JPH02102559A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To enable a wafer to be scribed along a scribing line of its front side from its rear side by a method wherein the wafer is held from its front side, a scriber is provided to the rear side of the wafer, and the relative position of the scriber to the wafer is positioned. CONSTITUTION:A blade 33 is observed by a microscope 21 through a glass chuck 13 without a wafer 11, and the center line of the eyepiece plane is made to coincident with the blade 33. In succession, the wafer 11 is sucked by the chuck 13 from its front side and positioned under the microscope 21 as being held horizontally, the wafer 11 is made to move in parallel through a transfer mechanism of a positioning means 41 observing the surface of the wafer 11 so as to make the center line of the eyepiece coincident with a scribe line. When this alignment on a horizontal plane is completed, the wafer 11 is made to descend to be scribed by a scriber 31. By this setup, the rear side of a wafer can be scribed corresponding to its front pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a scriber positioning apparatus used in a semiconductor wafer scribing process.

<Prior Art> Generally, monolithic ICs are manufactured by cutting a silicon wafer into rings from a single-crystal silicon ingot using a diamond saw for wafer scribing. On top of this silicon wafer, devices that make up logic circuits and the like are made. This is the pre-process.

Next, the wafer is scribed and divided into chips, which are then assembled by pasting them onto a lead frame. This is a post-process.

In this scrubbing process, in order to divide the wafer into individual chips, cuts are made in the wafer surface along the scribe line using, for example, a diamond blade.

In a conventional scribing process for semiconductor wafers, chips are attached to an adhesive tape to prevent them from falling apart, and then the wafer is half-cut or fully cut from the surface along the scribe line using a scriber. After scribing, the wafer is cleaned, and in the case of half-cutting, bending stress is applied to the back side using a jig such as a roller to separate it into individual pellets. Furthermore, in order to facilitate subsequent steps, the sheet to which the wafer is attached may be stretched.

In this case, the wafer is cut from the surface of the wafer which is attached to the tape, for example by a diamond plate. To scribe this wafer, the wafer surface was observed, the scribe line was observed, and alignment was performed by moving the wafer parallel within the surface.

<Problems to be Solved by the Invention> However, such conventional semiconductor manufacturing equipment has a problem in that it is only possible to scribe from the front side of the semiconductor wafer.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor manufacturing apparatus that can scribe along a scribe line from the back side of a wafer to the front side.

Means for Solving the Problems> The present invention includes a holding means for holding a semiconductor wafer from the front side thereof, and a holding means disposed on the back side of the semiconductor wafer held by the holding means to cut the back side of the semiconductor wafer. This is a semiconductor manufacturing apparatus including a scriber and positioning means for relatively positioning the scriber and a semiconductor wafer.

<Operation> In the semiconductor manufacturing apparatus according to the present invention, the semiconductor wafer is held from the front side by the holding means.

``Then, the scriber is placed on the back side of this wafer. Further, the relative position between the scriber and the wafer is determined by positioning means.

Then, the wafer is cut along the scribe line from the back side of the wafer using a scriber.

<Example> Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a longitudinal sectional view of a semiconductor manufacturing apparatus according to the present invention.

In this figure, 11 indicates a semiconductor wafer. The surface of this wafer 11 is attracted by a chuck 13 and held horizontally. Chuck 13 holds wafer 11
It is a holding means. Further, this chuck 13 is made of transparent glass, and the scribe line on the surface of the wafer 11 that is attracted can be visually recognized and observed through the chuck 13. 15 is a communication path connected to a vacuum pump.

Furthermore, the chuck 13 is provided movably within a horizontal plane by a mechanism not shown. Therefore, the wafer 11 can be translated and rotated within the horizontal plane.

A microscope 21 for position confirmation moves above the wafer 11 (
(vertical movement, rotation, horizontal movement) freely arranged. Furthermore, a guide such as a center line is provided on the eyepiece surface of the microscope 21.

A scriber 31 is provided below the wafer 11. The scriber 31 is arranged so that its blade 33 is perpendicular to the back surface (lower surface) of the wafer 11.

The scriber 31 itself is fixed at a predetermined position, that is, directly below the microscope 21 at a predetermined distance.

Therefore, the mechanism for horizontally and rotationally moving the microscope 21 and the chuck 13 as a whole
A positioning means 41 is configured to perform relative positioning between the scriber 31 and the scriber 31.

In the apparatus according to the above configuration, first, the blade 33 is observed through the glass chuck 13 with the microscope 21 without holding the wafer 11, and the microscope 21 is moved to, for example, align the center line of the eyepiece with the blade 33. match.

Subsequently, the wafer 11 is sucked from the front side by the glass chuck 13, held horizontally, and positioned below the microscope 21. Then, while observing the surface of the wafer 11 using the microscope 21, the wafer 11 is moved in parallel along a horizontal plane by the moving mechanism of the positioning means 41, so that the center line of the eyepiece surface and the scribe line are aligned. That is, the scribe line on the surface of the wafer 110 is appropriately positioned with respect to the fixed blade 33.

After the alignment in the horizontal plane is completed, the wafer 11 is lowered and the scriber 31 scribes the back surface of the wafer II along the scribe line.

FIG. 2 is a longitudinal sectional view thereof.

11... Semiconductor wafer, 13... Chuck (holding means), 31...
...Scriver, 41 ...Positioning means.

In the above embodiments, the glass chuck 13 was used as the holding means, but the holding means is not limited to this, and other types of chucks, such as a bifurcated chuck, may also be used provided that the supporting strength of the wafer is considered. You can also do that.

Claims (1)

[Claims] (1) A holding means for holding a semiconductor wafer from the front side thereof, a scriber disposed on the back side of the semiconductor wafer held by the holding means and cutting the back side of the semiconductor wafer, and a connection between the scriber and the semiconductor wafer. A semiconductor manufacturing apparatus comprising: positioning means for relatively positioning.