JPH0197280A - Interior finish - Google Patents
Interior finishInfo
- Publication number
- JPH0197280A JPH0197280A JP25255687A JP25255687A JPH0197280A JP H0197280 A JPH0197280 A JP H0197280A JP 25255687 A JP25255687 A JP 25255687A JP 25255687 A JP25255687 A JP 25255687A JP H0197280 A JPH0197280 A JP H0197280A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin
- prepreg
- phenolic resin
- interior finish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 15
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract description 15
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 12
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 43
- 238000002485 combustion reaction Methods 0.000 abstract description 14
- -1 hydroxymethylene group Chemical group 0.000 abstract description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000779 smoke Substances 0.000 abstract description 9
- 229920000642 polymer Polymers 0.000 abstract description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000005011 phenolic resin Substances 0.000 abstract description 7
- 238000001035 drying Methods 0.000 abstract description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003365 glass fiber Substances 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 abstract description 3
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004831 Hot glue Substances 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000003063 flame retardant Substances 0.000 abstract description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 238000000034 method Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000002759 woven fabric Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 229920002620 polyvinyl fluoride Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920006269 PPS film Polymers 0.000 description 3
- 229920006266 Vinyl film Polymers 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 2
- 241000723346 Cinnamomum camphora Species 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229960000846 camphor Drugs 0.000 description 2
- 229930008380 camphor Natural products 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000001469 hydantoins Chemical class 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920002490 poly(thioether-sulfone) polymer Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- NYKRSGJRIJJRRK-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)sulfonylbenzene Chemical compound ClC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1Cl NYKRSGJRIJJRRK-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910019440 Mg(OH) Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229940053195 antiepileptics hydantoin derivative Drugs 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical class FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006241 epoxy vinyl ester resin Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical group C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
- Synthetic Leather, Interior Materials Or Flexible Sheet Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はマトリ、クス樹脂としてレゾール型フェノール
樹脂を含むプリプレグとポリフェニレンスルフィドフィ
ルム及び/又はポリサルホン系フィルムとを積層してな
る難燃性に優れた内装材に関し、特に航空機の内装用表
面材として用いられる。Detailed Description of the Invention (Field of Industrial Application) The present invention is a material having excellent flame retardancy, which is obtained by laminating a prepreg containing a resol-type phenolic resin as a matrix or a matrix resin, and a polyphenylene sulfide film and/or a polysulfone film. Regarding interior materials, it is particularly used as a surface material for aircraft interiors.
(従来技術及びその問題点ン
従来、高度に密閉性を有する高速輸送機に於て、客室等
の内装表面材は紙やポリ塩化ビニール等の熱可塑性樹脂
等を材料とした物が主として用いられているが、これら
の表面は傷付き易く、シかも汚れ易く、更に火災の際に
燃焼し多量の発煙をしたり、又、延焼の原因になった)
した。その為、高速輸送機、特に航空機に於てはエポキ
シ樹脂をマトリックスとしたグリシレグで裏打ちし、表
面にポリフッ化ビニールフィルムを張り付けた表面材を
従来から使用していたが、表面の傷や耐汚染性には優れ
ているものの室内火災発生時の発煙や発熱が大きく、航
空機の安全性の観点から大きな問題となっていた。(Prior art and its problems) Conventionally, in highly airtight high-speed transport aircraft, materials such as paper and thermoplastic resins such as polyvinyl chloride have been mainly used for the interior surface materials of cabins, etc. However, these surfaces are easily scratched, easily stained, and in the event of a fire, they burn, emitting a large amount of smoke, and causing the spread of the fire.)
did. For this reason, high-speed transport aircraft, especially aircraft, have traditionally used a surface material that is lined with Glyshireg, which has an epoxy resin matrix, and has a polyvinyl fluoride film attached to the surface. However, when an indoor fire occurs, it generates a lot of smoke and generates a lot of heat, which is a big problem from the perspective of aircraft safety.
(問題点を解決するための手段)
本発明者はこれらの点の改善を種々検討した結果裏打ち
用グリシレグとしてエポキシ樹脂の代りに7エノール樹
脂を用い、更にポリフッ化ビニルフィルムK(lポリフ
ェニレンスルフィドフィルム及び/又はポリサルホン系
フィルムを用いる事によジ燃焼時の発煙及び発#1を下
げ、かつ自己消火性を向上させる事に成功し本発明に至
った。(Means for Solving the Problems) As a result of various studies on improving these points, the present inventor used a 7-enol resin instead of an epoxy resin as the backing glycile resin, and also used polyvinyl fluoride film K (l polyphenylene sulfide film). By using a polysulfone film and/or a polysulfone film, the present invention has been achieved by successfully lowering smoke emission and emission #1 during combustion and improving self-extinguishing properties.
即チ、本発明は、ポリフェニレンスルフィドフィルム及
び/又はポリサルホン系フィルムとその裏打ち材として
マトリックス樹脂がレゾール型フェノール樹脂を少なく
とも30重量%含んでなるf IJ f Vグとを積層
してなる内装材。That is, the present invention provides an interior material formed by laminating a polyphenylene sulfide film and/or a polysulfone film and a backing material of which is a matrix resin containing at least 30% by weight of a resol type phenolic resin.
