JP2000138485A - Printed wiring board incorporating heat pipe - Google Patents
Printed wiring board incorporating heat pipeInfo
- Publication number
- JP2000138485A JP2000138485A JP10308928A JP30892898A JP2000138485A JP 2000138485 A JP2000138485 A JP 2000138485A JP 10308928 A JP10308928 A JP 10308928A JP 30892898 A JP30892898 A JP 30892898A JP 2000138485 A JP2000138485 A JP 2000138485A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- printed wiring
- wiring board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高発熱性の電子部
品を冷却するためのヒートパイプを内蔵したプリント配
線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board having a built-in heat pipe for cooling electronic components having high heat generation.
【０００２】[0002]
【従来の技術】近年、ＣＰＵなどの高発熱性の電子部品
を備えた電子機器においては、電子部品を効果的に冷却
するために、この電子部品が実装されるプリント配線基
板にヒートパイプを内蔵したものが用いられている。2. Description of the Related Art In recent years, in an electronic device having a high heat-generating electronic component such as a CPU, a heat pipe is built into a printed wiring board on which the electronic component is mounted in order to effectively cool the electronic component. What was used is used.
【０００３】このヒートパイプは電子部品から発せられ
る熱を効率的に基板外の放熱部に伝達する働きを有し、
これによって電子部品を効果的に冷却して熱から保護す
るようにしたものである。This heat pipe has a function of efficiently transmitting heat generated from electronic components to a heat radiating portion outside the substrate,
This effectively cools the electronic components to protect them from heat.
【０００４】このようなヒートパイプを内蔵したプリン
ト配線基板としては、従来例えば「特開平３−２５５６
９０号公報」や「特開平５−２９７１７号公報」に開示
されているようなものがある。As a printed wiring board incorporating such a heat pipe, a conventional printed wiring board is disclosed, for example, in Japanese Patent Laid-Open No. Hei 3-2556.
No. 90 and Japanese Patent Application Laid-Open No. 5-29717.
【０００５】これら従来のヒートパイプ内蔵プリント配
線基板は、何れも単独で形成されたヒートパイプをプリ
ント配線基板の内部に埋め込んだ構造となっている。即
ち従来は、ヒートパイプ単体で独立した完成品が用いら
れており、これをプリント配線基板の絶縁層に埋め込ん
でヒートパイプ内蔵プリント配線基板を構成している。[0005] These conventional printed circuit boards with built-in heat pipes each have a structure in which a heat pipe formed alone is embedded in the printed circuit board. That is, conventionally, an independent completed product is used as a single heat pipe, and this is embedded in an insulating layer of the printed wiring board to form a printed wiring board with a built-in heat pipe.
【０００６】[0006]
【発明が解決しようとする課題】このように従来のヒー
トパイプ内蔵プリント配線基板は、単独で形成されたヒ
ートパイプをプリント配線基板に埋め込んだ構造である
ため、ヒートパイプそのものの厚さがプリント配線基板
の厚さをそのまま増やすことになるので、プリント配線
基板の厚さを薄くすることは困難であった。As described above, the conventional printed circuit board with a built-in heat pipe has a structure in which the heat pipe formed alone is embedded in the printed circuit board. Since the thickness of the substrate is to be increased as it is, it has been difficult to reduce the thickness of the printed wiring board.
【０００７】特に最近のプリント配線基板では、プリン
ト配線を多層に有するいわゆる多層基板が使用されてお
り、この多層基板において従来の如くヒートパイプを埋
め込むと基板の厚さは相当に厚くなってしまい、電子機
器の薄型化の大きな妨げとなっていた。Particularly in recent printed wiring boards, a so-called multilayer board having printed wiring in multiple layers is used. When a heat pipe is buried in this multilayer board as in the prior art, the thickness of the board becomes considerably large. This has been a major obstacle to thinning electronic devices.
【０００８】本発明はこのような問題点を解消すること
を目的としてなされたものである。[0008] The present invention has been made to solve such a problem.
【０００９】[0009]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、高発熱性の電子部品を実装し、この電子
部品から発せられる熱を放熱部に伝達するヒートパイプ
を内蔵したプリント配線基板において、基板内層でグラ
ウンドを構成する金属層にヒートパイプを一体に形成し
た構造としたものである。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a printed circuit having a heat generating electronic component mounted therein and a heat pipe for transmitting heat generated from the electronic component to a heat radiating portion. The wiring board has a structure in which a heat pipe is formed integrally with a metal layer constituting a ground in an inner layer of the board.
