JPH0210723U - - Google Patents

Info

Publication number
JPH0210723U
JPH0210723U JP8571988U JP8571988U JPH0210723U JP H0210723 U JPH0210723 U JP H0210723U JP 8571988 U JP8571988 U JP 8571988U JP 8571988 U JP8571988 U JP 8571988U JP H0210723 U JPH0210723 U JP H0210723U
Authority
JP
Japan
Prior art keywords
insulating substrate
busbar
wiring board
heat dissipation
extends along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8571988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8571988U priority Critical patent/JPH0210723U/ja
Priority to DE19893920686 priority patent/DE3920686C2/de
Priority to FR8908849A priority patent/FR2633785B1/fr
Publication of JPH0210723U publication Critical patent/JPH0210723U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
  • Multi-Conductor Connections (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP8571988U 1988-06-30 1988-06-30 Pending JPH0210723U (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8571988U JPH0210723U (de) 1988-06-30 1988-06-30
DE19893920686 DE3920686C2 (de) 1988-06-30 1989-06-23 Stromschienen-Leiterplatte
FR8908849A FR2633785B1 (fr) 1988-06-30 1989-06-30 Carte de circuit pour conducteurs omnibus et boite de connexion correspondante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8571988U JPH0210723U (de) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH0210723U true JPH0210723U (de) 1990-01-23

Family

ID=13866648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8571988U Pending JPH0210723U (de) 1988-06-30 1988-06-30

Country Status (3)

Country Link
JP (1) JPH0210723U (de)
DE (1) DE3920686C2 (de)
FR (1) FR2633785B1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334619U (de) * 1989-08-14 1991-04-04
JP2002374607A (ja) * 2001-06-14 2002-12-26 Sumitomo Wiring Syst Ltd 電気接続箱におけるバスバーの配線構造
JP2003032846A (ja) * 2001-07-09 2003-01-31 Sumitomo Wiring Syst Ltd 電気接続箱
JP2014220925A (ja) * 2013-05-09 2014-11-20 住友電装株式会社 リレーユニット

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19518522C2 (de) * 1995-05-19 1997-08-28 Siemens Ag Steuergerät für ein Kraftfahrzeug
JP2001144403A (ja) * 1999-11-11 2001-05-25 Yazaki Corp 電気部品の放熱実装構造及び電気部品の実装方法
FR2803113B1 (fr) * 1999-12-22 2002-05-17 Valeo Securite Habitacle Module electrique de serrure de vehicule automobile, et procede pour sa fabrication
CN103444272A (zh) * 2011-04-19 2013-12-11 株式会社丰田自动织机 布线基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926752U (ja) * 1982-08-10 1984-02-18 ライオン株式会社 容器とキヤツプとの嵌合構造
JPS59214125A (ja) * 1983-05-20 1984-12-04 日本電気株式会社 電磁継電器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729816A (en) * 1971-12-02 1973-05-01 Western Electric Co Method of forming a circuit
US4215361A (en) * 1978-09-12 1980-07-29 Aavid Engineering, Inc. Winged self-fastened heat sinks for semiconductor devices
DE3123201A1 (de) * 1981-06-11 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Gehaeuseloses, senkrecht steckbares single-in-line-schaltungsmodul
DE3048451C2 (de) * 1980-12-22 1985-05-15 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Zentralelektrik für Kraftfahrzeuge
US4689718A (en) * 1986-04-04 1987-08-25 United Technologies Automotive, Inc. Programmable junction box
JPS63144710A (ja) * 1986-12-04 1988-06-16 矢崎総業株式会社 自動車の機能組込型配線装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926752U (ja) * 1982-08-10 1984-02-18 ライオン株式会社 容器とキヤツプとの嵌合構造
JPS59214125A (ja) * 1983-05-20 1984-12-04 日本電気株式会社 電磁継電器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334619U (de) * 1989-08-14 1991-04-04
JP2002374607A (ja) * 2001-06-14 2002-12-26 Sumitomo Wiring Syst Ltd 電気接続箱におけるバスバーの配線構造
JP2003032846A (ja) * 2001-07-09 2003-01-31 Sumitomo Wiring Syst Ltd 電気接続箱
JP2014220925A (ja) * 2013-05-09 2014-11-20 住友電装株式会社 リレーユニット

Also Published As

Publication number Publication date
FR2633785A1 (fr) 1990-01-05
DE3920686A1 (de) 1990-01-04
FR2633785B1 (fr) 1993-03-05
DE3920686C2 (de) 1994-06-01

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