JPH02106049A - Wire bonding equipment - Google Patents

Wire bonding equipment

Info

Publication number
JPH02106049A
JPH02106049A JP63260125A JP26012588A JPH02106049A JP H02106049 A JPH02106049 A JP H02106049A JP 63260125 A JP63260125 A JP 63260125A JP 26012588 A JP26012588 A JP 26012588A JP H02106049 A JPH02106049 A JP H02106049A
Authority
JP
Japan
Prior art keywords
optical system
reading means
system reading
ball
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63260125A
Other languages
Japanese (ja)
Inventor
Yukio Yamaguchi
幸雄 山口
Satoru Waga
悟 和賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP63260125A priority Critical patent/JPH02106049A/en
Publication of JPH02106049A publication Critical patent/JPH02106049A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable the early discovery of abnormality, and improve the yield by installing a recognition apparatus to detect a bonding position and an optical system reading means. CONSTITUTION:A semiconductor element on a lead frame die set at a bonding position is position-detected by an optical system reading means 4 and a recognition apparatus 5, and correction values are calculated by a central operating apparatus 6. Electrodes on the element and external leads are automatically connected by a capillary 8 fixed on a bonding head part 7. The wired elements are sent sequentially, and carried on a stage on which an optical system reading means 9 for inspection use is arranged. Quality inspections about the ball diameter of a wire connected with the electrode, the ball displacement amount, the existence of ball, etc. are done. Thereby the early discovery of failure is enabled, and the yield can be improved.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体素子と外部リードとの間をワイヤーで
接続するワイヤボンデング装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding apparatus for connecting a semiconductor element and an external lead with a wire.

従来の技術 半導体素子（ＩＣ，ＬＳＩ等）の組立工程において、外
部リードと素子電極とを電気的に接続するため、金線等
を用いてワイヤーリングが行われる。2. Description of the Related Art In the assembly process of semiconductor devices (IC, LSI, etc.), wiring is performed using gold wire or the like to electrically connect external leads and device electrodes.

このワイヤーリングを行う自動ワイヤーボンデング装置
においては、素子の電極位置を検出する認識装置によっ
て検出された位置データにより自動的に所定位置にボン
デングされる。In an automatic wire bonding device that performs this wiring, bonding is automatically performed at a predetermined position based on position data detected by a recognition device that detects the electrode position of the element.

しかしながら、半導体素子の表面状態、パターンの映り
状態などでボンデング位置精度が悪い、接着力が弱くワ
イヤーが離れるなどの不良が発生する。However, defects such as poor bonding position accuracy, weak bonding strength, and wire separation may occur due to the surface condition of the semiconductor element, the reflection condition of the pattern, etc.

従来、後工程において、全数、または、技取りによりオ
ペレーターが顕微鏡により検査し、品質の離係とワイヤ
ボンデング装置のコンデジョンを保っていた。Conventionally, in the post-process, all items were inspected by an operator using a microscope, or by a technician, to maintain quality and integrity of the wire bonding equipment.

発明が解決しようとする課題 このように後工程において、検査する方法では、不良を
発見するまでに時間がかかるため、不良が多く発生する
。Problems to be Solved by the Invention In this method of inspection in the post-process, many defects occur because it takes time to discover defects.

また、収納されたマガジンよりリードフレームを出して
検査しなければならず、生産性が低い問題があった。In addition, the lead frame must be removed from the stored magazine and inspected, resulting in a problem of low productivity.

課題を解決するための手段 本発明では、ワイヤボンデング装置において、認識装置
および検査用光学系読取手段を取付けたものである。Means for Solving the Problems In the present invention, a recognition device and an inspection optical system reading means are attached to a wire bonding apparatus.

作用 本発明によれば、ボンデング品質を検査し、早期に不良
を発見し、装置条件にフィードバックすることにより、
歩留を高め、高精度なワイヤーボンデングが可能になる
。According to the present invention, bonding quality is inspected, defects are detected early, and feedback is provided to the equipment conditions.
It increases yield and enables high-precision wire bonding.

実施例 第１図は本発明による自動ワイヤボンデング装置の実施
例の説明図である。Embodiment FIG. 1 is an explanatory diagram of an embodiment of an automatic wire bonding apparatus according to the present invention.

マガジン１に収納されたリードフレーム２は順次取出し
、フィーダー３上をボンデング位置に搬送される。The lead frames 2 stored in the magazine 1 are taken out one by one and conveyed on the feeder 3 to the bonding position.

ボンデング位置にセットされたリードフレームダイ上の
半導体素子は、光学系読取手段（カメラ、レンズ、照明
）４と認識装置５により位置検出させ、中央演算装置６
により補正計算され、ボンデングヘッド部７に取付けら
れたキャピラリー８により、自動的に素子上の電極と外
部リードを接続される。The position of the semiconductor element on the lead frame die set at the bonding position is detected by the optical system reading means (camera, lens, illumination) 4 and the recognition device 5, and the position is detected by the central processing unit 6.
The capillary 8 attached to the bonding head section 7 automatically connects the electrode on the element and the external lead.