【００１０】このような構造としたことにより本発明の
ヒートパイプ内蔵プリント配線基板は、従来に比して基
板の厚さを薄く形成でき、電子機器の薄型化に有利なも
のとなる。By adopting such a structure, the printed wiring board with a built-in heat pipe of the present invention can be formed thinner than the conventional one, which is advantageous for making electronic equipment thinner.
【００１１】[0011]
【発明の実施の形態】以下、図面を参照しながら本発明
の好適な実施の形態例について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.
【００１２】図１は本発明によるプリント配線基板の内
部構造を拡大断面で示している。このプリント配線基板
１は、プリント配線層である銅層（金属層）を４層に有
する多層基板であり、そのうち上層から１，２，４層目
の銅層ａ1 ，ａ2 ，ａ4は夫々回路配線パターンを構成
し、３層目の銅層ａ3 はグラウンドを構成している（以
下この３層目の銅層ａ3 をグラウンド層という）。また
各層の銅層間はガラスエポキシ樹脂などによりなる樹脂
層２で絶縁されている。FIG. 1 is an enlarged sectional view showing the internal structure of a printed wiring board according to the present invention. The printed wiring board 1 is a multilayer board having four printed wiring copper layers (metal layers), of which the first , second and fourth copper layers a 1 , a 2 and a 4 from the upper layer are constitute respectively circuit wiring pattern (hereinafter referred to the third layer of the copper layer a 3 ground layer) 3-layer copper layer a 3 is constituting the ground. The copper layers of each layer are insulated by a resin layer 2 made of glass epoxy resin or the like.
【００１３】プリント配線基板１の上面には、ＣＰＵな
どの高発熱性の電子部品（以下高発熱部品という）３が
実装されており、この高発熱部品３から発せられる熱を
プリント配線基板１の端部の放熱部７に効率的に伝達し
て高発熱部品３を冷却するためのヒートパイプ４がプリ
ント配線基板１に内蔵されている。A high heat-generating electronic component (hereinafter, referred to as a high heat component) 3 such as a CPU is mounted on the upper surface of the printed circuit board 1, and heat generated from the high heat component 3 is generated by the printed circuit board 1. A heat pipe 4 for efficiently transmitting to the heat radiating section 7 at the end to cool the high heat generating component 3 is built in the printed wiring board 1.
【００１４】ここで特に本例のプリント配線基板１にお
いては、図１及び図２に示す如くヒートパイプ４は基板
内層のグラウンド層ａ3 に一体に形成されている。尚、
このヒートパイプ４を形成する方法については後に詳述
する。[0014] In the printed wiring board 1 in this case in particular the present example, the heat pipe 4 as shown in FIGS. 1 and 2 are formed integrally with the ground layer a 3 of the substrate inner layer. still,
The method for forming the heat pipe 4 will be described later in detail.
【００１５】ヒートパイプ４の熱端側（高発熱部品３
側）においては、プリント配線基板１に多数の貫通穴
（スルーホール）５が穿設されており、この貫通穴５の
内周面に施された金属メッキ６を介して高発熱部品３と
基板内層のグラウンド層ａ3 とが熱的に接続された構造
となっている。The heat end side of the heat pipe 4 (the high heat generating component 3
Side), a large number of through-holes (through-holes) 5 are formed in the printed wiring board 1, and the high heat-generating component 3 and the board are formed through metal plating 6 provided on the inner peripheral surface of the through-hole 5. an inner layer of the ground layer a 3 is a thermally-connected structure.
【００１６】即ち、貫通穴５は高発熱部品３の実装部に
対応して設けられ、４層の銅層のうちグラウンド層ａ3
のみを貫通しており（他の層ａ1 ，ａ2 ，ａ4 の回路配
線パターンは貫通穴５を除けて形成されている）、この
ため高発熱部品３から発せられた熱は貫通穴５の金属メ
ッキ６を通してグラウンド層ａ3 からヒートパイプ４に
伝えられるようになっている。That is, the through hole 5 is provided corresponding to the mounting portion of the high heat generating component 3, and the ground layer a 3 of the four copper layers is provided.
