JPH0191550U - - Google Patents
Info
- Publication number
- JPH0191550U JPH0191550U JP1987186754U JP18675487U JPH0191550U JP H0191550 U JPH0191550 U JP H0191550U JP 1987186754 U JP1987186754 U JP 1987186754U JP 18675487 U JP18675487 U JP 18675487U JP H0191550 U JPH0191550 U JP H0191550U
- Authority
- JP
- Japan
- Prior art keywords
- printer head
- head board
- hole
- ceramic substrate
- led printer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009429 electrical wiring Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第１図は本考案の第１の実施例を示す説明図、
第２図は本考案の第２の実施例を示す説明図、第
３図は本考案の第３の実施例を示す説明図、第４
図は従来のＬＥＤプリンタヘツド基板の説明図。
符号の説明、１……ＬＥＤアレイチツプ、２…
…絶縁層、３……電気配線、４……ボンデイング
パツド、５……ＣＣＢパツド、６……セラミツク
基板、７……コモン電極、２１……スルーホール
、２２……ＣＣＢはんだ、２３……ドライバＩＣ
回路、２４……電気配線、３１……導体、３２…
…コモン電極強化導体。
FIG. 1 is an explanatory diagram showing a first embodiment of the present invention;
Fig. 2 is an explanatory diagram showing a second embodiment of the present invention, Fig. 3 is an explanatory diagram showing a third embodiment of the invention, and Fig. 4 is an explanatory diagram showing a third embodiment of the invention.
The figure is an explanatory diagram of a conventional LED printer head board. Explanation of symbols, 1...LED array chip, 2...
...Insulating layer, 3...Electrical wiring, 4...Bonding pad, 5...CCB pad, 6...Ceramic substrate, 7...Common electrode, 21...Through hole, 22...CCB solder, 23... Driver IC
Circuit, 24... Electrical wiring, 31... Conductor, 32...
…Common electrode reinforced conductor.
Claims (1)
ク基板上に画像信号に応じた駆動信号を出力する
ドライバＩＣ回路と、前記駆動信号に応じて発光
するＬＥＤアレイチツプを搭載したＬＥＤプリン
タヘツド基板において、 前記セラミツク基板が所定数のスルーホールを
有し、 前記電気配線から選択された所定数の電気配線
が前記セラミツク基板の表面から前記スルーホー
ルを介してその裏面に配線され、再び他の前記ス
ルーホールを介して前記セラミツク基板の表面へ
戻されて配線されることを特徴とするＬＥＤプリ
ンタヘツド基板。 (2) 前記スルーホールを介して配線される電気
配線がボンデイングパツドを介して前記ＬＥＤア
レイチツプの一方の側に接続され、 前記スルーホールを介さないで配線される電気
配線が前記ＬＥＤアレイチツプの他方の側に接続
される構成の実用新案登録請求の範囲第１項記載
のＬＥＤプリンタヘツド基板。 (3) 前記セラミツク基板の裏面に配線された電
気配線が他のスルーホール介して前記ＬＥＤアレ
イチツプのコモン電極に接続されてる構成の実用
新案登録請求の範囲第１項記載のＬＥＤプリンタ
ヘツド基板。 (4) 前記スルーホールを介して配線される電気
配線が前記ドライバＩＣ回路の一方の側に接続さ
れ、 前記スルーホールを介さないで配線される電気
配線が前記ドライバＩＣ回路の他方の側に接続さ
れる構成の実用新案登録請求の範囲第１項記載の
ＬＥＤプリンタヘツド基板。[Claims for Utility Model Registration] (1) A driver IC circuit that outputs a drive signal according to an image signal and an LED array chip that emits light according to the drive signal are mounted on a ceramic substrate having a predetermined pattern of electrical wiring. In the LED printer head board, the ceramic substrate has a predetermined number of through holes, and a predetermined number of electrical wirings selected from the electrical wirings are routed from the front surface of the ceramic substrate to the back surface thereof through the through holes. . An LED printer head board, wherein the LED printer head board is returned to the surface of the ceramic substrate through another of the through holes for wiring. (2) The electrical wiring routed through the through hole is connected to one side of the LED array chip via a bonding pad, and the electrical wiring routed not through the through hole is connected to the other side of the LED array chip. 2. The LED printer head board according to claim 1, which is connected to the side of the LED printer head. (3) The LED printer head board according to claim 1, wherein the electric wiring wired on the back surface of the ceramic substrate is connected to the common electrode of the LED array chip via another through hole. (4) Electrical wiring routed through the through-hole is connected to one side of the driver IC circuit, and electrical wiring routed not through the through-hole is connected to the other side of the driver IC circuit. 1. An LED printer head board according to claim 1, which is a utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186754U JPH0191550U (en) | 1987-12-08 | 1987-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186754U JPH0191550U (en) | 1987-12-08 | 1987-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0191550U true JPH0191550U (en) | 1989-06-15 |
Family
ID=31477964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987186754U Pending JPH0191550U (en) | 1987-12-08 | 1987-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0191550U (en) |
-
1987
- 1987-12-08 JP JP1987186754U patent/JPH0191550U/ja active Pending
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