配線された素子は順次送られ、検査用光学系読取手段９
が取付けられたステージに搬送され、電極に接続された
、ワイヤーのボール径、ボールズレ量、ボールの有無な
どの品質検査が行われる。The wired elements are sequentially sent to the inspection optical system reading means 9.
The wire is transported to a stage equipped with a wire, and the quality of the wire connected to the electrode is inspected, including the diameter of the ball, the amount of ball displacement, and the presence or absence of the ball.

リード側も同様な検査が行われる。認識装置５と光学系
読取手段９により読み込まれ、中央演算装置６により判
定された結果はモニター１０に表示され、また、ランプ
でオペレーターに知らされる。また、異状率が高い場合
には、自動停止が発令されるようになっている。自動的
に位置補正量、ボール径など修正可能になっている。検
査された素子は、マガジン１１に順次収納される。A similar inspection is performed on the lead side as well. The results read by the recognition device 5 and the optical system reading means 9 and determined by the central processing unit 6 are displayed on the monitor 10 and are also notified to the operator by a lamp. Additionally, if the abnormality rate is high, an automatic stop will be issued. It is possible to automatically correct the position correction amount, ball diameter, etc. The inspected elements are sequentially stored in the magazine 11.

ボンデングヘッド７と検査用光学系読取手段９とは、そ
れぞれテーブル１２．１３にのせられ、Ｘ、Ｙ方向に移
動できるようになっている。また、データーは自動集計
される。The bonding head 7 and the inspection optical system reading means 9 are placed on tables 12 and 13, respectively, and are movable in the X and Y directions. Additionally, data is automatically aggregated.

発明の効果 本発明によれば、マガジンに収納する前に検査するため
異状の早期発見ができ、歩留が向上する。従来の後工程
の検査の人手が不用で、大幅な省人化が可能になる。Effects of the Invention According to the present invention, since the inspection is performed before storing in the magazine, abnormalities can be detected early, and the yield can be improved. This eliminates the need for labor in conventional post-process inspections, allowing for significant labor savings.

また、データーの自動集計と自動補正機能によりオペレ
ーターの持ち台数も大幅にふえる。Additionally, the automatic data collection and automatic correction functions will significantly increase the number of machines operators can carry.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例を示す斜視図である。 １・・・・・・マガジン、２・・・・・・リードフレー
ム、３・・・・・・フィーダー、４・・・・・・光学系
読取手段、５・・・・・・認識装置、６・・・・・・中
央演算装置、７・・・・・・ボンデングヘッド、８・・
・・・・キャピラリー、９・・・・・・検査用光学系読
取手段、１０・・・・・・モニター、１１・・・・・・
マガジン、１２．１３・・・・・・Ｘ、Ｙテーブル。 代理人の氏名　弁理士　粟野重孝　ほか１名第１図FIG. 1 is a perspective view showing an embodiment of the present invention. 1...Magazine, 2...Lead frame, 3...Feeder, 4...Optical system reading means, 5...Recognition device, 6... Central processing unit, 7... Bonding head, 8...
... Capillary, 9 ... Inspection optical system reading means, 10 ... Monitor, 11 ...
Magazine, 12.13...X, Y table. Name of agent: Patent attorney Shigetaka Awano and one other person Figure 1

Claims (1)

【特許請求の範囲】[Claims] リードフレーム等に接着された半導体素子の電極と外部
リードを接続するワイヤボンデング装置において、ボン
デング位置を検出する認識装置および光学系読取手段を
そなえたことを特徴とするワイヤボンデング装置。A wire bonding device for connecting an electrode of a semiconductor element bonded to a lead frame or the like to an external lead, the wire bonding device comprising a recognition device for detecting a bonding position and an optical system reading means.
JP63260125A 1988-10-14 1988-10-14 Wire bonding equipment Pending JPH02106049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63260125A JPH02106049A (en) 1988-10-14 1988-10-14 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63260125A JPH02106049A (en) 1988-10-14 1988-10-14 Wire bonding equipment

Publications (1)

Publication Number Publication Date
JPH02106049A true JPH02106049A (en) 1990-04-18

Family

ID=17343639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63260125A Pending JPH02106049A (en) 1988-10-14 1988-10-14 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JPH02106049A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156319A (en) * 1990-09-14 1992-10-20 Kabushiki Kaisha Toshiba Wire bonding inspection equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156319A (en) * 1990-09-14 1992-10-20 Kabushiki Kaisha Toshiba Wire bonding inspection equipment

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