(The circuit wiring patterns of the other layers a 1 , a 2 , a 4 are formed excluding the through holes 5), so that the heat generated from the high heat-generating component 3 does not pass through the through holes 5. Is transmitted from the ground layer a 3 to the heat pipe 4 through the metal plating 6.
【００１７】一方、ヒートパイプ４の冷端側（放熱部７
側）においては、放熱部７としてプリント配線基板１の
上下面に放熱板８がビス９等によって固定されている。
ここでもプリント配線基板１に多数の貫通穴１０が穿設
されており、この貫通穴１０の内周面に施された金属メ
ッキ１１を介して放熱板８と基板内層のグラウンド層ａ
3 とが熱的に接続された構造となっている。On the other hand, the cold end side of the heat pipe 4 (radiator 7)
2), a heat radiating plate 8 is fixed to upper and lower surfaces of the printed wiring board 1 as a heat radiating portion 7 by screws 9 or the like.
Also in this case, a large number of through holes 10 are formed in the printed wiring board 1, and the heat sink 8 and the ground layer a of the inner layer of the substrate are formed via metal plating 11 provided on the inner peripheral surface of the through hole 10.
3 is thermally connected.
【００１８】即ち、貫通穴１０は放熱板８の固定部に対
応して設けられ、４層の銅層のうちグラウンド層ａ3 の
みを貫通しており、このため高発熱部品３からヒートパ
イプ４に伝えられた熱はグラウンド層ａ3 から貫通穴１
０の金属メッキ１１を通して放熱板８に伝達されて放熱
されるようになっている。[0018] That is, through-holes 10 are provided corresponding to the fixed portion of the heat radiating plate 8 extends through only the ground layer a 3 out of the copper layer of 4-layer, heat pipes 4 Therefore the high heat-generating component 3 heat transferred to the through from the ground layer a 3-hole 1
The heat is transmitted to the heat radiating plate 8 through the metal plating 11 for heat radiation.
【００１９】以上の如く構成される本例のプリント配線
基板１では、高発熱部品３から発せられた熱をヒートパ
イプ４によって効率的に放熱部７の放熱板８に伝達して
放熱できるので、高発熱部品３を効果的に冷却して熱か
ら保護することができる。In the printed wiring board 1 according to the present embodiment configured as described above, the heat generated from the high heat-generating component 3 can be efficiently transmitted to the heat radiating plate 8 of the heat radiating section 7 by the heat pipe 4 and radiated. The high heat generating component 3 can be effectively cooled and protected from heat.
【００２０】またヒートパイプ４は周囲が樹脂層２で覆
われているので、ヒートパイプ４内の冷媒の蒸発・液化
による熱輸送経路としての断熱効果を期待でき、このた
めより効率的な伝熱性が確保されて良好な放熱効果が得
られるものである。Further, since the periphery of the heat pipe 4 is covered with the resin layer 2, it is possible to expect a heat insulating effect as a heat transport path by evaporating and liquefying the refrigerant in the heat pipe 4. And a good heat radiation effect can be obtained.
【００２１】次に、上記の如く構成されるプリント配線
基板において、基板内層にヒートパイプ４を形成する方
法について説明する。Next, a method of forming the heat pipe 4 in the inner layer of the printed wiring board configured as described above will be described.
【００２２】図３はその第１の例を示す。この例は、プ
リント配線基板の製造工程において、２枚の銅板（金属
板）１２と１３とを貼り合わせてグラウンド層ａ3 を形
成するものであり、この場合先ず（Ａ）に示す如く２枚
の銅板１２と１３に互いに対向する凹状の変形部１２ａ
と１３ａをプレス加工等によって形成する。FIG. 3 shows a first example. This example, in the manufacturing process of the printed wiring board, which forms a ground layer a 3 by bonding the two copper plates (metal plate) 12 and 13, two as shown in First this case (A) Concave portions 12a opposed to each other on copper plates 12 and 13
And 13a are formed by press working or the like.