本発明の主要な構成要素は最表面及び/又はその印刷さ
れた内側層に使用されるポリフェニレンスルフィトフィ
ルム及び/又はポリサルホン系フィルム及び裏打ち材と
して用いるレゾール型フェノール樹脂を主成分とするマ
トリックスを用いたプリプレグにある。The main components of the present invention are a polyphenylene sulfite film and/or a polysulfone film used for the outermost surface and/or its printed inner layer, and a matrix mainly composed of a resol type phenolic resin used as a backing material. It is in the prepreg that was used.
従来主として航空機の内装表面材として用いらレテイる
のは、最外層に透明なテトラ−フィルム(7″−ボン社
製、ボソッ、化ビニルフィルムヲ有し、その内側に印刷
されたテトラ−フィルム、次いで裏側となるエポキシシ
リプレグより成シ、それらを加熱圧縮により薄板状に成
形されたものである。Conventionally, the material used mainly as an interior surface material for aircraft is a transparent Tetra film (7" made by Bonn Co., Ltd., made of a vinyl film) as the outermost layer, and a Tetra film printed on the inside of the transparent Tetra film (7" made by Bonn Co., Ltd.). Next, the back side was made of epoxy silicone preg, which was then heated and compressed to form a thin plate.
−本発明者らは、上記従来の内装表面材についての諸問
題を検討し、まずこの表面材の燃焼時の発煙及び発熱量
を下げる為にはエポキシシリプレグによる裏打ち材から
レゾール型フェノール樹脂プリプレグによる裏打ち材に
変える事が有効であるという知見を得た。そしてマトリ
、クス樹脂としてレゾール型フェノール樹脂を主成分と
するノリプレグとしては以下に示すものが適することを
も検討された。- The present inventors investigated various problems with the above-mentioned conventional interior surface materials, and first of all, in order to reduce smoke emission and heat generation when this surface material is burned, we changed the backing material from epoxy silipreg to resol type phenolic resin prepreg. We obtained the knowledge that it is effective to change to a backing material made of It was also considered that the following materials were suitable as Noripreg containing resol-type phenolic resin as the main component for matrices and camphor resins.
(1)含浸基材
織布、不織布、マット状、ペーパー状等、特にその繊維
形態は問わないが、強度を必要とする場合には織布が好
ましい。又、最終表面材とした際に適当なシボ模様を付
けるが織布で裏打ちした際、その織目がシボ模様に影響
したり、又低価格品とする時など、必要に応じて織布以
外の材料も使える。尚、該基材は単一層でなく、織布と
不織布、織布とマット等の複数の基材を組合せても良く
、特にその組合せは限定しない。(1) Impregnated base material The fiber form is not particularly limited, such as woven fabric, non-woven fabric, mat-like, paper-like, etc., but woven fabric is preferable when strength is required. In addition, when used as the final surface material, an appropriate grain pattern is applied, but when lining with woven fabric, the texture may affect the grain pattern, or when producing a low-priced product, a material other than woven fabric may be used. Materials can also be used. Note that the base material is not a single layer, and may be a combination of a plurality of base materials such as a woven fabric and a nonwoven fabric, a woven fabric and a mat, and the combination is not particularly limited.
この基材を構成する繊維の種類としては、ガラス繊維、
炭素繊維、アラミド繊維、その他のセラミック繊維等が
使用できる。特に、低価格を目指す時はガラス繊維、軽
量化に重点を置く時にはアラミツド繊維が適している。The types of fibers that make up this base material include glass fiber,
Carbon fiber, aramid fiber, other ceramic fibers, etc. can be used. In particular, glass fiber is suitable when aiming for low cost, and aramid fiber is suitable when emphasis is placed on weight reduction.
(2)マトリ、クス樹脂
この基材に含浸させるマトリ、クス樹脂としては少くと
もレゾール型フェノール樹脂を20重量%以上、好まし
くは30重量%以上含む、ものが使用される。(2) Matori, Chest resin The matrix or camphor resin impregnated into the base material contains at least 20% by weight or more, preferably 30% by weight or more, of a resol type phenolic resin.
又、マトリックス樹脂に難燃性を付与する為、水酸化ア
ルミニウム、水酸化マグネシウム、炭酸カルシウム、ア
ルミナ、酸化モリブデン、酸化アンチモン、酸化カルシ
ウム、酸化マグネシウム等の無機充填材やハロゲン類、
リン原子等を含んだ所謂難燃剤等をマトリ、クヌ樹脂中
0〜60重量%、好ましくは10〜50重量−の割合で
添加できる。更に、マトリックス樹脂による成形物の強
ジン性、柔軟性を向上する目的でエポキシ樹脂、ビニル
エステル樹脂等のレゾール型フェノール樹脂以外の他の
熱硬化性樹脂やナイロン樹脂、エチレン/酢ビ共重合樹
脂等の熱硬化性樹脂も0〜40重量%の割合で混合する
事が出来る。In addition, in order to impart flame retardancy to the matrix resin, inorganic fillers such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, alumina, molybdenum oxide, antimony oxide, calcium oxide, magnesium oxide, and halogens,
A so-called flame retardant containing phosphorus atoms etc. can be added to the matori or kunu resin in an amount of 0 to 60% by weight, preferably 10 to 50% by weight. Furthermore, in order to improve the strength and flexibility of molded products using matrix resins, other thermosetting resins other than resol-type phenolic resins such as epoxy resins and vinyl ester resins, nylon resins, and ethylene/vinyl acetate copolymer resins are used. It is also possible to mix thermosetting resins such as 0 to 40% by weight.
