配線上必要となるス
ルーホールを介して外部に放熱するようにしている。In this way, the heat that tends to accumulate in the insulating layers 3 and 5, which have poor thermal conductivity, is radiated to the outside by the heat dissipating layer 4, which has good thermal conductivity, through the through holes required for wiring.
し発明が解決しようとする課題]
しかしながら、この方法によると、適度な放熱効果を得
ることができるが、配線上必要がない専用の放熱層4を
設けているため、製造工数が増え、また、基板が高価に
なるという問題がある。また、放熱に利用するスルーホ
ールが配線上必要なものであるため、電子部品の端子が
挿入されており、この分、スルーホールを通過する空気
流の流れが悪く、放熱に大きく寄与しないスルーホール
も出現する。[Problems to be Solved by the Invention] According to this method, however, although an appropriate heat dissipation effect can be obtained, since a dedicated heat dissipation layer 4 that is not necessary for wiring is provided, the number of manufacturing steps increases. There is a problem that the board becomes expensive. In addition, since the through holes used for heat radiation are necessary for wiring, terminals of electronic components are inserted, and the flow of air through the through holes is poor and the through holes do not contribute much to heat radiation. also appears.
本発明は、以上の点を考慮してなされたもので、専用の
放熱層を設けることなく、絶縁層に熱がたまることを防
止する放熱性の優れた多層印刷配線板を提供しようとす
るものである。The present invention has been made in consideration of the above points, and aims to provide a multilayer printed wiring board with excellent heat dissipation properties that prevents heat from accumulating in an insulating layer without providing a dedicated heat dissipation layer. It is.
[課題を解決するための手段]
かかる課題を解決するため、本発明においては、複数の
導体層の中間層として絶縁層を有する多層印刷配線板に
おいて、放熱用のスルーホールを複数個設けた。[Means for Solving the Problem] In order to solve the problem, in the present invention, a plurality of through holes for heat radiation are provided in a multilayer printed wiring board having an insulating layer as an intermediate layer between a plurality of conductor layers.
[作用]
多層印刷配線板に搭載されている電子部品から発熱され
、内部の絶縁層に溜ろうとした熱は、印刷配線板外部の
温度との相違によって放熱用スルーホールを介して外部
に放出される。[Function] The heat generated by the electronic components mounted on the multilayer printed wiring board and stored in the internal insulating layer is released to the outside through the heat dissipation through holes due to the difference in temperature from the outside of the printed wiring board. Ru.
[実施例]
以下、本発明の一実施例を図面を参照しながら詳述する
。[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第1図はこの実施例の多層印刷配線板を示す斜視図、第
3図は導体層の一部を除去して絶縁層を露出された状態
の部分拡大斜視図である。FIG. 1 is a perspective view showing the multilayer printed wiring board of this embodiment, and FIG. 3 is a partially enlarged perspective view showing the insulating layer exposed by removing a portion of the conductor layer.
第1図において、この多層印刷配線板10は、導体層1
1、絶縁層12及び導体層13が積層されて形成されて
いる。この実施例の場合、導体層11.13の電子部品
の搭載領域及び配線パターンの形成領域外の領域である
、多層印刷配線板10の周辺部に多数の放熱用のスルー
ホール15が設けられている。これらスルーホール15
は内周面に銅メツキが施されており、導体層11、絶縁
層12及び導体層13を貫通している。In FIG. 1, this multilayer printed wiring board 10 includes a conductor layer 1
1. An insulating layer 12 and a conductive layer 13 are laminated. In the case of this embodiment, a large number of through holes 15 for heat dissipation are provided in the periphery of the multilayer printed wiring board 10, which is an area outside the electronic component mounting area and the wiring pattern forming area of the conductor layers 11, 13. There is. These through holes 15
Copper plating is applied to the inner peripheral surface, and the conductor layer 11, the insulating layer 12, and the conductor layer 13 are penetrated.