【００２３】そしてこの２枚の銅板１２と１３を（Ｂ）
のように貼り合わせてグラウンド層ａ3 を形成すると、
このグラウンド層ａ3 には銅板１２と１３の互いの変形
部１２ａと１３ａの間に空洞部１４が作られることにな
る。尚、ここで空洞部１４は、両端部分に鋭角状部１４
ａと１４ｂが形成されるような形状とする（このような
形状とすることにより、ヒートパイプの伝熱性が向上す
ることが知られている）。Then, the two copper plates 12 and 13 are
When the ground layer a 3 is formed by bonding
This would cavity 14 therebetween the deformable portion 12a and 13a of the copper plate 12 and 13 are made on the ground layer a 3. Here, the hollow portion 14 is provided with the acute angle portions 14 at both end portions.
a and 14b are formed (it is known that such a shape improves the heat conductivity of the heat pipe).
【００２４】こうして２枚の銅板１２と１３を貼り合わ
せてなるグラウンド層ａ3 に空洞部１４を形成した後、
（Ｃ）に示す如くグラウンド層ａ3 の上下両側に樹脂層
２を形成し、最後に（Ｄ）のように空洞部１４に冷媒１
５を封入して気圧を下げ、ヒートパイプ４を形成する。[0024] After thus forming the cavity 14 to the ground layer a 3 formed by bonding two copper plates 12 and 13,
The resin layer 2 is formed on both upper and lower sides of the ground layer a 3 as (C), the coolant 1 in the cavity 14 as the last (D)
The heat pipe 4 is formed by lowering the air pressure by enclosing 5.
【００２５】図４はヒートパイプの形成方法の第２の例
を示す。この例では、プリント配線基板の製造工程にお
いて、先ず（Ａ）に示す如く樹脂層２の上に銅箔（金属
箔）によりなるグラウンド層ａ3 が形成された状態で、
その上に例えばワックスなどの低融点材料１６でヒート
パイプの経路を形成する。FIG. 4 shows a second example of a method for forming a heat pipe. In this example, in a manufacturing process of the printed wiring board, with the ground layer a 3 made of copper foil (metal foil) on the resin layer 2 as shown in first (A) is formed,
A path of a heat pipe is formed thereon with a low-melting material 16 such as a wax.
【００２６】そしてこの低融点材料１６の上に被せるよ
うに（Ｂ）の如く蒸着やメッキなどで銅（金属）のカバ
ー層１７を生成し、その上に（Ｃ）に示すように樹脂層
２を形成した後、低融点材料１６を熱で溶かして空洞部
１４を作り、最後にこの空洞部１４に（Ｄ）のように冷
媒１５を封入して気圧を下げ、ヒートパイプ４を形成す
る。Then, a cover layer 17 made of copper (metal) is formed by vapor deposition or plating as shown in (B) so as to cover the low melting point material 16, and a resin layer 2 is formed thereon as shown in (C). Is formed, a low melting point material 16 is melted by heat to form a cavity 14, and finally, a refrigerant 15 is sealed in the cavity 14 as shown in FIG.
【００２７】以上の例のようにヒートパイプ４を基板内
層のグラウンド層ａ3 と一体に形成した構造とすること
により、従来のように単独で形成されたヒートパイプを
埋め込んだ構造に比べてプリント配線基板の厚さを薄く
形成することができる。By forming the heat pipe 4 integrally with the ground layer a 3 as the inner layer of the substrate as in the above-described example, the heat pipe 4 is printed as compared with the conventional structure in which the heat pipe 4 formed alone is embedded. The thickness of the wiring board can be reduced.
【００２８】特に図４の第２の例では、ヒートパイプ４
を薄い層で形成できるので、プリント配線基板のより一
層の薄型化が可能である。In particular, in the second example of FIG.
Can be formed in a thin layer, so that the printed wiring board can be further thinned.
【００２９】またこのようにヒートパイプ４を基板内層
のグラウンド層ａ3 と一体化したことにより、生産性及
びコストの面でも有利となり、またヒートパイプ４の接
触不良が生じることもないので確実な放熱効果が得られ
るものである。Further, by integrating the heat pipe 4 with the ground layer a 3 as the inner layer of the substrate in this manner, it is advantageous in terms of productivity and cost, and there is no poor contact of the heat pipe 4 so that it is reliable. A heat radiation effect can be obtained.
【００３０】図５〜図７はヒートパイプの冷端側の放熱
構造の例を示している。図５は、高発熱部品３を実装し
たプリント配線基板１が収容される電子機器の筺体１８
の一部分に、ヒートパイプ４の冷端側の放熱部７をビス
等の金属締結１９によって熱的に接続し、高発熱部品３
から発せられる熱を筺体１８を使って大気に放熱する構
造としたものである。FIGS. 5 to 7 show examples of the heat radiating structure on the cold end side of the heat pipe. FIG. 5 shows a housing 18 of the electronic device in which the printed wiring board 1 on which the high heat-generating components 3 are mounted is housed.