本発明でマトリックス樹脂に含まれるレゾール型フェノ
ール樹脂としてはフェノール1モル当9ヒドロキシメチ
レン基及びベンゼン環を結ぶメチレン基の総和を1.0
〜3.0倍モル有するものが好ましい、このようなレゾ
ール型フェノール樹脂はフェノール、クレゾール、レゾ
ルシノール、カテコール、ノヤラターシャリブチルフェ
ノール、パラターシャリブチル、カテコール等の芳香族
環に直接結合した水酸基を有するフェノール類に、ホル
ムアルデヒド、パラホルムアルデヒド、トリオキサン等
のアルデヒド類又はテトラミン等の様にメチレン基を付
加させる化合物をアルカリ触媒下で反応させて作る。上
記ヒドロキシメチレン基は芳香族環に直接結合するもの
が好ましい。かかるレゾール型フェノール樹脂中のヒド
ロキシメチレン基はポリマー化の際に架橋して低発煙性
能を与える要因の一つとなる。尚、上記ヒドロキシメチ
レン基及び上記メチレン基のモル比が3.0倍よフ大き
いとポリマー化した際硬くてもろくなシ、一方1、0よ
り小さいとポリマー化し難い傾向となる。In the present invention, the resol type phenolic resin contained in the matrix resin has a total of 9 hydroxymethylene groups and methylene groups connecting benzene rings per mole of phenol of 1.0.
Preferably, the resol-type phenolic resin has a mole of ~3.0 times, and has a hydroxyl group directly bonded to an aromatic ring such as phenol, cresol, resorcinol, catechol, noyara tert-butylphenol, para-tert-butyl, catechol, etc. It is produced by reacting phenols with aldehydes such as formaldehyde, paraformaldehyde, trioxane, or compounds that add methylene groups such as tetramine under an alkali catalyst. The above-mentioned hydroxymethylene group is preferably one that is directly bonded to an aromatic ring. The hydroxymethylene groups in such resol type phenolic resins are crosslinked during polymerization and become one of the factors that provide low smoke generation performance. If the molar ratio of the hydroxymethylene group to the methylene group is more than 3.0 times, the polymer will be hard and brittle, while if it is less than 1.0, it will be difficult to polymerize.
この様なレゾール型フェノール樹脂としては、上記条件
を満足する市販のフェノール樹脂が使え、例えば大日本
インキ化学工業■社製の商品名「7゜ライオ−フェン」
で市販されているフェノール樹脂が使用できる。As such a resol type phenol resin, a commercially available phenol resin that satisfies the above conditions can be used, such as "7° Liophen" manufactured by Dainippon Ink & Chemicals Co., Ltd.
A commercially available phenolic resin can be used.
通常、マトリ、ジス樹脂中の樹脂成分としては、レゾー
ル型フェノール樹脂単独でも差しつかえないが、強度上
、特に層間剪断強度(ILSS)や他材料と接合させる
場合の剥離強度が不足する場合にはエポキシ基含有オリ
ゴマー、即ちエポキシ樹脂を0〜60重量%、最適には
0〜50重量%含有することが出来る。かかるエポキシ
樹脂としては、ビスフェノールA型、ビスフェノールF
型、ノデラ、クフェノール型、アミノ型等の各種タイプ
のエポキシ樹脂が使用可能であり、エポキシ当量が80
〜800のものが好ましい。エポキシ当量は小さい程架
橋密度が大きくなって硬くなシ、逆にエポキシ当量が大
きい場合には架橋密度が小さくなり柔らかくなるため、
該樹脂のエポキシ当量は通常90〜800が良く、15
0〜300がよシ適しているが、柔らかいマトリックス
樹脂を必要とする場合等ではこの限シではない。このよ
うなエポキシ樹脂としては、例えば大日本インキ化学工
業■社製の「エピクロン」の商品名で市販されている各
種エポキシ樹脂が使用可能である。尚、難燃性を付与さ
せる為にはこれらエポキシ樹脂の中でも特にノブラック
フェノール型エポキシ樹脂が最適である。Normally, resol type phenolic resin alone can be used as the resin component in matori and diss resins, but in terms of strength, especially when interlaminar shear strength (ILSS) or peel strength when bonding with other materials is insufficient, The epoxy group-containing oligomer, ie, the epoxy resin, can be contained in an amount of 0 to 60% by weight, optimally 0 to 50% by weight. Such epoxy resins include bisphenol A type and bisphenol F type.
Various types of epoxy resins such as type, nodella, cuphenol type, and amino type can be used, and epoxy resins with an epoxy equivalent of 80
~800 is preferred. The lower the epoxy equivalent, the higher the crosslinking density and the less hardness; conversely, the higher the epoxy equivalent, the lower the crosslinking density and the softer it becomes.
The epoxy equivalent of the resin is usually 90 to 800, preferably 15
A value of 0 to 300 is most suitable, but this is not the limit in cases where a soft matrix resin is required. As such an epoxy resin, for example, various epoxy resins commercially available under the trade name "Epicron" manufactured by Dainippon Ink & Chemicals, Inc. can be used. Among these epoxy resins, Novlac phenol type epoxy resin is particularly suitable for imparting flame retardancy.
