JPH02104641U - - Google Patents
Info
- Publication number
- JPH02104641U JPH02104641U JP1989012757U JP1275789U JPH02104641U JP H02104641 U JPH02104641 U JP H02104641U JP 1989012757 U JP1989012757 U JP 1989012757U JP 1275789 U JP1275789 U JP 1275789U JP H02104641 U JPH02104641 U JP H02104641U
- Authority
- JP
- Japan
- Prior art keywords
- insulating board
- composite
- heat spreader
- composite insulating
- soldered onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012757U JPH02104641U (de) | 1989-02-06 | 1989-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012757U JPH02104641U (de) | 1989-02-06 | 1989-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104641U true JPH02104641U (de) | 1990-08-20 |
Family
ID=31222487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989012757U Pending JPH02104641U (de) | 1989-02-06 | 1989-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104641U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045399A (ja) * | 2009-11-17 | 2010-02-25 | Mitsubishi Electric Corp | パワー半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5218663B1 (de) * | 1971-07-16 | 1977-05-23 | ||
| JPS61240665A (ja) * | 1985-04-17 | 1986-10-25 | Sanyo Electric Co Ltd | 半導体装置 |
-
1989
- 1989-02-06 JP JP1989012757U patent/JPH02104641U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5218663B1 (de) * | 1971-07-16 | 1977-05-23 | ||
| JPS61240665A (ja) * | 1985-04-17 | 1986-10-25 | Sanyo Electric Co Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045399A (ja) * | 2009-11-17 | 2010-02-25 | Mitsubishi Electric Corp | パワー半導体装置 |