The heat radiating portion 7 on the cold end side of the heat pipe 4 is thermally connected to a part of the
In this structure, the heat generated from the radiator is radiated to the atmosphere using the housing 18.
【００３１】また図６は、筺体１８の上面に配置固定さ
れるキーボード２０などの機器にヒートパイプ４の冷端
側の放熱部７を熱的に接続して高発熱部品３の熱を放熱
するようにした例である。FIG. 6 also shows that the heat radiating portion 7 on the cold end side of the heat pipe 4 is thermally connected to a device such as a keyboard 20 arranged and fixed on the upper surface of the housing 18 to radiate the heat of the high heat generating component 3. This is an example.
【００３２】さらに図７に示すように、ヒートパイプ４
の冷端側をヒートシンク２１に接続し、このヒートシン
ク２１から放熱される熱をファン２２によって強制的に
筺体１８の外に排出させる構造としてもよい。Further, as shown in FIG.
May be connected to the heat sink 21, and the heat radiated from the heat sink 21 may be forcibly discharged to the outside of the housing 18 by the fan 22.
【００３３】以上、本発明の実施の形態例について説明
したが、本発明はこれらの例に限ることなく他にも種々
の実施形態を採り得るものであることは言うまでもな
い。Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to these embodiments, but can adopt various other embodiments.
【００３４】[0034]
【発明の効果】以上に説明した如く本発明は、高発熱性
の電子部品を実装し、この電子部品から発せられる熱を
放熱部に伝達するヒートパイプを内蔵したプリント配線
基板において、基板内層でグラウンドを構成する金属層
にヒートパイプを一体に形成した構造としたことによ
り、従来に比べてプリント配線基板の厚さを薄く形成す
ることができ、電子機器の薄型・コンパクト化を図る上
で有利なものとなる。As described above, the present invention relates to a printed wiring board having a heat pipe for mounting a heat-generating electronic component and transmitting heat generated from the electronic component to a heat radiating portion. By adopting a structure in which the heat pipe is formed integrally with the metal layer that constitutes the ground, the thickness of the printed wiring board can be made thinner than before, which is advantageous in making electronic equipment thinner and more compact. It becomes something.
【００３５】さらにヒートパイプを基板内層と一体化し
たことで生産性及びコストの面でも有利となり、またヒ
ートパイプの接触不良が生じることもないので確実な放
熱効果が得られる等、従来にはない種々の実用的効果を
有する。Further, since the heat pipe is integrated with the inner layer of the substrate, it is advantageous in terms of productivity and cost, and there is no contact failure of the heat pipe, so that a reliable heat radiation effect can be obtained. It has various practical effects.
【図１】本発明によるプリント配線基板の内部構造を示
す縦断側面図である。FIG. 1 is a vertical sectional side view showing an internal structure of a printed wiring board according to the present invention.
【図２】同、グラウンド層の平面図である。FIG. 2 is a plan view of the ground layer.
【図３】本発明によるプリント配線基板におけるヒート
パイプの形成方法の第１の例を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing a first example of a method for forming a heat pipe on a printed wiring board according to the present invention.
【図４】同、第２の例を示す縦断面図である。FIG. 4 is a longitudinal sectional view showing a second example.
【図５】ヒートパイプの冷端側の放熱構造の一例を示す
概略平面図である。FIG. 5 is a schematic plan view showing an example of a heat dissipation structure on the cold end side of the heat pipe.
【図６】同、他の例を示す概略側面図である。FIG. 6 is a schematic side view showing another example of the same.
【図７】同、さらに他の例を示す概略平面図である。FIG. 7 is a schematic plan view showing still another example of the same.