エポキシ樹脂を併用する場合、窒素原子に直接結合する
水素原子、好ましくは該水素原子3〜5個を有するアミ
ノ化合物を添加する事が好ましい。When an epoxy resin is used in combination, it is preferable to add an amino compound having hydrogen atoms, preferably 3 to 5 hydrogen atoms, directly bonded to nitrogen atoms.
かかるアミノ化合物は通常エポキシ樹脂の硬化剤として
使用されているものであれば使用可能である。例えば、
ジアミノジフェニルスルホン、ジシアンジアミド、グリ
シジルアミン、ヘキサメチレンジアミン等の芳香族及び
脂肪族アミン類:ヒダントイン類;イソシアヌレート類
等の各種のアミンが使用可能であるが、本発明の組成物
を用いて得られる成形材料が強化用繊維を含んだB−ス
テージ状態、所謂プリプレグとして使用される場合には
ジアミノジフェニルスルホンやジシアンジアミド等のア
ミンが保管時の安定性が良く、シかも硬化時の加熱によ
り急速に硬化するという点てより優れている。該アミノ
化合物の添加によシ複合材料の強度、特に層間剪断強度
(ILSS)が向上する。Any such amino compound that is commonly used as a curing agent for epoxy resins can be used. for example,
Various amines such as aromatic and aliphatic amines such as diaminodiphenylsulfone, dicyandiamide, glycidylamine, and hexamethylene diamine; hydantoins; isocyanurates can be used; When the molding material is used in a B-stage state containing reinforcing fibers, so-called prepreg, amines such as diaminodiphenylsulfone and dicyandiamide have good stability during storage and can be cured rapidly by heating during curing. It's better than that. The addition of the amino compound improves the strength of the composite material, especially the interlaminar shear strength (ILSS).
その添加量は窒素原子に直接結合する水素原子、通常活
性水素の量が前記エポキシ樹脂のエポキシ基の0.5〜
2倍当量であり、0.8〜1.5倍当量がよシ望ましい
。この範囲を大きく離れ九添加量であるとILSS値が
下が9望ましくない。更に硬化促進剤としてクロロフェ
ニル化尿素、三弗化ホウ素誘導体、ヒダントイン誘導体
等も併用可能である。The amount added is a hydrogen atom directly bonded to a nitrogen atom, and the amount of active hydrogen is usually 0.5 to 0.5 to the epoxy group of the epoxy resin.
2 times equivalent, and 0.8 to 1.5 times equivalent is more desirable. If the amount added is far outside this range, the ILSS value will be lower than 9, which is undesirable. Furthermore, chlorophenylated urea, boron trifluoride derivatives, hydantoin derivatives, etc. can also be used as curing accelerators.
本発明に於ては成形硬化時のレジン70−、表面の滑ら
かさ、他材料との接合性及び柔軟性の調節等の為にエチ
レン−酢酸ビニール共重合体又は/及びポリアミド樹脂
等をレゾール製フェノール樹脂よシも多くならない範囲
で加える事ができ、フェノール樹脂100重量部に対し
て0〜80重量部、特に好ましくは20〜60重量部加
える事ができる。In the present invention, ethylene-vinyl acetate copolymer or/and polyamide resin is used to make the resin 70-, surface smoothness, bondability with other materials, flexibility, etc. during molding and curing. The amount of phenol resin can be added within a range that does not increase the amount, and it can be added in an amount of 0 to 80 parts by weight, particularly preferably 20 to 60 parts by weight, per 100 parts by weight of phenol resin.
更に本発明の特徴となる難燃性及び低発煙性をよシ向上
せしめる目的で水酸化アルミニウム及び水酸化マグネシ
ウムを加える事が好ましく、その量は樹脂配合物全体の
中で10〜60重量%を占める割合で加える事が好まし
く、より好ましくは20〜50重量%が適している。又
、この両者の中ではAj(OH)3が配合物の粘度を高
める割合が少ない事でよp適している。Furthermore, it is preferable to add aluminum hydroxide and magnesium hydroxide for the purpose of further improving the flame retardancy and low smoke emission properties that are the characteristics of the present invention, and the amount thereof is 10 to 60% by weight based on the entire resin composition. It is preferable to add it in proportion, more preferably 20 to 50% by weight. Furthermore, of the two, Aj(OH)3 is more suitable because it increases the viscosity of the blend in a smaller proportion.
本発明に使用されるグリプレグは前記のフェノール樹脂
及びAn(OH)3及び/又はMg(OH)2 k含む
ことが好ましく、通常これらが互いに反応していない状
態で含有されるか、又、その内の一部を予め反応させて
おいたものが含有されても良い。The glypreg used in the present invention preferably contains the above-mentioned phenolic resin and An(OH)3 and/or Mg(OH)2k, and is usually contained in a state in which these are not reacted with each other, or It may also contain a portion of which has been reacted in advance.
かかるプリプレグは予め配合したマトリックス樹脂にメ
チルエチルケトン、アセトン、メタノール等の溶剤を加
えて粘度を調整した後、前記含浸基材に含浸し、更に溶
剤の除去及びマ) IJフックス脂のB−ステージ化を
目的にして加熱乾燥させて得る事が出来る。Such a prepreg is prepared by adding a solvent such as methyl ethyl ketone, acetone, or methanol to a pre-blended matrix resin to adjust the viscosity, and then impregnating the impregnated base material, followed by removal of the solvent and ma) B-staging of IJ Fuchs resin. It can be obtained by heating and drying it.
