JPH0194628A - Chip bonding apparatus - Google Patents

Abstract

PURPOSE:To provide a chip bonding apparatus capable of bonding chips disposed on chip trays efficiently without requiring man power and still having improved space efficiency, by providing a chip supply mechanism constituted by a specific stock table, a specific pitch feeding device and specific pick-up means. CONSTITUTION:In a chip bonding apparatus, a chip supply mechanism A sequentially bonds chips C to substrates F on a substrate transportation device 4. The chip supply mechanism A comprises a stock table 8 carrying thereon a predetermined number of piledup chip trays 1 each holding a predetermined number of chips C aligned in a plurality of rows and columns; a pitch feeding device 12 for pitch feeding the chip trays 1 transferred one by one from the stock table 8 to a conveyor path 13 at the same pitch that the chips C are alinged in columns: and a pick-up means 18 for sequentially picking up the chips C alinged in rows on each chip tray 1 which has been pitch fed and bonding them on the substrate F on the bonding substrate transportation device 4.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a chip bonding apparatus, and relates to an apparatus that is highly space efficient and configured to dramatically extend the continuous operation time of the chip bonding apparatus.

[Conventional technology]

It is well known that manufacturing of ICs, LSIs, etc. includes a step of bonding a semiconductor element chip (hereinafter simply referred to as a chip) onto a lead frame. In response to the decline in the yield of chips on wafers due to the increase in the size of chips accompanying high integration, we decided to do this instead of picking up chips on an expandable tape and bonding them directly onto the lead frame. ,
The pick-up process for picking up chips from the expanded tape and the chip bonding process for bonding the chips onto the lead frame are separated, and once in the pick-up process, only good chips with no batho markings on the expanded tape are picked up and placed on a tray. In the chip bonding process, a method of bonding the chips on a tray is sometimes used. This is because when chips with bad marks appear consecutively on the expanded tape, the pickup operation by the collet or the operation of the bonding machine stops while the chips are recognized, which deteriorates the bonding efficiency and makes the control of the bonding machine more complicated. This is to eliminate the drawbacks of the conventional chip bonding process that has been commonly performed. The tray 1 is made of a thin resin plate having a rectangular shape in plan view as shown in FIG. 6, and is capable of holding a plurality of chips C in a plurality of columns and rows in a rectangular recess 2 formed on its upper surface. Moreover, the tray 1 itself is configured so that a plurality of sheets can be stacked while holding the chips C. In the bonding apparatus 3 corresponding to this tray 1, as shown in the schematic configuration in FIG. An XY table 6 that can drive the cassette 5 in the XY direction is arranged. Then,
The pickup means 7 having a vacuum chuck function is
Chips C sequentially guided to predetermined positions by table 6
are sequentially conveyed onto the lead frame F and bonded.

[Problems to be solved by the invention]

By the way, conventionally, placing the tray 1 on the tray cassette 5 required manual labor. That is, the operator had arranged the trays 1 full of chips C one by one on the tray cassette 5. This type of work is inefficient and prone to handling errors, and since the number of trays 1 that can be placed on the tray cassette 5 at one time is limited, the bonding device 3 is Another problem was that the amount of time they could drive was relatively short. Note that the bonding device 3
If we only consider extending the continuous operation time of
It would be better to expand the area of the tray cassette 5 and increase the number of trays 1 that can be placed on it at one time, but then,
It is necessary to replace the X-Y table 6 with a larger and more expensive one by extending the travel strokes of the X-Y table 6 in the X and Y directions, and the lead frame conveying device for the X-Y table must be replaced. There is a problem in that the distance from the pick-up means 7 becomes longer and the space efficiency deteriorates, and as a result, the reciprocating distance of the pickup means 7 from the pink-up position to the bonding position becomes longer, which actually worsens the bonding efficiency. This invention solves the above-mentioned conventional problems all at once, allows chips on a tray to be bonded efficiently without requiring human labor, and also improves the space efficiency of the entire bonding device. The purpose is to provide a chip bonding device that can perform the following steps.

