JPH0192140U - - Google Patents
Info
- Publication number
- JPH0192140U JPH0192140U JP18774487U JP18774487U JPH0192140U JP H0192140 U JPH0192140 U JP H0192140U JP 18774487 U JP18774487 U JP 18774487U JP 18774487 U JP18774487 U JP 18774487U JP H0192140 U JPH0192140 U JP H0192140U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- wiring board
- printed wiring
- dissipation structure
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Connecting Device With Holders (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18774487U JPH0192140U (de) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18774487U JPH0192140U (de) | 1987-12-11 | 1987-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0192140U true JPH0192140U (de) | 1989-06-16 |
Family
ID=31478877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18774487U Pending JPH0192140U (de) | 1987-12-11 | 1987-12-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0192140U (de) |
-
1987
- 1987-12-11 JP JP18774487U patent/JPH0192140U/ja active Pending