本発明に於けるグリプレグの樹脂含有量は20〜50重
量%が適当でちゃ1例えばメチルエチルケトンで希釈し
て100センチポイズの粘度としたマトリックス樹脂配
合物を300 P/−の重さを有するガラス織布に含浸
させ、100℃、10分間の乾燥で得る事ができる。The resin content of the Gripreg according to the present invention is suitably 20 to 50% by weight.1 For example, the matrix resin formulation diluted with methyl ethyl ketone to a viscosity of 100 centipoise is prepared using a glass woven fabric having a weight of 300 P/-. It can be obtained by impregnating it with water and drying it at 100°C for 10 minutes.
次に本発明の内装材の1つを構成するフィルムについて
記す。Next, a film constituting one of the interior materials of the present invention will be described.
本発明に使用されるフィルムは、ポリフェニレンサルフ
ァイド(pps)系ポリマー及び/又はポリサルホン系
ポリマーを主成分としたフィルムであり、厚さ10〜.
100 pmが適しておシ、特に15〜50μmが最適
である。The film used in the present invention is a film mainly composed of polyphenylene sulfide (pps)-based polymer and/or polysulfone-based polymer, and has a thickness of 10-.
A suitable thickness is 100 pm, particularly 15 to 50 μm.
かかるフィルムはPPS又はポリサルホン系ポリマー単
独でも良く、又それらを混合した組成でも良い。Such a film may be made of PPS or polysulfone polymer alone, or may be a mixture of them.
上記フィルムの主成分を成すPPS及びポリサルホン系
ポリマーは次の様にして得る事が出来る。PPS and polysulfone-based polymers, which constitute the main components of the above film, can be obtained in the following manner.
まず、PPSは例えばジクロルペンと硫化ソーダ七N−
メチルピロリドン中で安息香酸ナトリウム及び水酸化ナ
トリウムとで200℃で脱NaCJ、する。First, PPS is, for example, dichlorpene and sodium sulfide 7N-
De-NaCJ with sodium benzoate and sodium hydroxide in methylpyrrolidone at 200°C.
この調製法の具体例は例えば昭和57年特願第9138
2号の実施例に見る事ができる。A specific example of this preparation method is, for example, Patent Application No. 9138 filed in 1982.
This can be seen in Example No. 2.
又、ポリサルホン系ポリマーとしては各種のものがある
が、例えばポリチオエーテルサルホンはクロルフェニル
スルホンと硫化ソーダをN−メチルピロリドン中で水酸
化ナトリウムの存在下で反応させて得る事が出来る。こ
の作υ方の詳細は例えば特開昭62−115030号に
見る事ができる。There are various types of polysulfone polymers, and for example, polythioether sulfone can be obtained by reacting chlorphenylsulfone and sodium sulfide in N-methylpyrrolidone in the presence of sodium hydroxide. Details of this method can be found in, for example, Japanese Patent Application Laid-open No. 115030/1983.
又、ポリサルホン、ポリエーテルサルホン、ポリアリー
ルサルホン等も挙げることができ、それらも公知の方法
によシ得る事ができる。Also included are polysulfone, polyethersulfone, polyarylsulfone, etc., which can also be obtained by known methods.
こレラポリフェニレンスルフィド及びポリサルホン類の
フィルム化はT−ダイによる押出し法、二軸延伸法、ブ
ロー法等により行うが、例えば特開昭54−14227
5号、特開昭56−62121号、特開昭55−349
67号及び特願昭57−91382号等に詳述されてい
る方法で行っても良い。Formation of polyphenylene sulfide and polysulfone into a film is carried out by extrusion using a T-die, biaxial stretching, blowing, etc.
No. 5, JP-A-56-62121, JP-A-55-349
The method described in detail in No. 67 and Japanese Patent Application No. 57-91382 may also be used.
又これらのフィルムはその含有量が全重量の50%を越
えない範囲で他の熱可塑性ポリマー例えばナイロン、ポ
リカーゲネート、ボリア、化ビニール、ボワッ、化ビニ
リデン、ポリエーテルケトン等を加える事もフィルム成
形上、又その加工上良好な性能を与える場合も多く、そ
の使用を特に制限しない。These films may also contain other thermoplastic polymers such as nylon, polycargenate, boria, vinylide, bois, vinylidene chloride, polyetherketone, etc., to the extent that the content does not exceed 50% of the total weight. , and often provide good processing performance, so there are no particular restrictions on its use.
本発明に於て、上記フィルムは次の様に使用される。In the present invention, the above film is used as follows.
■ 内装材の一番外側の透明フィルムとして使用される
。■ Used as the outermost transparent film of interior materials.
この場合裏側に接着剤が3〜40綿の厚さで、好ましく
は5〜15μmの厚さで塗布され前記シリプレグと接着
される。これに用いられる接着剤は、いわゆるアクリル
系接着剤、ウレタン系接着剤、エポキシ系接着剤、ポリ
アミド系接着剤等であり、云わゆるホットメルト系接着
剤であれば特に限定なく使用できる。又、この際、フィ
ルム面にコロナ放電処理等の活性化処理を施す事は接着
強度向上の為にも好ましい。In this case, an adhesive is applied to the back side to a thickness of 3 to 40 μm, preferably 5 to 15 μm, and bonded to the silicon preg. Adhesives used here include so-called acrylic adhesives, urethane adhesives, epoxy adhesives, polyamide adhesives, etc., and so-called hot melt adhesives can be used without particular limitations. Further, at this time, it is preferable to subject the film surface to activation treatment such as corona discharge treatment in order to improve adhesive strength.