[Means for solving simple problems]

In order to solve the above problem, the present invention takes the following technical measures. That is, in a chip bonding apparatus in which chips are sequentially bonded to substrates on a bonding substrate transport device by a chip supply mechanism, the chip supply mechanism stacks a predetermined number of chip trays each holding a predetermined number of chips aligned in a plurality of columns and a plurality of rows. a pitch feeding device that pitch-feeds the chip tray, which is transferred one by one from the stock table onto a conveyance path, at the same pitch as the alignment pinch in the chip column direction; and the chip tray. The device includes pink amplifier means for sequentially pinking up the chips lined up in the row direction on the tray and bonding them to the substrate on the bonding substrate transfer device in a state in which the chips are fed at each pitch.

[Action and effect]

First, in the bonding apparatus of the present invention, chip trays for holding a plurality of chips in alignment are placed on a stock table in a stacked state.The bonding apparatus operates continuously until there are no more chip trays on the stock table. However, simply by increasing the number of chip trays to be stocked, the continuous operation time of the bonding machine can be dramatically extended. Moreover, the chip trays on the stock table are not placed in large numbers in a plane direction, but are placed in a stacked state, so even if the number of chip trays increases, it does not take up much space. Next, the chip trays stacked on the stock table are transferred one by one onto the conveyance path of the pitch feeder. A known chucking device can be used for this. On the pinch feeder, the chip tray is pinch-fed in the column direction at the same pitch as the five chips it holds in the column direction, and while the chip tray is stopped, the pick-up means sequentially picks up the chips lined up in the row direction and transfers them to the bonding substrate. Bonding to the substrate on the transport device. Then, when there are no more chips in the row direction, the chip tray moves forward by one pinch as described above, and the pickup means performs the operation as described above. When bonding of all the chips on one chip tray is completed in this way, the next chip tray is introduced from the stock table onto the pitch feeding device, and the above-described pick amplifier operation is repeated. That is, the bonding apparatus of the present invention sequentially introduces a chip tray full of chips placed in a stacked state on a stock table into a pinch feeding device, and while feeding the chips at pitch in the column direction of the chips on the tray, each row is A new method is adopted in which the chips in the same direction are bonded onto the substrate using pink-up means. As a result, the following remarkable effects can be achieved. ■ Since the chip trays can be placed in a stacked state on the stock table, there is no need to manually arrange the chip trays in the tray cassette as in the past. ■ At the same time, it is possible to stock many chip trays without taking up space, which dramatically extends the continuous operation time of the bonding equipment, increases the number of machines that one operator can handle, and reduces labor costs. A significant cost reduction effect can be expected. In addition, as mentioned above, since the chip trays can be placed in a stacked state on the stock table, it is easy to automatically place the chip trays loaded with chips in the previous process on the stock table. It becomes possible to integrate the manufacturing process of the device into a line. ■ Furthermore, since the pitch feeding device pinch-feeds the chip tray in one direction, by making this feeding direction parallel to the substrate feeding direction of the bonding substrate transfer device, space efficiency is dramatically improved. At the same time, the reciprocating distance of the pink-up means from the chip on the pitch feeder to the substrate is shortened, and the bonding efficiency is dramatically improved.

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a schematic side view of the chip supply mechanism A, which is a main part of the bonding apparatus of the present invention, and FIG.
It is a sectional view taken along the line ■-■ in the figure. In FIG. 2, reference numeral 4 indicates a conveyance device for a lead frame F as an example of a bonding substrate, and the lead frame F is moved on this conveyance device by
The pitch is fed from the back side of the drawing to the front side. As is clear from FIGS. 1 and 2, the chip supply mechanism A is disposed on the side of the lead frame conveying device and approximately parallel thereto. Reference numeral 8 denotes a stock table, onto which a plurality of chip trays 1 similar to the one shown in FIG. 5 filled with chips C are stacked and introduced into a columnar shape. In the figure, a plurality of pillars formed by stacking chip trays 1 are further arranged. An elevator 10 that is raised and lowered by a feed screw 9 is arranged adjacent to the tip of the stock table 8. This elevator 10 receives the stacked column of the chip tray 1 which is shifted forward on the stock table 8 by the actuator 11 when its mounting surface 10a is in a vertical position flush with the top surface of the stock table 8. The chips are removed, and then raised one by one by the thickness of the chip tray 1. A chip tray 1 is located adjacent to the front of the elevator 10.
A pitch feeding device W12 is arranged to pitch the lead frame in a direction parallel to the feeding direction of the lead frame conveying device 4. This pitch feeding device 12 includes a conveyance path 13 that can slide the loaded chip tray 1 in one direction, that is, in the direction of the columns of chips C arranged in multiple rows and columns on the tray. . At the starting end of this conveying path 13, the chip tray 1 located at the top of the stacked column of chip trays, which is successively raised to a predetermined height by the elevator IO, is sequentially moved back and forth between the upper part of the elevator 10 and the starting end of the conveying path 13. The chuffing means 14 performs the transfer. In this example, the chip tray 1 transferred onto the conveyance path 13
The chuck 16 rises onto the conveyance path through a slit 15 opened in the feed direction of the conveyance path 13 and is capable of pinching the front and rear of the chip tray 1. It is configured to pinch-feed at the same pinch as the pitch of the chips C lined up. Furthermore, as shown in FIG. 2, there are
A pickup means 18 is provided for sequentially picking up the chips C lined up in the row direction on the chip tray 1 stopped on the conveyance path 13 of the pitch feeding device 12 and bonding them onto the lead frame F. This pick amplifier means 18 is
Instead of reciprocating over a fixed distance, when the chip C closest to the transport device 4 is transported onto the lead frame F and returned, as shown by the imaginary line in FIG.
Furthermore, it is configured to over-move one pitch at a time in the row direction, pick up the chips C lined up in the row direction one after another from the end, and transfer them to the bonding position on the lead frame. Although not shown in the drawings, the pickup portion of the pickup means 18 may be a known device such as a vacuum collet. When the chips in the row direction run out, the chip tray 1 is moved one pinch in the column direction and the chip C is picked up and bonded in the same way as above, but all the chips C on the chip tray 1 are picked up and Empty chip trays 1'' after bonding are stacked in an empty tray stocker 19. This empty tray stocker 19 has locking upper surfaces 20a, 20a that can prevent the chip trays 1 from falling. , a pair of ratchet pawls 20.20 are supported by leaf springs 21.21 that extend upward and can be elastically deformed in the inward and outward directions, and the actuator 22 moves the elevating plate from the end of the conveyance path 13 of the pitch feeding device 12 to the adjacent elevating plate. The empty chip tray 1' that has been slid onto the
By lifting the chip tray 1' upward from below, the empty chip tray 1', which is sent sequentially from below, is placed on the locking upper surface 20a.
, 20a, and are successively stacked while being prevented from falling. Next, the overall operation of the bonding apparatus having the above configuration will be explained. The stacked column of chip trays l full of chips is transferred from the stock table 8 onto the elevator lO, and the chip tray 1 at the upper end thereof is transferred to the starting end of the conveyance path 13 of the pitch feed device 12 by the chucking means 14. Ru. The chip tray 1 thus transferred onto the transport path 13 is pitch-fed in the direction of the rows of chips C held thereon. Then, the chips C lined up in the row direction on the stopped chip tray 1 are sequentially picked up by the pink-up means 18, and are pitch-fed to the bonding position on the lead frame conveying device 4 at the bonding portion of the lead frame F. (usually islands) are bonded sequentially. When the chips in the row direction run out, the chip tray 1 is sent forward by one pitch, and the chips C in the next row are sequentially pick-amplified and bonded as described above. The empty chip tray 1', which has become empty after all the chips have been picked up and bonded, is stored in the empty tray stocker 19 as described above. Moreover, at the same time that the empty chip tray is transferred to the empty tray stocker 19, the next chip tray 1 is transferred from the top of the chip tray stacking column on the elevator 10 onto the pitch feeding device 12, and the chip tray 1 is placed on the pitch feeding device 12, and the chip tray 1 is placed on the pitch feeding device 12. Chips are picked up one after another and bonded. Furthermore, when the chip tray on the elevator 10 runs out, the next chip tray stacking column on the stock table 8 is slid onto the elevator 1.0 by the actuator 11, and the pickup and bonding operations are repeated as described above. It will be done. Therefore, the bonding apparatus of this example can be operated continuously as long as there are chip trays 1 stacked on the stock table 8, and compared to the chip supply method using a tray cassette shown in FIG. This makes it possible to dramatically extend the continuous operation time. Note that the chip supply mechanism A, which is comprised of the above-mentioned S)7 cuttable 8 or empty tray stocker 19 and pickup means 18, also serves as a mechanism for loading chips without a butt mark on the expandable tape into the empty chip tray 11. It can be used as a. That is, as shown in FIGS. 3 and 4, the empty stock stack column accumulated in the empty tray stocker 19 in FIG. 1 is introduced into the stock table 81, and the elevator 101 The empty chip tray at the top of the empty chip tray stacked column is raised by 1°
are sequentially transferred onto the conveyance path 13' of the pitch feeding device 12' by the chunking means 14', and while the empty chip tray 1° is pitch-fed on the conveyance path 13',
The pick-up means 189 sequentially arranges good chips without bad marks on the empty chip tray 11 from the extended tape 23 located on the side of the "." This is similar to the above, but the direction of chip transport is completely reversed.That is, when the chips on the expanded tape 23 are guided one by one to the pink-up position by an X-Y table and an optical recognition device (not shown), The pink-up means 18' pinks up the chips C, transfers them to the chip tray 11 on the conveyance path 13', arranges the chips C in the row direction, and when the arrangement of one row is completed, the chip tray 11 moves forward by one pinch. Then, the chips C are arranged in the next row.When one empty chip tray 11 is filled with up-Cs, this chip tray becomes like the empty chip tray stocker in FIG. , are stored in a stacked manner in the chip-loaded tray stocker 19''. Then, the chip tray stacking column filled with chips stored in this stocker 19 is automatically or manually transferred to the next chip bonding process, that is, the stock table 8 in FIG. 1. It is. The chip tray stacking column on the stock table 8 functions as a buffer to absorb variations in operating speed between the good chip extraction process and the chip bonding process in FIGS. 3 and 4, so that the good chips on the expand tape 23 are The process up to bonding to the lead frame F can be conveniently arranged in a line. Of course, the present invention is not limited to the above embodiments. For example, a bonding substrate is a concept that includes not only a lead frame but also a substrate for a hybrid IC or a substrate for a thermal head, and in short, includes all substrates to which chip elements are bonded.

