JPH02102726U - - Google Patents
Info
- Publication number
- JPH02102726U JPH02102726U JP1056889U JP1056889U JPH02102726U JP H02102726 U JPH02102726 U JP H02102726U JP 1056889 U JP1056889 U JP 1056889U JP 1056889 U JP1056889 U JP 1056889U JP H02102726 U JPH02102726 U JP H02102726U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- liquid
- hole
- etching liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056889U JPH0710494Y2 (ja) | 1989-01-31 | 1989-01-31 | 基板エッチング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056889U JPH0710494Y2 (ja) | 1989-01-31 | 1989-01-31 | 基板エッチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02102726U true JPH02102726U (ko) | 1990-08-15 |
| JPH0710494Y2 JPH0710494Y2 (ja) | 1995-03-08 |
Family
ID=31218346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056889U Expired - Lifetime JPH0710494Y2 (ja) | 1989-01-31 | 1989-01-31 | 基板エッチング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710494Y2 (ko) |
-
1989
- 1989-01-31 JP JP1056889U patent/JPH0710494Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710494Y2 (ja) | 1995-03-08 |