尚、かかる透明フィルムとしてポリフッ化ビニールフィ
ルムを用いることができ、その際には!リグレグ層との
間にポリフェニレンスルフィドフィルム及び/又はポリ
サルホン系フィルムを積層する必要がある。In addition, a polyvinyl fluoride film can be used as such a transparent film, and in that case! It is necessary to laminate a polyphenylene sulfide film and/or a polysulfone film between the regreg layer and the regreg layer.
■ 他の使用方法として図柄を印刷するフィルムとして
使用する事が出来る。■ Another way to use it is to use it as a film for printing designs.
この際に使用するフィルムは特に透明である必要はなく
、酸化チタン、炭酸カルシウム、その他の無機化合物の
添加により白色に仕上げられたフィルムでも良い。The film used in this case does not need to be particularly transparent, and may be a film finished white by adding titanium oxide, calcium carbonate, or other inorganic compounds.
この場合の使用に際しては、フィルムの両面をコロナ放
電、その他で活性化しておく事が印刷の容易さ及びプレ
ス成形の際グリプレグとの接着の容易さの点でよシ好ま
しい。又、印刷する場合のインキの厚さについても、本
発明の目的である難燃性の付与の為には厚過ぎる事は好
ましくなく、又余りに薄過ぎると色ムラ等の原因ともな
シ易く、5〜40μmの厚さが適し、10〜20μmが
より最適である。When used in this case, it is preferable to activate both sides of the film by corona discharge or other means from the viewpoint of ease of printing and ease of adhesion to Gripreg during press molding. Also, regarding the thickness of the ink used for printing, it is not preferable to be too thick in order to impart flame retardancy, which is the objective of the present invention, and if it is too thin, it is likely to cause color unevenness. A thickness of 5-40 μm is suitable, with 10-20 μm being more optimal.
尚、かかる印刷フィルムとグリプレグとの接着は上記の
と同様に行なわれる。この際印刷フィルムの接着面は該
フィルムの上に透明フィルムが積層される場合には印刷
されていない面が、又、透明フィルムが積層されない場
合には印刷された面が好ましい。The adhesion between the printed film and Gripreg is carried out in the same manner as described above. In this case, the adhesive side of the printed film is preferably the unprinted side when a transparent film is laminated on the film, and the printed side when no transparent film is laminated.
又、印刷フィルムとしてポリフェニレンスルフィドフィ
ルム及び/又はポリサルホン系フィルムが用いられる場
合には透明フィルムとして同種のフィルムを用いること
ができるが、ポリス、化ビニールフィルムを用いてもよ
い。Furthermore, when a polyphenylene sulfide film and/or a polysulfone film is used as the printing film, the same type of film can be used as the transparent film, but polystyrene or vinyl film may also be used.
■ 更に、上記のと■のフィルムを併用することもでき
る。(2) Furthermore, the above films and (2) can also be used together.
本発明の内装材は最終的に次の様にして作る事が出来る
。The interior material of the present invention can finally be produced as follows.
裏側に糊を塗布した透明フィルム及び/又は印刷したフ
ィルム、!リグレグの記載順に重ね合せ、その上下に離
型の為の例えばポリグロビレンフイルム等を合せて加熱
圧縮成形して作る。その際の加熱圧縮成形は例えば10
0〜150℃の温度、5〜50ゆ/3雪 の圧力下、
20−180分の保持時間で硬化させて行う事が出来る
。Transparent film with glue on the back side and/or printed film,! They are made by stacking the regregs in the order listed, and then placing, for example, polyglopylene film, etc., on top and bottom of the regregs for release, and then heating and compression molding them. The heat compression molding at that time is, for example, 10
At a temperature of 0 to 150℃, under a pressure of 5 to 50 Yu/3 snow,
This can be done by curing with a holding time of 20-180 minutes.
本発明の内装材は上記の少くとも2層を最低含む事が条
件であるが、必要に応じてその他の材料を加える事も出
来る。例えば他のフィルム、プリプレグ、アルミニュー
ム箔等の金属箔等も加える事ができる。The interior material of the present invention must contain at least the above-mentioned two layers, but other materials may be added as necessary. For example, other films, prepregs, metal foils such as aluminum foils, etc. can also be added.
本発明の内装材を使用する場合、他の壁材に張フ付ける
か、又は他の壁材と一体で成形して使うかのどちらかの
方法が一般的である。When using the interior material of the present invention, it is generally either attached to other wall materials or molded integrally with other wall materials.
特に高速輸送機、そのうちの航空機等の内装材として使
用する場合にはその壁材は軽量でしかも壁としての強度
を保持する目的でハニカム構造体を使用する事が多い。In particular, when used as interior materials for high-speed transport aircraft, including aircraft, honeycomb structures are often used for the purpose of being lightweight and maintaining wall strength.
この・場合、予め作っておいたハニカム構造体を芯とす
るサンドイッチツクネルを作っておき、本発明の内装材
を接着剤又は粘着剤により張り付けて使用する方法があ
る。この際の接着剤としては常温で硬化するポリウレタ
ン接着剤、エポキシ接着剤等の2液型接着剤を使う事が
多い。In this case, there is a method in which a sandwich tunnel is made with a honeycomb structure made in advance as a core, and the interior material of the present invention is attached to the sandwich tunnel using an adhesive or a pressure-sensitive adhesive. As the adhesive in this case, a two-component adhesive such as a polyurethane adhesive or an epoxy adhesive that hardens at room temperature is often used.
