JPH02105440A - Extension of semiconductor wafer - Google Patents

Abstract

PURPOSE:To reduce a frictional resistance acting between an adhesive tape and a cylindrical tool for extension use and to easily obtain a stable and uniform extension amount of a wafer by a method wherein an air layer is formed between the adhesive tape and the cylindrical tool for extension use by using high-pressure air and an extension operation is executed. CONSTITUTION:A cylindrical tool 4 for extension use is provided with a flat ring 3 and a high-pressure air supply part 5. An adhesive tape 2 where a wafer 1 has been pasted is held by the flat ring 3 and is set at an end face of the cylindrical tool 4 for extension use; while high-pressure air 8 is being supplied to the inside of the cylindrical tool 4 for extension use from the high-pressure supply part 5, a load 6 is applied to the flat ring 3 and a semiconductor wafer 1 is extended. During this process, the high-pressure air 8 supplied to the inside of the cylindrical tool 4 pushes the semiconductor wafer 1 upward, tries to escape to the outside through the end face and forms an air layer 7; since a frictional resistance between the adhesive tape 2 and the end face of the cylindrical tool 4 for extension use can be reduced remarkably, a uniform extension stroke is always given to the adhesive tape 2; the semiconductor wafer can be divided smoothly into elements while equal intervals are being kept.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for stretching a semiconductor wafer, and more particularly to a method for stretching a wafer through an adhesive tape.

[Conventional technology]

Conventionally, in order to stretch a semiconductor wafer, as shown in FIG. 2, methods such as coating the adhesive tape 2 held by the flat ring 3 with a fluororesin 9 or attaching a plurality of bearings have been used. Set it up and clean it in the surrounding area.
A method is used in which a cylindrical enlarging tool 4, which can be moved in a straight line, is used and the enlarging tool is slid on the end surface of the enlarging tool.

[Problem to be solved by the invention]

However, in the conventional wafer stretching method described above, stretching is performed with the adhesive tape 2 in direct contact with the end surface of the cylindrical tool 4 for stretching, so when a load 6 is applied as shown by the arrow, frictional resistance is generated at the contact point between the two. Due to this frictional resistance, a stretching force sufficiently acts on the adhesive tape 2 located inside the contact point, exerting a large outward force on V, and the outside of the contact point stretches more than the inside. As a result, in order to obtain the actually required amount of stretching of the wafer, it is necessary to stretch the adhesive tape 2 with more stretching strokes than the required amount, which has the disadvantage that it is difficult to secure a stable amount of stretching. . In particular, in devices with a limited enlargement stroke, it may not be possible to obtain a sufficient amount of enlargement for assembling semiconductor devices.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a method for stretching a semiconductor wafer, which can always apply a uniform stretching stroke to an adhesive tape.

[Means to solve the problem]

According to the present invention, a method for enlarging a semiconductor wafer includes the steps of preparing a cylindrical enlarging tool including a flat ring and a high-pressure air supply unit, and holding an adhesive tape on the upper surface of which a semiconductor wafer is attached by the flat ring. and setting the semiconductor wafer on the end face of the enlarging cylindrical tool, and supplying high pressure air from the high pressure air supply section into the enlarging cylindrical tool to push the semiconductor wafer upward and forming an air layer near the end face. and stretching the adhesive tape to apply a load onto the flat ring.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

FIGS. 1(a) and 1(b) are drawings of a semiconductor wafer enlargement process showing an embodiment of the present invention.

According to this embodiment, a cylindrical enlarging tool 4 including a flat ring 3 and a high-pressure air supply section 5 is prepared, and the adhesive tape 2 to which the wafer 1 is attached is held by the flat ring 3, and the enlarging cylindrical tool [1st
Figure (a)]. Here, a load 6 is applied to the flat ring 3 while supplying high-pressure air 8 from the high-pressure air supply section 5 to the inside of the cylindrical tool 4 for enlarging, and the semiconductor wafer 1 is enlarged [FIG. 1(b)]. At this time, the high-pressure air 8 supplied inside the cylindrical tool 4 pushes the semiconductor wafer 1 upward and tries to escape to the outside through the end surface, forming an air layer 7, which causes the adhesive tape 2 and the end surface of the enlarging cylindrical tool 4 to Since the frictional resistance between the adhesive tapes 2 and 2 can be significantly reduced, a uniform stretching stroke is always given to the adhesive tape 2. That is, the semiconductor wafer is divided into elements very smoothly while maintaining equal intervals.

〔Effect of the invention〕

As explained in detail above, according to the present invention, enlarging is performed by creating a layer of air between the adhesive tape and the cylindrical enlarging tool using high-pressure air. It is possible to reduce the frictional resistance caused by the stretching of the wafer, suppress the occurrence of wafer stretching loss, and easily obtain a stable and uniform amount of wafer stretching at all times.

...Teflon coating.

Claims (1)

[Claims] a step of preparing a cylindrical tool for enlarging that includes a flat ring and a high-pressure air supply section; a step of holding an adhesive tape for pasting a semiconductor wafer on the upper surface with the flat ring and setting it on an end surface of the cylindrical tool for enlarging; , an adhesive tape stretching step in which high pressure air is supplied from the high pressure air supply section into the cylindrical stretching tool to push the semiconductor wafer upward and apply a load on the flat ring while forming an air layer near the end surface; A method for enlarging a semiconductor wafer, comprising: