JPH0196261U - - Google Patents
Info
- Publication number
- JPH0196261U JPH0196261U JP18972087U JP18972087U JPH0196261U JP H0196261 U JPH0196261 U JP H0196261U JP 18972087 U JP18972087 U JP 18972087U JP 18972087 U JP18972087 U JP 18972087U JP H0196261 U JPH0196261 U JP H0196261U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pot
- section
- soldering device
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000002893 slag Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Molten Solder (AREA)
Description
第１図は、本考案に係るコイル端子用半田付け
装置の構成を示す斜視図、第２図は、第１図のコ
イル端子用半田付け装置に利用するフラツクス塗
布装置の構成を示す斜視図、第３図は他の実施例
を示す要部断面図、第４図は第３図のコイル端子
用半田取付け装置の要部平面図、第５図は従来の
コイル端子用半田付け装置の構成を示す要部断面
図である。
１１…半田ポツト部、１２…ポツト、１３…コ
イル、１３ａ…端子、１４…ヒータ部、１６…電
熱ヒータ、２５…回収皿、３２…糸半田、３４…
取付け治具、Ａ…反転機構、Ｂ…糸半田自動供給
機構。
FIG. 1 is a perspective view showing the configuration of a coil terminal soldering device according to the present invention, FIG. 2 is a perspective view showing the configuration of a flux application device used in the coil terminal soldering device of FIG. 1, FIG. 3 is a sectional view of the main parts showing another embodiment, FIG. 4 is a plan view of the main parts of the coil terminal soldering device shown in FIG. 3, and FIG. 5 shows the configuration of the conventional coil terminal soldering device. FIG. DESCRIPTION OF SYMBOLS 11... Solder pot part, 12... Pot, 13... Coil, 13a... Terminal, 14... Heater part, 16... Electric heater, 25... Collection plate, 32... Thread solder, 34...
Installation jig, A...reversing mechanism, B...automatic thread solder supply mechanism.
Claims (1)
用のポツトを備えた半田ポツト部と、該半田ポツ
ト部に脱着自在に結着されたヒータ部と、半田ポ
ツト部及びヒータ部を反転させる反転機構と、ポ
ツト上面を往復摺動する半田滓取り兼用の均し板
と、ポツトに糸半田を供給する糸半田自動供給機
構とから成ることを特徴とするコイル端子用半田
付け装置。 A solder pot section that has a pot for storing molten solder that is large enough to allow insertion of a coil terminal, a heater section that is detachably connected to the solder pot section, and an inversion mechanism that inverts the solder pot section and the heater section. A soldering device for coil terminals, comprising: a leveling plate that also serves as a solder slag remover that slides back and forth on the top surface of the pot; and an automatic thread solder supply mechanism that supplies thread solder to the pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18972087U JPH0224540Y2 (en) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18972087U JPH0224540Y2 (en) | 1987-12-14 | 1987-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0196261U true JPH0196261U (en) | 1989-06-26 |
| JPH0224540Y2 JPH0224540Y2 (en) | 1990-07-05 |
Family
ID=31480735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18972087U Expired JPH0224540Y2 (en) | 1987-12-14 | 1987-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224540Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008513211A (en) * | 2004-09-15 | 2008-05-01 | 白光株式会社 | Electrically controlled solder bath equipment |
-
1987
- 1987-12-14 JP JP18972087U patent/JPH0224540Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008513211A (en) * | 2004-09-15 | 2008-05-01 | 白光株式会社 | Electrically controlled solder bath equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0224540Y2 (en) | 1990-07-05 |
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