又、第二の方法として、本発明による積層板を予め表面
に付けた壁材として成型しておいて使用する方法がある
。即ち、ハニカム構造体の両側に例えば本発明で用いら
れる!リグレグをあて、その上に本発明でのフィルムを
あててカロ熱、加圧成形して作る方法である。As a second method, there is a method in which the laminate according to the present invention is previously molded as a wall material attached to the surface and then used. That is, on both sides of the honeycomb structure, for example, used in the present invention! This is a method of manufacturing by applying a regreg, applying the film of the present invention thereon, and applying heat and pressure molding.
本発明の内装材の使用方法については特に限定するもの
ではなく、例えば上記方法の内どちらを取っても良い。The method of using the interior material of the present invention is not particularly limited, and for example, any of the above methods may be used.
(実vffi例ン 以下、本発明全実施例に従い説明する。(actual vffi example) Hereinafter, all embodiments of the present invention will be explained.
ヒドロキシメチレン/フェノール モル比1.6のレゾ
ール型フェノール樹脂R−53(DIC社友)60重i
ts、 ポリアミド樹脂ラッカマイト5003(DI
C製)15重量係、及び水酸化アルミニウム(試薬−級
)25重量%をメタノール中で均一混合物とし粘度10
0センチポイズの配合液とした。この配合Kt−300
1/ln”の目付量を有するガラスクロス5L8213
B(旭ファイバーガラス社製)に含浸し、100℃、1
0分間の乾燥により、!リプレグを作った。樹脂含有量
40重il優であった。Hydroxymethylene/phenol resol type phenolic resin R-53 (Friend of DIC) 60 weight i with a molar ratio of 1.6
ts, polyamide resin Laccamite 5003 (DI
C) 15% by weight and aluminum hydroxide (reagent grade) 25% by weight were made into a homogeneous mixture in methanol, and the viscosity was 10.
It was made into a mixed liquid of 0 centipoise. This combination Kt-300
Glass cloth 5L8213 with a basis weight of 1/ln"
B (manufactured by Asahi Fiber Glass Co., Ltd.) and heated at 100°C for 1
By drying for 0 minutes,! I made a repreg. The resin content was more than 40 weight il.
このプリプレグをアウスゲンW−63040と名付けた
。This prepreg was named Ausgen W-63040.
参考例1
片側に2波型ウレタン接着剤(チバ・ガイギー社製〕を
塗布した厚さ25μmの透明なボリア、化ビニールフィ
ルム、片側に印刷した38μm厚さのポリフッ化化ビニ
ールフィルムびエポキシグリプレグ(アウスデンW−3
100G、大日本インキ化学社製]を合せて、130℃
、15に97cm2の圧力下1時間でプレス成形し厚さ
200μmの積層板を作った0
JIS L−1091A−4による垂直燃焼試験の結果
、表面フィルムの燃焼が非常に激しく、残炎時間25秒
で燃焼距離は20mであった。Reference example 1: 25 μm thick transparent boria coated with two-wave urethane adhesive (manufactured by Ciba Geigy) on one side, PVC film, 38 μm thick polyfluorinated vinyl film printed on one side, and epoxy grip preg. (Ausden W-3
100G, manufactured by Dainippon Ink Chemical Co., Ltd.] together at 130℃
, 15 was press-formed under a pressure of 97 cm2 for 1 hour to make a laminate with a thickness of 200 μm.0 As a result of a vertical combustion test according to JIS L-1091A-4, the burning of the surface film was very intense, and the afterflame time was 25 seconds. The combustion distance was 20m.
参考例2
厚さ25μmの透明なポリ7ツ化ビニールフイルム(D
u Pont社製)に2液量ウレタン系接着剤(チパガ
イギー#〕を厚さLoamで塗布した。予め作っておい
た38μm厚のポリフッ化ビニールフィルム印刷物及び
フェノールプリグレグ(アウス?ン、W−6304G
DIC製ンを1枚合せて1301:、151/、”圧力
下1時間でプレス成形に厚さ200μmの積層板を作っ
た。これをJIS L−1091A4に従い垂直燃焼試
験を行った。表面のフィルム面での燃焼が激しく残炎時
間は5秒、燃焼距離は10儒であった口
実施例1
厚さ25μmの透明なPPSフィルムの片側に2液型ウ
レタン系接着剤を10μm厚さで塗布した。Reference example 2 25 μm thick transparent polyvinyl 7thamide film (D
A two-component urethane adhesive (Chipa Geigy #) was applied to a thickness of Loam on a 38 μm thick polyfluoride film printed material and a phenol prepreg (Austin, W-6304G) made in advance.
A laminate with a thickness of 200 μm was made by press-molding 1301:, 151/, 1301:, 151/, 200 μm thick laminates under pressure for 1 hour. This was subjected to a vertical combustion test in accordance with JIS L-1091A4. The afterflame time was 5 seconds and the combustion distance was 10 seconds.Example 1 A two-component urethane adhesive was applied to one side of a 25 μm thick transparent PPS film to a thickness of 10 μm. .