１‥‥プリント配線基板、ａ3 ‥‥グラウンド層（グラ
ウンドを構成する金属層）、３‥‥高発熱部品（高発熱
性の電子部品）、４‥‥ヒートパイプ、５‥‥貫通穴、
６‥‥金属メッキ、７‥‥放熱部、８‥‥放熱板、１０
‥‥貫通穴、１１‥‥金属メッキ、１２，１３‥‥銅
板、１２ａ，１３ａ‥‥変形部、１４‥‥空洞部、１５
‥‥冷媒、１６‥‥低融点材料、１７‥‥銅（金属）の
カバー層1 printed wiring board, a 3 ground layer (metal layer constituting ground), 3 high heat-generating component (high heat-generating electronic component), 4 heat pipe, 5 through hole,
6 metal plating, 7 radiator, 8 radiator plate, 10
{Through hole, 11} metal plating, 12, 13} copper plate, 12a, 13a} deformed part, 14} hollow part, 15
{Refrigerant, 16} Low melting point material, 17} Copper (metal) cover layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 林 文祥 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 Ｆターム(参考） 5E322 AA11 AB01 AB08 AB11 BB03 CA05 CA06 DB09 DB10 FA01 FA02 FA04 FA09 5E346 AA11 AA15 AA42 AA60 BB01 BB07 CC08 CC60 FF45 HH17 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Bunsyo Hayashi 6-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F-term (reference) 5E322 AA11 AB01 AB08 AB11 BB03 CA05 CA06 DB09 DB10 FA01 FA02 FA04 FA09 5E346 AA11 AA15 AA42 AA60 BB01 BB07 CC08 CC60 FF45 HH17
Claims (5)
部品から発せられる熱を放熱部に伝達するヒートパイプ
を内蔵したプリント配線基板において、 基板内層でグラウンドを構成する金属層に上記ヒートパ
イプを一体に形成したことを特徴とするヒートパイプ内
蔵プリント配線基板。1. A printed circuit board having a heat pipe for mounting a high heat generating electronic component and transmitting heat generated from the electronic component to a heat radiating portion, wherein the heat layer is formed on a metal layer constituting a ground in an inner layer of the substrate. A printed wiring board with a built-in heat pipe, wherein the pipe is formed integrally.
電子部品と上記金属層とは、金属メッキされた貫通穴を
介して熱的に接続されていることを特徴とする請求項１
に記載のヒートパイプ内蔵プリント配線基板。2. The heat pipe according to claim 1, wherein the electronic component and the metal layer are thermally connected to each other through a metal-plated through-hole at a hot end of the heat pipe.
A printed wiring board with a built-in heat pipe according to item 1.
放熱部と上記金属層とは、金属メッキされた貫通穴を介
して熱的に接続されていることを特徴とする請求項１に
記載のヒートパイプ内蔵プリント配線基板。3. The heat pipe according to claim 1, wherein on the cold end side of the heat pipe, the heat radiating portion and the metal layer are thermally connected via a metal plated through hole. Printed wiring board with built-in heat pipe.
状の変形部が形成された２枚の金属板を貼り合わせて上
記凹状の変形部間に空洞部を作り、この空洞部内に冷媒
を封入して形成されたものであることを特徴とする請求
項１に記載のヒートパイプ内蔵プリント配線基板。4. The heat pipe according to claim 1, wherein two metal plates having concave deformed portions facing each other are bonded to form a cavity between the concave deformed portions, and a refrigerant is sealed in the hollow portion. The printed wiring board with a built-in heat pipe according to claim 1, wherein the printed wiring board is formed by heating.
点材料によってヒートパイプの経路を形成してその上に
金属のカバー層を生成し、その後に上記低融点材料を溶
かして空洞部を作り、この空洞部内に冷媒を封入して形
成されたものであることを特徴とする請求項１に記載の
ヒートパイプ内蔵プリント配線基板。5. The heat pipe according to claim 1, wherein a path of the heat pipe is formed on the metal layer with a low melting point material, a metal cover layer is formed thereon, and then the low melting point material is melted to form a cavity. 2. The printed circuit board with a built-in heat pipe according to claim 1, wherein the printed circuit board is formed by enclosing a coolant in the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30892898A JP4140100B2 (en) | 1998-10-29 | 1998-10-29 | Printed wiring board with built-in heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30892898A JP4140100B2 (en) | 1998-10-29 | 1998-10-29 | Printed wiring board with built-in heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000138485A true JP2000138485A (en) | 2000-05-16 |
| JP4140100B2 JP4140100B2 (en) | 2008-08-27 |
Family
ID=17986975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30892898A Expired - Fee Related JP4140100B2 (en) | 1998-10-29 | 1998-10-29 | Printed wiring board with built-in heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4140100B2 (en) |
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