JPH0292936U - - Google Patents

Info

Publication number
JPH0292936U
JPH0292936U JP1989000960U JP96089U JPH0292936U JP H0292936 U JPH0292936 U JP H0292936U JP 1989000960 U JP1989000960 U JP 1989000960U JP 96089 U JP96089 U JP 96089U JP H0292936 U JPH0292936 U JP H0292936U
Authority
JP
Japan
Prior art keywords
chip
circuit board
printed circuit
chip carrier
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989000960U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989000960U priority Critical patent/JPH0292936U/ja
Publication of JPH0292936U publication Critical patent/JPH0292936U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Wire Bonding (AREA)
JP1989000960U 1989-01-09 1989-01-09 Pending JPH0292936U (un)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989000960U JPH0292936U (un) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989000960U JPH0292936U (un) 1989-01-09 1989-01-09

Publications (1)

Publication Number Publication Date
JPH0292936U true JPH0292936U (un) 1990-07-24

Family

ID=31200434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989000960U Pending JPH0292936U (un) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0292936U (un)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941901A (un) * 1972-08-29 1974-04-19
JPS4942624A (un) * 1972-08-23 1974-04-22
JPH01235356A (ja) * 1988-03-16 1989-09-20 Nec Corp モジュール基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942624A (un) * 1972-08-23 1974-04-22
JPS4941901A (un) * 1972-08-29 1974-04-19
JPH01235356A (ja) * 1988-03-16 1989-09-20 Nec Corp モジュール基板

Similar Documents

Publication Publication Date Title
JPH0292936U (un)
JPH0170383U (un)
JPS6316178U (un)
JPH0295247U (un)
JPH0351861U (un)
JPH03102762U (un)
JPS6196558U (un)
JPH0199663U (un)
JPH0197557U (un)
JPH02113344U (un)
JPS62197881U (un)
JPH0392047U (un)
JPS6296882U (un)
JPS62163956U (un)
JPH0345U (un)
JPS6270445U (un)
JPS6247171U (un)
JPH0246669U (un)
JPS6339580U (un)
JPS63153551U (un)
JPS6375068U (un)
JPH0336478U (un)
JPH0383956U (un)
JPH02140875U (un)
JPS6240867U (un)