予め作りておいた38μm厚さのポリフッ化ビニールフ
ィルム印刷物及びフェノール系グリプレグ(アウスゲン
W−6304G DIC製)1枚を合せて130℃、1
5kl//cm”の圧力下で1時間プレス成形して厚さ
200μmの積層板を作った。A pre-made 38 μm thick polyvinyl fluoride film printed matter and 1 sheet of phenolic Gripreg (Ausgen W-6304G manufactured by DIC) were combined at 130°C for 1 hour.
A laminate with a thickness of 200 μm was produced by press molding for 1 hour under a pressure of 5 kl//cm”.
これをJIS L−1091A4に従い垂直燃焼試験を
行うと残炎時間2.0秒で燃焼距離8画であり、フィル
ム面での残炎がなく、参考例と比べて明らかに難燃性に
優れている事が判った。When this was subjected to a vertical combustion test according to JIS L-1091A4, the afterflame time was 2.0 seconds and the combustion distance was 8 strokes, there was no afterflame on the film surface, and the flame retardance was clearly superior compared to the reference example. I found out that there was.
実施例2
片側にウレタン接着剤の塗布された25μm厚さの透明
なPPS フィルム、予め両面にコロナ放電処理を施し
た38μm厚さのPPSフィルムの片側に印刷したフィ
ルム及び前記フェノールプリグレグを合せて同様にプレ
ス成形し厚さ200μmの積層板を作った。Example 2 A 25 μm thick transparent PPS film coated with urethane adhesive on one side, a 38 μm thick PPS film which had been previously subjected to corona discharge treatment on both sides, a film printed on one side, and the phenol pregreg were combined. A laminate plate with a thickness of 200 μm was produced by press molding in the same manner.
JIS L−1091A4による垂直燃焼試験の結果フ
ィルム面での燃焼は小さく残炎時間0秒、燃焼距gI7
0であり、非常に優れた難燃性を示した。As a result of the vertical combustion test according to JIS L-1091A4, the combustion on the film surface was small, the afterflame time was 0 seconds, and the combustion distance gI7.
0, indicating extremely excellent flame retardancy.
実施例3
片側にウレタン接着剤の塗布された25μm厚さの透明
なポリ7ツ化ビニールフイルム、片側に印刷した38μ
m厚さのポリチオエーテルサルホンフィルム(大日本イ
ンキ化学社製〕及び前記フェノール系グリプレグを用い
て積層板を作った。Example 3 25 μm thick transparent polyvinyl 7thide film coated with urethane adhesive on one side, 38 μm printed on one side
A laminate was made using a polythioethersulfone film (manufactured by Dainippon Ink Chemical Co., Ltd.) with a thickness of m and the phenolic Gripreg.
垂直燃焼試験によシ残炎時間2.5秒、燃焼距離8.5
mであシ、参考例に比べて優れた難燃性を示した。Vertical combustion test: afterflame time 2.5 seconds, combustion distance 8.5 seconds
It showed excellent flame retardancy compared to the reference example.
(発明の効果〕
本発明は燃焼時の発煙蓋及び発熱量が低く、かつ自己消
火性に優れた内装材をもたらすことができる。(Effects of the Invention) The present invention can provide an interior material that generates smoke during combustion, has a low calorific value, and has excellent self-extinguishing properties.
Claims (1)
ルホン系フィルムとその裏打ち材としてマトリックス樹
脂がレゾール型フェノール樹脂を少なくとも20重量%
含んでなるプリプレグとを積層してなる内装材。A polyphenylene sulfide film and/or a polysulfone film and a matrix resin as its backing material contain at least 20% by weight of a resol type phenolic resin.
An interior material made by laminating prepreg containing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25255687A JP2679060B2 (en) | 1987-10-08 | 1987-10-08 | Interior materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25255687A JP2679060B2 (en) | 1987-10-08 | 1987-10-08 | Interior materials |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0197280A true JPH0197280A (en) | 1989-04-14 |
JP2679060B2 JP2679060B2 (en) | 1997-11-19 |
Family
ID=17239012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25255687A Expired - Fee Related JP2679060B2 (en) | 1987-10-08 | 1987-10-08 | Interior materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2679060B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10115047A (en) * | 1996-10-09 | 1998-05-06 | Aica Kogyo Co Ltd | Material reinforcing method and fiber reinforced decorative sheet |
US9382384B2 (en) | 2013-12-27 | 2016-07-05 | Nano Cms Co., Ltd. | μ-polyoxo crosslinked phthalocyanine compound, preparing method thereof, and near infrared ray absorbing and reflecting composition using the same |
CN106905500A (en) * | 2017-03-06 | 2017-06-30 | 北京玻钢院复合材料有限公司 | Sweat connecting material thermosetting phenolic resin and preparation method thereof |
-
1987
- 1987-10-08 JP JP25255687A patent/JP2679060B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10115047A (en) * | 1996-10-09 | 1998-05-06 | Aica Kogyo Co Ltd | Material reinforcing method and fiber reinforced decorative sheet |
US9382384B2 (en) | 2013-12-27 | 2016-07-05 | Nano Cms Co., Ltd. | μ-polyoxo crosslinked phthalocyanine compound, preparing method thereof, and near infrared ray absorbing and reflecting composition using the same |
CN106905500A (en) * | 2017-03-06 | 2017-06-30 | 北京玻钢院复合材料有限公司 | Sweat connecting material thermosetting phenolic resin and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2679060B2 (en) | 1997-11-19 |
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