JPH0197557U - - Google Patents
Info
- Publication number
- JPH0197557U JPH0197557U JP19369887U JP19369887U JPH0197557U JP H0197557 U JPH0197557 U JP H0197557U JP 19369887 U JP19369887 U JP 19369887U JP 19369887 U JP19369887 U JP 19369887U JP H0197557 U JPH0197557 U JP H0197557U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- hollow part
- board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19369887U JPH0197557U (un) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19369887U JPH0197557U (un) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197557U true JPH0197557U (un) | 1989-06-29 |
Family
ID=31484476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19369887U Pending JPH0197557U (un) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197557U (un) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087294A (ja) * | 2008-09-30 | 2010-04-15 | Toshiba Corp | プリント回路板及びプリント回路板を備えた電子機器 |
-
1987
- 1987-12-21 JP JP19369887U patent/JPH0197557U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087294A (ja) * | 2008-09-30 | 2010-04-15 | Toshiba Corp | プリント回路板及びプリント回路板を備えた電子機器 |
| JP4560113B2 (ja) * | 2008-09-30 | 2010-10-13 | 株式会社東芝 | プリント回路板及びプリント回路板を備えた電子機器 |