[Brief explanation of the drawing]

FIG. 1 is a side view of the overall configuration of the main parts of the bonding apparatus of the present invention, FIG. 2 is a sectional view taken along line nn of FIG. 1, FIG. 3 is a side view of the entire related structure of the present invention, and FIG. 4 is IV in Figure 3.
-II/ line sectional view, Figure 5 is a schematic perspective view of the conventional example, and Figure 6 is a schematic perspective view of the conventional example.
The figure is an overall perspective view of the chip tray. ■...Chip tray, 1'...Empty chip tray, 8
...Stock table, 12...Pitch feeding device,
14...Chucking means, A...chip supply mechanism, C...chip.

Claims (1)

[Claims] (1) In a chip bonding apparatus in which a chip supply mechanism sequentially bonds chips to a substrate on a bonding substrate transport device, the chip supply mechanism has a predetermined number of chip trays each holding a predetermined number of chips arranged in a plurality of columns and a plurality of rows. A stock table that is placed in a stacked state,
A pitch feeding device that feeds the chip trays transferred one by one onto the conveyance path from the stock table at the same pitch as the alignment pitch of the chips in the column direction; A chip bonding apparatus comprising a pickup means for sequentially picking up chips arranged in a row direction and bonding them to a substrate on a bonding substrate transfer device.