これらスルーホール15は、導体層11及び13につい
ては、第3図に導体層11について示すように、表面に
、孔15bの内周面の銅メツキと連なる銅メツキ領域(
ランド)15aが設けられている。また、絶縁層12の
表面は、銅メツキ12aが施されているが、孔15bの
まわりの表面は、円周方向に断続的、かつ部分的にメツ
キが施されていない部分12bが設けられている。この
部分12bは、絶縁層12の熱成分を孔15b側に集め
るようにするために設けられている9このような放熱用
スルーホール15を多数設けると、印刷配線板10に搭
載された電子部品から発熱し、熱伝導性の悪い絶縁層1
2に溜まろうとした熱は、印刷配線板10の外部温度よ
り高いため、熱交換原理によってこれらスルーホール1
5を介して放熱される。この際、絶縁層12の銅メツキ
12aが導体層11及び13のスルーホール15の内周
の銅メツキを介して外部に露出されている銅メツ−ql
laに連なるため、スルーホール15内を通過する空
気流によって放熱されるだけでなく、銅メツキ部分を介
した熱伝導によって印刷配線板10の表面に伝達され、
表面から放熱される。As shown in FIG. 3 for the conductor layer 11, these through-holes 15 have a copper-plated area (
land) 15a is provided. Further, the surface of the insulating layer 12 is plated with copper 12a, but the surface around the hole 15b is provided with portions 12b intermittently and partially unplated in the circumferential direction. There is. This portion 12b is provided to collect the heat component of the insulating layer 12 toward the hole 15b.9 When a large number of such heat dissipation through holes 15 are provided, electronic components mounted on the printed wiring board 10 Insulating layer 1 which generates heat and has poor thermal conductivity
Since the heat accumulated in the through holes 1 is higher than the external temperature of the printed wiring board 10, the heat exchange principle
Heat is radiated through 5. At this time, the copper plating 12a of the insulating layer 12 is exposed to the outside through the copper plating on the inner periphery of the through holes 15 of the conductor layers 11 and 13.
Since the heat is connected to la, the heat is not only dissipated by the air flow passing through the through hole 15, but also transferred to the surface of the printed wiring board 10 by heat conduction through the copper plating part.
Heat is radiated from the surface.
従って、上述の実施例によれば、別個独立に放熱層を設
けることなく、絶縁層から放熱することができ、電気特
性が劣化するような事態を押さえることができる。この
ように内部に熱が止どまろうとすることを防止できるの
で、電子部品からの発熱直後の熱を逃がすように、電子
部品にフィンを設ける方法やモータを用いた強制空冷方
法を適用しなくても良くなる。Therefore, according to the embodiments described above, heat can be radiated from the insulating layer without providing a separate heat radiating layer, and it is possible to prevent the electrical characteristics from deteriorating. In this way, it is possible to prevent heat from staying inside, so there is no need to apply fins on electronic components or forced air cooling methods using motors to release heat immediately after it is generated. It gets better though.
第4図は上記実施例の放熱効果を一段と高める方法を示
す斜視図である。少なくとも一部の放熱用のスルーホー
ル15の孔15bに、熱伝導性の良好な金属材でなる線
材16の一端を挿入装着し、その線材16の他端を、当
該印刷配線板1−0を収納している筐体(図示せず)に
装着した。FIG. 4 is a perspective view showing a method for further enhancing the heat dissipation effect of the above embodiment. One end of a wire 16 made of a metal material with good thermal conductivity is inserted into the hole 15b of at least a part of the heat dissipation through hole 15, and the other end of the wire 16 is connected to the printed wiring board 1-0. It was attached to the housing (not shown) in which it was stored.
このようにすると、絶縁層12の熱は、この線材16を
伝導して印刷配線板10の実装領域より一段と低温度の
筐体に導かれて放熱され、放熱効果が一段と高まる。In this way, the heat of the insulating layer 12 is conducted through the wire rod 16 and led to the casing, which has a lower temperature than the mounting area of the printed wiring board 10, and is radiated, thereby further increasing the heat radiation effect.
なお、上述の実施例においては、印刷配線板の周辺部に
放熱用のスルーホールを設けたものを示したが、電子部
品の搭載位置や配線パターン位置に関係しない位置なら
ば、印刷配線板の中央部に放熱用のスルーホールを設け
ても良い。In the above embodiment, a through hole for heat dissipation was provided at the periphery of the printed wiring board, but if the through hole is not related to the mounting position of electronic components or the wiring pattern position, A through hole for heat radiation may be provided in the center.
また、放熱用のスルーホールは、信号伝送や電源電圧の
伝送に寄与しないので、必しも銅メツキが施されていな
くても良い。Further, since the heat dissipation through holes do not contribute to signal transmission or power supply voltage transmission, they do not necessarily need to be copper plated.
さらに、放熱用のスルーホールは、全て同一形状である
必要はなく、大小やその横断面形状が異なっていても良
い。Furthermore, the heat dissipation through holes do not all have to have the same shape, and may be different in size and cross-sectional shape.
また、電源電圧レベルの種類ごとに異なる絶縁層が設け
られている多層印刷配線板に対しても本発明を適用する
ことができる。Further, the present invention can also be applied to a multilayer printed wiring board in which different insulating layers are provided for each type of power supply voltage level.
[発明の効果]
以上のように、本発明によれば、放熱専用の放熱層を設
けることなく、内部の絶縁層に溜まろうとする熱を良好
に放熱させることができる。[Effects of the Invention] As described above, according to the present invention, the heat that tends to accumulate in the internal insulating layer can be effectively radiated without providing a heat radiating layer exclusively for heat radiating.
第1図は本発明による多層印刷配線板の一実施例を示す
斜視図、第2図は従来配線板を示す斜視図、第3図は第
1図印刷配線板の一部を除去して示す要部破断斜視図、
第4図は第1図印刷配線板の放熱効果をより高める使用
方法を示す斜視図である。
10・・・多層印刷配線板、11.13・・・導体層、
12・・・絶縁層、15・・・放熱用スルーホール。
第1図
1多層印刷配線板
従来の印刷配線板の斜視図
第2図
第4図
Wk ′3図Fig. 1 is a perspective view showing an embodiment of a multilayer printed wiring board according to the present invention, Fig. 2 is a perspective view showing a conventional wiring board, and Fig. 3 shows the printed wiring board of Fig. 1 with a part removed. Main part cutaway perspective view,
FIG. 4 is a perspective view showing a method of using the printed wiring board of FIG. 1 to further enhance the heat dissipation effect. 10... Multilayer printed wiring board, 11.13... Conductor layer,
12...Insulating layer, 15...Through hole for heat radiation. Figure 1 1 Multilayer printed wiring board Perspective view of conventional printed wiring board Figure 2 Figure 4 Wk '3 Figure
Claims (1)
線板において、放熱用のスルーホールを複数個設けたこ
とを特徴とする多層印刷配線板。A multilayer printed wiring board having an insulating layer as an intermediate layer between a plurality of conductor layers, the multilayer printed wiring board comprising a plurality of through holes for heat dissipation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15938888A JPH0210797A (en) | 1988-06-29 | 1988-06-29 | Multilayer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15938888A JPH0210797A (en) | 1988-06-29 | 1988-06-29 | Multilayer printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0210797A true JPH0210797A (en) | 1990-01-16 |
Family
ID=15692697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15938888A Pending JPH0210797A (en) | 1988-06-29 | 1988-06-29 | Multilayer printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0210797A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04313297A (en) * | 1990-12-17 | 1992-11-05 | Hughes Aircraft Co | Three-dimensional structure / substrate through multilayer resistance |
KR20010063109A (en) * | 1999-12-21 | 2001-07-09 | 이형도 | Radiating apparatus of pcb |
-
1988
- 1988-06-29 JP JP15938888A patent/JPH0210797A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04313297A (en) * | 1990-12-17 | 1992-11-05 | Hughes Aircraft Co | Three-dimensional structure / substrate through multilayer resistance |
KR20010063109A (en) * | 1999-12-21 | 2001-07-09 | 이형도 | Radiating apparatus of pcb |
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